The 2026 IMAPS Society Awards are now open!

Nominations are due August 1.

Each year, IMAPS members recognize fellow members who have done such notable work that they deserve the distinction of an IMAPS Society Award.  

Nominate a deserving IMAPS member today ~ check out the various awards on our Awards page.  There are 11 different awards covering early career, lifetime, technical achievements, corporate and more.

Want to see who won last year?  View our 2025 winners. 

The International Microelectronics Assembly and Packaging Society (IMAPS) is pleased to announce a major milestone for the Society, with IMAPS taking over the "stewardship" of the trusted 3D InCites platform which was owned by Françoise von Trapp and her partner Martijn Pierik. Following Françoise’s retirement, IMAPS purchased the 3D InCites platform, including its website, content library, and podcasts. These longstanding industry resources are now part of the IMAPS portfolio. IMAPS leadership aims to continue 3D InCites' legacy going forward as an important technical and media platform for the advanced packaging industry.

Françoise von Trapp expressed excitement about the transition, stating that "by passing the torch to IMAPS, I feel confident that they will preserve our legacy far into the future. It is a natural fit, and I’m excited to see where IMAPS takes 3D InCites next.”

Brian Schieman, IMAPS Executive Director, spoke similarly by stating that “following the many years of close collaborations between our organizations, our executive leadership team recognized that IMAPS was in a unique position to offer a seamless transition of this platform, with a vision and strategy for future expansion of these invaluable industry resources.”

3D InCites has been a media supporter of IMAPS for more than a decade and the Official Industry Partner of IMAPS for the past five years. Other notable collaborations included IMAPS hosting the 3D InCites Awards, 3D InCites podcasting from IMAPS signature conferences, and the Back Yard Olympics fundraiser to support the 3D InCites Scholarship through the IMAPS Microelectronics Foundation.

Following von Trapp’s retirement and the closure of 3D InCites, LLC, the 3D InCites platform will continue under the IMAPS umbrella, delivering a technology and innovation spotlight for engineers, researchers, manufacturers, and students across the microelectronics and advanced packaging sectors. IMAPS plans for future content and media under the 3D InCites platform covering a variety of leading technologies, including device and chiplet packaging, advanced thermal solutions, packaging for AI/HPC, 3D integration, heterogeneous integration, photonics/CPO, and next generation materials, to name a few. Further details will be shared soon.

“I think I speak for all our IMAPS members and volunteers, as well as the broader industry, when I say thank you to Françoise for all that she has done for the industry over the past 17 years – she will be greatly missed. We look forward to writing this next chapter for the platform she created,” said Schieman.

IMAPS looks to share full details on the future activities planned for 3D InCites media platform at the IMAPS 22nd International Conference and Exhibition on Device Packaging in Phoenix, March 2-5 – a fitting event given the significance of this Conference throughout the relationship between IMAPS and 3D InCites over the past 16 years!

Visit the 3D InCites website

The core mission of the IMAPS Microelectronics Foundation is to promote student engagement in packaging. We do this by awarding scholarships, grants, and best paper awards to highly deserving students, as well as sponsoring IMAPS student chapters at universities and STEM related clubs at the high school level. We’re excited to feature a few of the 2025 award recipients and activity in this report. Engaged students will become the next generation of engineers and leaders in our rapidly evolving packaging industry. 

Click on image to view the 2025 Report

Visit the Foundation page

The IMAPS 2025 Society Awards are now open for nomination! IMAPS is proud to recognize its members with a meaningful awards tradition. The Society has many deserving members who have given their time, energy, and expertise to ensure our industry has a robust future.

Every year, IMAPS members recognize fellow members who have done such notable work that they deserve the distinction of the Society‘s awards. Our portfolio of awards publicly acknowledges each honoree's significant impacts on the membership and the microelectronics packaging industry.

Submit your nominations by August 1, 2025.

LIST OF THE AVAILABLE AWARDS: 

The IMAPS Leadership Award recognizes significant contributions to the growth of the Society in terms of mentorship, technical or business achievement. Aimed at mid-career thought leaders in microelectronics, nominees are expected to have 8-20 years in the field and 5 years in the society.

The Emerging Leaders Award recognizes the contributions made by emerging talent with 3-8 years in the field and Society membership for a minimum of 2 years.

The Daniel C. Hughes, Jr. Memorial Award is the highest, most prestigious annual technical honor, and is awarded to the individual who has the greatest combination of technical achievements related to microelectronics, combined with outstanding contributions supporting the microelectronics industry, academic achievement, or support and service to IMAPS.

The William D. Ashman - John A. Wagnon Technical Achievement Award is given to a member of the society who has made outstanding technical contributions to the microelectronics packaging industry, while participating and demonstrating support of activities to enhance the profession as a member. The award may be given for a specific accomplishment, a number of accomplishments over a period of years, or for overall contributions to the microelectronics industry. 

The Fellow of the Society Award honors and recognizes those who have made significant and continuing contributions to IMAPS over the years at any level – local or national. A nominee must have been an IMAPS member for 5 consecutive years. Examples of the nomination criteria considered are: (1) service as an officer of a local chapter or in a national office; (2) service as a member of a local, regional, or national committee or task force; and/or (3) presentation of papers or conducting of short courses at local, regional, or national symposia.

The Corporate Recognition Award honors and recognizes a corporation (or the appropriate division or department) that, in the opinion of the Corporate Recognition Award Selection Committee, has made significant technical contributions to the microelectronics industry, while demonstrating support of IMAPS through participation in such activities as Organizational and Regular Memberships, promoting member participation in IMAPS-sponsored activities, sponsorships, Educational Foundation contributions, and by exhibiting at the Annual Symposium.

The Sidney J. Stein International Award recognizes an individual who has provided significant international technical and/or leadership contributions to the microelectronics packaging industry, while participating and demonstrating support of IMAPS International activities to enhance the electronics packaging profession.

The Outstanding Educator Award recognizes an individual who has provided significant contributions to education for the electronics packaging industry and/or to the advancement of IMAPS Student Chapters. Note that this does not have to be restricted exclusively to academic education.

The Lifetime Achievement Award is given to a member of the Society who has made exceptional, visible, and sustained impact on the microelectronics packaging industry in technology, business or both. Because this award recognizes long term and exceptional impact on the greater microelectronics industry, candidates may be nominated only by senior members, life members, or previous recipients of either the Fellow or Technical Achievement awards. 

The IMAPS Foundation‘s Steve Adamson Student Recognition Award honors an active student member‘s participation in IMAPS events, chapters, and programs. Significant technical research and/or service contributions to IMAPS and the microelectronics industry will be considered during the judge‘s review. Nominees must be current IMAPS student members at an undergraduate or graduate level taking courses or in an approved internship in either engineering or natural sciences (at a 4-year college or university). The winner must be present at the award ceremony.

The Founder's Award recognizes an individual who has formed a company with a longevity of 10 or more years, and at least 25 employees, with the company also participating as a Corporate Member of IMAPS. In addition, this award is given to an individual who has made significant technical and/or leadership contributions to IMAPS and the microelectronics packaging industry.

The IMAPS Microelectronics Foundation is thrilled to receive a generous donation from 3D InCites! Many thanks to Françoise von Trapp (3D InCites) and Martijn Pierik (Kiterocket).

"It was an extra special year, as after years of fund-raising activities, Martijn Pierik and I were proud to present a check for $70k to the IMAPS Microelectronics Foundation to fund a STEM scholarship for women and under-represented minorities." ~ Francoise von Trapp

The Foundation supports student activities that cultivate an understanding of packaging, components, and assembly technologies; how they are used; and understanding materials used in the processes. To promote these activities, the Foundation sponsors technical paper and poster contest awards at various chapter and national level conferences and workshops. The Foundation also promotes the formation of student chapters at appropriate/aligned institutions.

Learn more about the Foundation

PRESS RELEASE

IMAPS Joins the National Semiconductor Technology Center
as a Core Member

IMAPS will benefit from the robust U.S. semiconductor ecosystem and
advance its workforce development, education and upskilling efforts

[Pittsburgh, PA – January 20, 2025] – the International Microelectronics Assembly and Packaging Society (IMAPS), the largest society dedicated to the advancement and growth of microelectronics and electronics packaging, today announced its membership in the National Semiconductor Technology Center (NSTC), a public-private consortium creating an unprecedented infrastructure to accelerate semiconductor R&D innovation, develop a skilled workforce, and secure the United States’ leadership position in the global semiconductor industry. This partnership aligns with IMAPS's commitment to communities associated with Microelectronics Advanced Packaging, Interconnect and Assembly by providing channels for communicating, educating, and interacting within academia, industry and government.

“As a proud member of the NSTC, IMAPS is committed to advancing the training and development of microelectronic packaging professionals in the U.S. Through a diverse range of educational programs, training initiatives, networking events, leadership opportunities, and publishing platforms, IMAPS is dedicated to fostering excellence in this critical field. By collaborating with fellow NSTC members, we aim to ensure that the U.S. not only meets its future workforce demands in microelectronic packaging but also continues to lead the world in technological innovation,” said Beth Keser, Ph.D., Past President of IMAPS and Vice President of Manufacturing at Zero ASIC.   

IMAPS professional development offerings enable people with all levels of experience in the semiconductor ecosystem can learn about the processes, materials, and structures that are key in enabling microelectronic packaging. For individuals, IMAPS offers skill enhancement for students and those new to the industry, expanding capabilities, or changing roles. Employers can engage with IMAPS for future workforce development and employee onboarding, minimizing skill gaps and developing talent to give them a competitive advantage.

Learn more about the benefits of becoming an NSTC member and join the mission at natcast.org/NSTCmembership .

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ABOUT IMAPS

The International Microelectronics Assembly and Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging.  Worldwide, IMAPS offers educational and marketing opportunities for industry professionals, packaging organizations, and students through technical conferences and workshops, professional development courses, IMAPSource microelectronics packaging research library, local chapters, and exhibitions. The Society encompasses a wide-range of technologies and topics critical to microelectronics assembly and packaging, including: on-shoring, heterogenous integration, fan-out wafer level packaging, 2.5D/3D technologies, system-in-package, photonics/optical, power packaging, CPI, package design/modeling, interconnects, wire bonding, flip chip, MEMS, sensors, packaging for 5g/6g, RF/wireless, signal/power integrity, advanced materials, substrates and more.

ABOUT NATCAST

Natcast is a purpose-built, non-profit entity designated to operate the National Semiconductor Technology Center (NSTC) by the Department of Commerce. Established by the CHIPS and Science Act of the U.S. government, the NSTC is a public-private consortium dedicated to semiconductor R&D in the United States. The NSTC convenes industry, academia, and government from across the semiconductor ecosystem to address the most challenging barriers to continued technological progress in the domestic semiconductor industry, including the need for a skilled workforce. The NSTC reflects a once-in-a-generation opportunity for the U.S. to drive the pace of innovation, set standards, and secure global leadership in semiconductor design and manufacturing. Learn more at  natcast.org.

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December 3, 2024

IMAPS has chosen to join the GivingTuesday movement to focus on raising additional important funds to help expand our 2025 efforts ~ to offer more students in the microelectronics industry financial assistance and awards through our Microelectronics Foundation’s mission and efforts. Student involvement in IMAPS is critical to workforce development and the future of the microelectronics and packaging industry!

GivingTuesday is a global generosity movement unleashing the power of radical generosity. It was created in 2012 as a day that encourages people to give back in whatever ways they can.

To learn more and join the cause, please visit the IMAPS GivingTuesday page.
(Donations are tax deductible)

Congratulations to all of the 2024 Society Award Winners!  

Our portfolio of awards publicly acknowledges each honoree's significant impacts on the membership and the microelectronics packaging industry.

Jon Aday - President's Award

Philip Garrou - Lifetime Achievement Award

Mike Gervais - Fellow of the Society Award

Brandon Hamilton - Emerging Leadership Award

Scott Hayes - Leadership Award

Gary Hemphill - President's Award

Shin-Puu Jeng - Sidney J. Stein International Award and Fellow of the Society Award

John Lannon - William D. Ashman - John A. Wagnon Technical Achievement Award

Wei-Chung Lo - Fellow of the Society Award

Amy Lujan - Fellow of the Society Award

Ivan Ndip - Outstanding Educator Award

Emma Pawliczak - Microelectronic Foundation Steve Adamson Student Recognition

Dongkai Shangguan - Daniel C. Hughes, Jr. Memorial Award

Vern Stygar - Fellow of the Society Award

StratEdge Corporation - Corporate Recognition Award

Visit the Awards page for more details.

On October 1, during our annual Symposium in Boston, we welcomed three new Directors to the IMAPS Executive Council: Habib Hichri (Ajinomoto Fine-Techno Corporation USA) Scott Hayes (NXP Semiconductors) Hongbin Yu (Arizona State University)   In addition, Mark Gerber (ASE, Inc.) moved from Director to the VP of Technology position.   At the same time, Patrick McCluskey, Jenny Shen and Jon Aday finished up their terms on the Executive Council.  We thank them for their time and commitment while serving!

Habib Hichri is an Executive Vice President, Senior Fellow Global Applications and Business Development at Ajinomoto Fine-Techno Corporation USA. Habib holds over 35 U.S. patents and authored over 70 publications and presentations and a book chapter in “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies”.  He was the general chair of IMAPS 2020 and is fellow of the IMAPS Society. 

Scott Hayes is the Technical Director, Package Innovation with NXP Semiconductor. He is located in Chandler, Arizona. Scott has been a member of the IMAPS Device Packaging Conference (DPC) organizing committee for >10 years (general, track, session chair) and has been an author/presenter/attendee of DPC since the inception in early 2000’s. Scott has 46 US Patents granted with several filings under examination, and 12 technical papers and conference presentations.

Hongbin Yu joined Arizona State University in 2005 and is currently the Center Director of NSF IUCRC Center for Efficient Vehicles and Sustainable Transportation Systems. His expertise areas include nanostructure and nano device fabrication and characterization; flexible, transparent and wearable electronics; wide bandgap semiconductor electronics and optoelectronics; quantum size effect in metallic and semiconducting nanostructures; integrated microwave and power devices, LiDAR and sensors for automotive applications. 

Visit the ABOUT US page to learn about all the roles on the Executive Council.

The August 2 deadline is approaching to nominate a hard-working IMAPS member who deserves recognition.  Each year, IMAPS members honor fellow members who have given their time, energy and expertise to ensure the microelectronics packaging industry has a robust future. 

There are 11 different awards to submit for, including lifetime achievement, emerging leader, technical achievement, outstanding educator, student recognition and more.  

Visit the Society Awards page to learn about the award types and how to nominate.

 

IMAPS Academy

 

IMAPS is pleased to announce the launch of IMAPS Academy, an online training resource to support the industry’s rapidly growing need for workforce development.

IMAPS has a strong track record delivering in-person professional development initiatives, which it is now expanding to an on-demand environment. Students and professionals of all levels of experience in the semiconductor advanced packaging ecosystem can learn about relevant processes, materials, and structures that are key in enabling microelectronic packaging directly from leading industry experts. 

IMAPS Academy offers convenient professional development and technical training for students and others new to the industry, as well as opportunities for those currently involved in advanced packaging to expand their knowledge and capabilities, in turn enabling them to change roles or increase their value. Employers can also engage with IMAPS for future workforce development and employee onboarding, to minimize skill gaps and develop talent to give them a competitive advantage.

“IMAPS Academy is set to become the gold standard in semiconductor advanced packaging education,” stated Brian Schieman, Executive Director, IMAPS. “Our program is focused on delivering value-added training from an industry perspective so students can gain current, marketable knowledge, enabling them to stay ahead in a rapidly evolving industry. With investment in advanced packaging accelerating globally, the need for workforce development is growing in kind, and IMAPS Academy offers an excellent opportunity to build this specialized talent pool.”

IMAPS Academy is a global platform that offers introductory, advanced and specialty training topics.  The courses are focused on key advanced packaging technologies in support of various industries, including: 5G/mobile, IoT, automotive, military, power, industrial, networking, advanced computing & artificial intelligence, and medical.  Academy instructors are leading technical experts who share both personal experiences and industry knowledge on focused topics.

IMAPS provides Certificates of Completion for each Academy training course. Participants can complete a series of courses to achieve a strong knowledge base and provide certificates to employers for continuous education requirements.

The introductory course “What is a Package?” is complementary and intended for those unfamiliar with the basics of IC packaging or wanting a quick refresher course. All other courses are offered with member, non-member and student pricing and include topics on chip packaging basics, wire bonding, fan out wafer level packaging, flip chip, system-in-package, failure analysis and more. 

“With its dynamic curriculum and continuous updates, IMAPS Academy ensures that participants remain at the forefront of technological advancements. Future courses will delve into cutting-edge topics such as 3D package design, advanced materials, mechanical modeling, MEMS sensors and silicon photonics, reflecting our commitment to staying ahead of industry trends,” said Schieman.

Visit the IMAPS Academy page to learn more.

The U.S. Department of Labor requests your assistance with a program that is important to the nation – the Occupational Information Network (O*NET®). The O*NET Program serves employers, human resource professionals, job counselors, and labor market analysts across the country who depend on occupational information to perform their daily work. Individuals who are exploring and planning careers also use O*NET information. We would like your help to keep this information current. 

As a representative of IMAPS, your assistance is requested in identifying occupational experts (OEs) for the occupation "Microsystems Engineers".  Also called: Process Engineer, Product Design Engineer, Project Engineer, Radio Frequency Design Engineer (RF Design Engineer).

For O*NET data collection purposes, OEs usually have five or more years of experience with an occupation. They may also have experience as a supervisor or trainer, as well as the expertise to rate the occupation on tasks, knowledge areas, work context factors, and work activities.

Occupational experts will be asked to complete O*NET questionnaires to provide information on their field of expertise. Their contribution to this program will ensure that the occupational information provided in the O*NET database is current and accurate.