Semiconductor Assembly and Packaging Courses | IMAPS Academy

Semiconductor Assembly and Packaging Courses

Your Online Portal for Microelectronics Packaging Professional Development

Advanced Packaging Education
Online Professional Development Taught by Microelectronics Industry Experts

IMAPS professional development initiatives enable an In-Person and now On-Demand environment through our Academy, where people with all levels of experience in the semiconductor ecosystem can learn about the process, materials, and structures that are key in enabling Microelectronic Packaging.

IMAPS is committed to providing various formats of professional development and education to the microelectronics packaging industry. For Individuals, IMAPS offers in-person and online professional development and skill enhancement for students and those new to the industry, expanding capabilities, changing roles or wanting to increase their value. Employers can engage with IMAPS for future workforce development and employee onboarding, minimizing skill gaps and developing talent to give them a competitive advantage.  Read the Academy Press Release.

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IMAPS Academy Covers 3 Key Areas
Introductory, Advanced and Specialty Training Topics

IMAPS offers courses focused on key technologies in support of various industries including: 5G/Mobile, IOT, Automotive, Military, Power, Industrial, Networking, Advanced Computing & AI, and Medical.

Academy instructors are industry technical experts that share both personal experiences and industry knowledge on focused topics.

IMAPS provides Certificates of Completion for each training course within Academy. Participants can complete a series of courses to achieve a knowledge base and receive certificates to provide to employers for continuous education requirements.

Academy Value Goals: Industry Ecosystem Training | Industry Knowledge Sharing | New Technology Advancements | Continuous Education/Learning | Industry Networking | Career Growth/Expansion

Get Started ~ Select a Course
What is a semiconductor package?
What is a Package?
introductOry | online self-paced | 1 chapter | 11-minutes | no testing

Complimentary ($0) for all.
English language course. Intended for those unfamiliar with the basics of packaging or for those wanting a quick refresher course. This course focuses on the basics around what is an IC package and why do we need it.

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Introduction to chip packaging
Introduction to Chip Packaging
INTRODUCTORY | ONLINE SELF-PACED | 4 CHAPTERs each ~30-MINUTES | chapter TESTING

Members $169, Non-members $229, Students $49.
English language course. Intended for those who want to learn more about the basics of packaging. Topics begin with what is a chip; why package a chip; advantages of packaging; package types; design; and more. 

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Introduction to wire bonding
Introduction to Wire Bonding
INTRODUCTORY | ONLINE SELF-PACED | 4 CHAPTERS EACH ~30-MINUTES | CHAPTER TESTING

Members $169, Non-members $229, Students $49.
English language course. Addresses the basics of Wire Bonding and the critical process steps for making electrical interconnections between an integrated circuit and substrate. More than 85% of all semiconductors use wire bonding. 

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Introduction to FOWLP Fan out wafer level packaging
Introduction to Fan-Out Wafer Level Packaging
INTRODUCTORY | ONLINE SELF-PACED | 4 CHAPTERS EACH ~30-MINUTES | CHAPTER TESTING

Members $169, Non-members $229, Students $49.
English language course. Addresses the basics of Fan-Out Wafer Level Packaging (FOWLP) and includes chapters on materials challenges, equipment challenges, and technical challenges.

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Flip chip technology
The Evolution of Flip Chip Technology
INTRODUCTORY | ONLINE SELF-PACED | 4 CHAPTERS EACH ~30-MINUTES | CHAPTER TESTING

Members $169, Non-members $229, Students $49.
English language course. A summary of the history, evolution and overview of flip chip technology; market drivers; bump options and process flows; and more.

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System in Package SiP
System-in-Package (SiP) - System Solutions through Miniaturization
INTRODUCTORY | ONLINE SELF-PACED | 4 CHAPTERS EACH ~30-MINUTES | CHAPTER TESTING

Members $169, Non-members $229, Students $49.
English language course. An introduction of the System-in-Package (SiP) platform and how companies are diversifying from SoC to leverage heterogenous silicon integration and package miniaturization.

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Failure analysis in semiconductor packaging
Failure Analysis in Semiconductor Package Assembly
INTRODUCTORY | ONLINE SELF-PACED | 4 CHAPTERS EACH ~30-MINUTES | CHAPTER TESTING

Members $169, Non-members $229, Students $49.
English language course. Addresses the basics of failure analysis; why do FA; failure plots and process flows; mechanical and thermal causes; accelerated testing; and detection methods.

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Advances in FOWLP fan out wafer level packaging
Advances in Fan Out Wafer Level Packaging
ADVANCED | ONLINE SELF-PACED | 4 CHAPTERS EACH ~30-MINUTES | CHAPTER TESTING

Members $169, Non-members $229, Students $49.
English language course. Prerequisite course: Intro to FOWLPAddresses the advanced topics of FOWLP; definitions; process; applications; package structures; roadmaps; and more.

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Surface Finishes for Optimum Performance & Better Reliability 5G-mmWave-6G Devices)
Selection Criteria of Surface Finishes for Optimum Performance & Better Reliability of Next Gen Device Packaging/Electronic Assemblies (5G-mmWave-6G Devices)
SPECIALTY | ONLINE SELF-PACED | 4 CHAPTERS EACH ~30-MINUTES | CHAPTER TESTING

Members $169, Non-members $229, Students $49.
English language course. Selection criteria of surface finishes for 5G-mmWave-6G, high frequency, HDI, RF-Microwave applications, next gen WLP/PCB tech.  Pros & cons of different surface finishes and impact on performance, signal integrity and reliability.

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Accessing Your Courses

Step 1:
For current IMAPS members: You will be prompted to sign-in with your member login credentials to complete course registration.

For non-members: BEFORE starting your IMAPS Academy registration, click ‘join’ at the top of the IMAPS Academy page. When prompted, select the member type: IMAPS Academy User. Once member registration is complete, you can register for courses. You will be prompted to sign-in with your new member login credentials prior to completing course registration(s).

Step 2: After registering, you will receive a confirmation email with your course details. To access your courses once registered and logged-in at www.imaps.org, use the IMAPS ACADEMY > Academy CLASSROOM link under QuickLinks. You will see your purchased courses under MY COURSES. Once complete, access your certificates and additional details through your Academy profile.

Announcements

Check out the May 2024 press release about the Academy launch.

Additional introductory, advanced and specialty courses will be added throughout 2024. If your organization or you as an individual member of IMAPS have requests for new technical topics and additional on-demand course content, please let us know at info@imaps.org or 919-293-5000. There will be options for corporate member bundling of IMAPS Academy courses, as well as licensing options for institutions and other groups throughout this year.

Want the In-Person Experience?  Join Live PDCs at Upcoming IMAPS Events

Additional professional development courses and training seminars will be held at many upcoming IMAPS conferences and workshops. Be sure to attend in person to access additional courses, have in-person conversations with instructors, and network with like-minded members.

PO Box 14727, Pittsburgh PA 15234 | Email Us | 1-919-293-5000