Congratulations to the IMAPS 2024 Society Award Winners!
IMAPS is proud to recognize its members with a robust awards tradition. IMAPS has many deserving members who have given their time, energy, and expertise to ensure our industry has a robust future. Every year IMAPS members recognize the Society‘s members who have done such notable work that they deserve the distinction of the Society‘s awards. Our portfolio of awards publicly acknowledges each honoree's significant impacts on the membership and the microelectronics packaging industry. Thank you Beth Keser, 2024 Awards Chair.
3D InCites Podcast: Françoise von Trapp sits down with three of the award winners to talk about their IMAPS experience, at different stages of their career ~ Emma Pawliczak, Brandon Hamilton and Phil Garrou
2024 WINNERS
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Microelectronic Foundation Steve Adamson Student Recognition Award
Emma Pawliczak
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Emma Pawliczak earned her B.S. in Mechanical Engineering from SUNY Binghamton in 2020. She returned to Binghamton to pursue her Ph.D. in Mechanical Engineering, where she joined the Microfluidics and Multiphase Flow Laboratory
under Dr. Paul Chiarot. Her anticipated graduation day is May 2025. Her work includes using electrospray deposition (ESD) to generate thin films for electronics packaging. Her research includes manufacturing thin polymeric
(polyimide) films for corrosion protection on bond wires and metallic (silver) films for EMI protection of system-in-package architectures.
Emma has publications in the American Chemical Society’s Applied Polymer Materials journal, MRS Advances, and IEEE.
At IMAPS 2023 in San Diego, California, Emma won the Top Student Poster award. She interned with Intel in the summer of 2024 in the thermal materials technology development group.
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Emerging Leadership Award
Brandon Hamilton
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Brandon Hamilton is Microelectronics Packaging Program Manager at BAE Systems Navigation & Sensor Systems where his focus is the development and transition advanced packaging, and secure packaging technologies. Brandon has 25+ years combined active-duty military and Defense Industrial Base service. Prior to BAE, he was a Chief Engineer at Booz Allen Hamilton and Amentum supporting OUSD R&E’s Trusted and Assured Microelectronics and OUSD A&S IBAS investment initiatives. Prior to his DoD support roles, he was Technical Program Manager and Principal Packaging Engineer at Collins Aerospace where he championed printed electronics and supported high reliability SiP design and factory transition.
Before shifting into mil/aero hardware, Brandon was a polymer product development chemist and quality engineer at Henkel Electronics where he developed and manufactured assembly and semiconductor grade mold compounds and adhesives for the automotive, defense and medical industries.
Brandon holds 21 patents or patents pending in advanced packaging, sensors, antenna, and materials development. He received a bachelor’s degree from Houghton College and studied biochemistry at Cornell University. He has chaired the annual IMAPS Onshoring Workshops.
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Leadership Award
Scott Hayes
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Scott Hayes is a technical director at NXP Semiconductors with over 25 years of packaging experience. He leads a team focused on new technology strategy and implementation for NXP’s analog, mixed signal, and automotive product families
including ADAS and vehicle electrification solutions. Scott is passionate about leading IP generation for NXP’s packaging team by directing innovation, coaching inventors, and adding to his own 46 patents in areas of advanced packaging.
Scott has been a member of the IMAPS Device Packaging Conference organizing committee for more than 10 years, most recently as General Chair. As a new member of the IMAPS Executive Council, Scott looks forward to engaging
with and creating opportunities for students and new engineers in the rapidly growing packaging industry. |
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Corporate Recognition Award
Stratedge
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In 1992, StratEdge introduced its first ceramic package designed for the microwave industry. Since that time, StratEdge has focused on designing, manufacturing, assembling, and testing ceramic packages in microwave and millimeter wave
(mmWave) frequencies, and a series of patented stripline filters for use in microwave satellite communication systems.
StratEdge high performance semiconductor packages operate from DC to 63+ GHz for the high-speed digital,
mixed signal, broadband wireless, satellite, point-to-point and point-to-multipoint, VSAT, and test and measurement industries. Their packages are known for: High reliability and high performance * Superior electrical,
mechanical, and thermal performance * Non-shrinking post-fired hardened ceramic composition * Patented electrical transition designs * Hermetic surface mount capabilities
StratEdge is headquartered in Santee, California.
This 9001:2015 facility houses their design, manufacturing, test, and assembly.
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Outstanding Educator Award
Ivan Ndip
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Ivan Ndip is a full Professor at the Brandenburg University of Technology in Germany. He is also with Fraunhofer IZM (since 2000) where he currently leads the Dept of RF & Smart Sensor Systems and the IZM Branch Lab for High-Frequency
Sensors and High-Speed Systems. While working at IZM, he served as a Lecturer at the Technische Univeristaet Berlin.
Professor Ndip has mentored, advised and supervised over 100 Bachelor, Master and PhD students. He has been teaching
Professional Development Courses to hundreds of engineers and scientists for over 15 years. His outstanding publications and inventions have been widely used in the education of university students and in training professionals in
the microelectronics packaging industry.
He is an author and co-author of 250+ publications in journals and conference proceedings, and has more than 35 German, European and US patents. His research has been honored with
numerous national and international awards. Professor Ndip is a Fellow and Life Member of IMAPS and served on the IMAPS Executive Council as Director from 2016 to 2020. Ivan studied electrical engineering and obtained his
Dipl.-Ing. (M.Sc.), and Dr.-Ing. (PhD) from TU Berlin. He received a second doctorate degree, Dr.-Ing. habil., also in electrical engineering from BTU Cottbus-Senftenberg. |
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Sidney J. Stein International Award and Fellow of the Society
Shin-Puu Jeng
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Dr. Shin-Puu Jeng is currently a Consultant to TSMC, Advanced Packaging and Technology and Service. At TSMC he previously held Director positions in various divisions: New Technology and System Integration, 3DIC, and Special
ASIC. Prior to TSMC he was with Applied Materials, Texas Instruments and Yale University.
He was the recipient of the second National Industrial Innovation Award from the Ministry of Economic Affairs, the Outstanding Engineer Award from the Chinese Institute of Engineers, as well as the Prolific Inventor Award and Best
Disclosure Award from TSMC.
Dr. Jeng has 587 USPTO (US Patent and Trade Office) granted patents, more than 9 conference and journal papers and a long list of awards and professional society affiliations. He received
his Ph.D from the University of Florida and conducted his postdoctoral studies at Yale University.
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Fellow of the Society Award
Amy Lujan
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Amy is President at SavanSys Solutions LLC, where she does cost modeling and analysis for companies in the electronics packaging and aerospace industries. In her ten years at SavanSys, she has helped establish the company as the industry
standard choice for cost modeling.
Prior to joining SavanSys, Amy held positions in business development at TOK America and in engineering at Nokia Japan. Over the past sixteen years, she has published numerous technical
papers, been an invited speaker at conferences and seminars, and contributed to many industry publications.
Amy received a B.S. in chemistry with a focus on polymer science from the College of William & Mary. Upon
graduation, she spent one year in Japan on a Fulbright grant analyzing the cost of moving to lead-free electronics.
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Fellow of the Society Award
Wei-Chung Lo
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Wei-Chung Lo is currently Deputy General Director and Senior Principal Engineer, Electronic and Optoelectronic System Research Laboratories (EOSL) of Industrial Technology Research institute (ITRI).
Research areas: Semiconductor research, Wafer-level System Integration and Advanced electronic/opto-electronic packaging: Non-Volatile Memory (MRAM, Computing in Memory), 3D IC/ 3D SiP/ 3D Chiplets Integration, Silicon
Photonics & Co-packaged Optics, WBG Power chip, Power packaging and Power module, RF packaging (Antenna-in-package).
Dr. Lo has published over 80 international papers on advanced semiconductor packaging and memory technologies, 40 patents granted, and co-authored the specialized book 'Handbook of 3D Integration' on 3D ICs (Wiley-VCH). He is
also the co-author of the 2030/2035 Semiconductor Technology Strategy and Blueprint of the Industrial Technology Research Institute (ITRI). He has served in many industry chair and committee roles and won numerous
awards.
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Fellow of the Society Award
Vern Styger
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Vern Stygar has worked in the semiconductor industry for more than 35 years and began his career as a process engineer at Beckman Instruments. Vern then moved to McDonell Douglas as a program manager then followed by 10 years at Ferro
Corporation as product manager for thick film paste and LTCC for high frequency devices. In 2004 Vern joined AGC as the product manager for glass for semiconductor products. In his role as a product manager, Vern is responsible
for advance packaging for High Frequency products, DNA photonics and solid-state meta materials for quantum processes.
Vern has authored or co-authored papers for high frequency applications utilizing glass, LTCC, thick film and thin film metallization. Vern holds a degree in Chemistry from Cal State Fullerton and an MBA from the University of
Phoenix.
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Fellow of the Society Award
Mike Gervais
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Mike Gervais serves as Sales Manager for Noble Metal Services in Cranston, RI, a leading precious metals refinery. Gervais’ career path is predominately precious metals focused which includes manufacturing, refining, accounting and finance.
He has held volunteer Board positions ranging from Treasurer to President in several industries that use precious metals.
Mike has been a member of IMAPS since 1994. He’s enjoyed various Board roles with the New England
Chapter, concluding at President in 2014.
From 2016 to 2021, Mike was a Corporate Board member and tasked as Treasurer under four Presidents. Looking back at his roles within IMAPS, Mike credit’s his success to the incredibly
talented, smart, and dedicated Board members he has worked with. |
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William D. Ashman - John A. Wagnon Technical Achievement Award
John Lannon
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John Lannon is the General Manager of Micross Advanced Interconnect Technology. He received a BS in Physics from West Virginia University and PhD in Physics from WVU. With a background in thin film deposition and characterization, John
has worked on the fabrication and improvement of resistive IR emitter devices for Infrared Scene Projectors for over 20 years. Since 2005, he has assisted with the development of high-density interconnects for die stacking and detector
hybridization, as well as the development of wafer-level vacuum packaging for MEMS devices. He continues to focus on the development and implementation of 3D integration and advanced packaging technologies (flip-chip bumping, high
density interconnect bonding, WLVP, through-Si vias, through glass via, Si interposers, etc.) for government and commercial applications, as well as the development of novel 3D microstructures.
John has been an active
member of IMAPS, helping facilitate the transition of 3DASIP conference into IMAPS and serving on the U.S. Government and Defense Committee since its inception. He has contributed to and helped organize US onshoring related workshops/activities
at IMAPS DPC and Symposium, as well as contributing an article to a special issue of IMAPS Advancing Microelectronics magazine in 2022. Throughout the years, he supported local IMAPS activities, including hosting events in North Carolina.
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Daniel C. Hughes, Jr. Memorial Award
Dongkai Shangguan
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Dr. Dongkai Shangguan is a Strategic Advisor to Indium Corporation, and President of Thermal Engineering Associates. Previously, he served as Corporate VP at Flex (formerly Flextronics) for Technology & Engineering, and as CMO at STATSChipPAC
(currently JCET). Early in his career, he held various technical and management responsibilities at Ford Electronics and Visteon. He also served on the Board of Directors/Advisors of several companies over the years.
Dr.
Shangguan has published 3 books, including the recently published book “Direct Copper Interconnection for Advanced Semiconductor Technology”. He has also authored/co-authored over 200 technical papers, and has been issued 33 U.S. patents.
He has received many awards over the years, including the IMAPS William D. Ashman Achievement Award.
Dr. Shangguan received his B.Sc. degree in Mechanical Engineering from Tsinghua University, China, MBA degree from San
Jose State University, and Ph.D. in Materials from the University of Oxford. He conducted post-doctoral research at University of Cambridge and University of Alabama.
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Lifetime Achievement Award
Phil Garrou
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Phil Garrou received his BS in Chemistry from North Carolina State University and his PhD from Indiana University with a focus on Organometallic chemistry. He joined the Dow Chemical Central Research New England Lab in 1975 and spent 29
years with Dow, retiring as Dir of Technology & New Business Development for their Adv. Electronic Materials Division. His most significant contribution while at Dow was the commercialization of Benzocyclobutene (BCB). He
is generally credited with taking BCB from obscurity in Dow's Central Research Department to its global status as a microelectronics thin film dielectric used in many of today’s leading-edge processes.
At Dow he served as
Chief Scientist for Microelectronics and as General Manager of the BCB Microelectronic Resin Business. During this time, he led Dow DARPA contracts including “Large Area Processing” “Super High Off Chip Interconnect” and “Printed Electronics
for Low-Cost High Volume Microelectronic Applications”.
He has served as a subject matter expert for DARPA on programs such as ICECool, DAHI and CHIPS, and worked with the DoD on programs such as Navy Cranes “SHIP”
program and Industrial Base Analysis and Sustainment (IBAS) “RESHAPE” program.
Beyond his > 200 conference presentations and publications, he has edited 2 texts on Multichip Modules and 4 volumes on 3D packaging,
contributed to Rao Tummala’s “Microelectronic Packaging Handbook” and served as Associate Editor of the IMAPS Int. Journal of Microcircuits and Electronic Packaging. Since 2011 he has shared his Advanced Packaging knowledge
in his weekly blog “Insights From the Leading Edge” initially published in Solid State Technology magazine and more recently on the web pages of “3D InCites”.
Dr. Garrou has been President of IMAPS (1998), has chaired many
IMAPS conferences and workshops, and has won numerous industry awards. |
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President's Award
Gary Hemphill
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Gary Hemphill has been a stalwart supporter of the IMAPS Foundation and became its primary advocate in 2016. In this role, Gary helped with all the silent auctions, 50/50 raffles, golf events, and other fundraising duties until 2023
when he retired. He has served on the Foundation committee providing guidance and making decisions on how to best support students in our technical community. And he was back this year helping with our auction. Thank you, Gary,
for your continued support of the Foundation and we will miss you! |
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President's Award
Jon Aday |
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Jon Aday has served as director for 2 terms, and more recently served as the VP of Technology for the past 5 years, having completed a predecessor’s term and 2 of his own. During this time, Jon kept the IMAPS conference content relevant
while having to pivot to virtual events during COVID. Jon has worked to provide the support to our technical conference leaders and shaped events that add value to our members. Thank you to Jon for your efforts to grow
IMAPS technical events and set us on a path for future success. |
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View Past Award Winners |
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