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About Us
International Microelectronics Assembly and Packaging Society Who We AreMission Statement: IMAPS is the premier, non-profit membership association steering the communities associated with Microelectronics Advanced Packaging, Interconnect and Assembly by providing channels for communicating, educating, and interacting within academia, industry and government. Worldwide, IMAPS offers many benefits through membership, and educational and networking opportunities for industry professionals, packaging organizations, and students through technical conferences / workshops, professional development courses, IMAPS Academy, IMAPSource microelectronics packaging research library, and local chapters. Exhibitions market the latest product and service applications of the current technology. The Society covers a wide-range of technologies and topics critical to microelectronics assembly and advanced packaging, including: on-shoring, heterogeneous integration, fan-out wafer level packaging, 2.5D/3D technologies, chiplets, system-in-package, hybrid bonding, photonics/optical, power packaging, CPI, package design/modeling, interconnects, wire bonding, flip chip, MEMS, sensors, packaging for 5g/6g, RF/wireless, signal/power integrity, advanced materials, substrates and more. MembershipIMAPS memberships are available for Corporations, Individuals and Students and provide many valuable benefits: technical, educational and speaking opportunities, networking, event discounts, and the Advancing Microelectronics magazine. Corporate benefits include branding, press releases, discounted advertising and exhibition space, Jobs Marketplace, and more. Each year with the Society awards, members honor fellow members who have given their time, energy, and expertise to ensure the microelectronics packaging industry has a robust future. IMAPS is committed to providing various formats of workforce upskilling, professional development and education to the microelectronics packaging industry. We offer many education and training opportunities with flexibility to fit your schedule and needs. IMAPS Academy is our online portal for relevant semiconductor packaging courses taught by instructors who are industry technical experts, sharing both personal experiences and industry knowledge on focused topics.  HISTORY Founded in 1967 as the International Society for Hybrid Microelectronics (ISHM), then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history. Highlights include: 1968: First ISHM Symposium held in Chicago The one thing that has never changed over time is an unending commitment to be the premiere entity dedicated to the dissemination of technical and commercial information about microelectronics packaging. Society members have made significant contributions to our industry and advances in all types of leading technologies. Executive Council IMAPS President
Northrop Grumman  President Elect
Honeywell FM&T  Past President
Zero ASIC  VP of Technology
ASE, Inc.  VP of Marketing
Consultant  Director
NXP Semiconductor  Director
Ajinomoto Fine-Techno USA  Director Henkel Corp.  Director
Besi  Director
U.S. Partnership for Assured Electronics  Director
Arizona State University  Ex-Officio
IMAPS Executive Director
Pittsburgh, PA StaffMicroelectronics Foundation Microelectronics Foundation
The Foundation supports student activities that cultivate an understanding of advanced packaging, components, and assembly technologies; how they are used; and the materials used in the processes.  Make a Donation
We invite you to donate to the Microelectronics Foundation to help us create a better understanding of technologies of microelectronics packaging through student initiatives. |
