New IMAPS Scholarship Announced

A new IMAPS 3D InCites Student Scholarship was recently announced that will support workforce development in the advanced packaging industry. Funds were donated last year by 3DI and the first scholarship will be awarded this year.

The goal of the scholarship is to give underrepresented students opportunities in the microelectronics field with scholarships, mentoring and participation in an IMAPS event. The scholarship will focus on women in microelectronics in 2026.

Applications are now being accepted through May 31 and the winner will be announced later in 2026.

Scholarship Overview:

• $10,000/year scholarship to be used for tuition for a graduate program related to the field of microelectronics at an accredited US university or institute for a maximum of two years per awardee. An award winner may reapply but is not guaranteed a scholarship beyond one year.
• One award per year shall be granted at the discretion of the Award committee & Microelectronics Foundation 
• An industrial contact within IMAPS will be assigned to the awardee for mentoring (not research contact, but professional association) for an hour-long professional development conversation once per quarter.
• Travel to the IMAPS International Symposium (same year as award) from the awardees’ US based accredited institution. Travel is covered in accordance with the separate Foundation Student Travel Grant.
• Automatic enrollment in the International Microelectronics and Packaging Society, the largest society dedicated to the advancement and growth of microelectronics and electronics packaging.

To learn more and submit an application, visit the Scholarship page.

Thank you to all the faculty advisors and student leaders/chapter members involved in scheduling and coordinating these events. We look forward to announcing even more student chapters and events soon.

Let us know if you are interested in joining an IMAPS student chapter or starting one at your university by completing the IMAPS student chapter sign-up form. Additional information can be found on our student chapter homepage.

		Thanks to generous funds from our donor members and companies, the Microelectronics Foundation was able to distribute more than $10,000 in 2025 to students through our Steve Adamson Student Awards, poster competitions, and best paper, poster and presentation awards at various events, as well as donations to several high schools that have participated in IMAPS events this year, including: Sage Creek High School, Carlsbad High School, and NeoCity Academy. We are proud of the winning university students, and those who presented their work, exhibited, and joined our meetings.
A global generosity movement		IMAPS has chosen to join the Giving Tuesday movement (December 2) to focus on raising additional important funds so that we can expand our efforts in 2026 to offer more students in our industry financial assistance and awards through our Microelectronics Foundation’s efforts. Student involvement in IMAPS is critical to workforce development and the future of the microelectronics and packaging industry.

Students at IMAPS Symposium 2025 San Diego

Symposium 2025 welcomed students from multiple high schools and community colleges who arrived in grand style by bus. They spent the day hearing from industry speakers about the role microelectronics and advanced packaging plays in today's technology, as well as career paths and tips on resume building ideas. They finished up with time on the exhibit floor seeing the technology firsthand and meeting supply chain companies.

During our annual Symposium in San Diego, we welcomed two new members to the IMAPS Executive Council: VP of Marketing: Eelco Bergman (Saras Micro Devices) Director: Vikas Gupta (ASE Global) In addition: Dan Kruger was elected President Erica Folk became Past President Mark Gerber moved from VP of Technology to the President-Elect position. Beth Keser moved into the VP of Technology position. Others continue their position for another year:  Curtis Zwenger, Treasurer Eric Huenger, Secretary Scott Hayes, Director Habib Hichri, Director Rita Borah Mohanty, Director James Will, Director Hongbin Yu, Director Brian Schieman, Executive Director At the same time, Chris Scanlan and Jim Haley finished up their terms on the Executive Council.  We thank them for their time and commitment while serving!

The IMAPS Executive Council provides strategic and technical vision to the society, contributing personal knowledge, experience and talent. 
Council members oversee resource generation, define society success and monitor progress.

Visit the ABOUT US page to learn about all the roles on the Executive Council.

System-in-Package (SiP) - System Solutions through Miniaturization

 An introduction of the System-in-Package (SiP) platform and how companies are diversifying from SoC to leverage heterogenous silicon integration and package miniaturization.  

3D Package and Assembly Technology

 Covers 3D and 2.5D (interposer) designs, 3D assembly flow, known good die, 3D package testing issues, supply line logistics, thermal management, bump metallization options, wafer thinning and handling and interposers with microfluidics cooling built in. 

Understanding the Cost of FOWLP

Covers all key cost drivers of FOWLP and major variations including chip-first and chip-last process flows. Introduces activity-based cost modeling and explains why and how it is useful.

EACH COURSE IS 4 CHAPTERS ~30-MINUTES EACH | CHAPTER TESTING
Members $169, Non-members $229, Students $49.

Visit the Academy Page 

It is with deep sorrow that we share the news of the passing of our dear colleague and friend, Nihal Sinnadurai.  

Nihal dedicated many years of his life to voluntary service within IMAPS. He began his involvement in the United Kingdom and later took on significant responsibilities at the European level, particularly within the European Liaison Council (ELC). As Secretary of the ELC, Nihal played a key role in representing the European IMAPS chapters on the global stage, including strong engagement with our counterparts in North America and Asia.
His commitment extended far beyond administrative duties. Nihal was a vital contributor to the
biennial flagship conference, EMPC, where he frequently took on important organizational roles. He also acted as a bridge among local IMAPS chapters across the European Union, fostering collaboration and community throughout the region.

Nihal will be remembered not only for his unwavering dedication and professionalism, but also for his warmth, kindness, and the true friendship he offered to so many of us. We will deeply miss his presence at our events — always friendly, engaged, and supportive.
Nihal leaves behind a legacy of service, connection, and friendship.

We invite you to read more about Nihal and view photos and memories from his colleagues and friends...(click to enlarge)