Attendees were enthusiastic about the quality and relevance of the topics presented and the networking opportunities that allowed direct communication and hallway conversations between speakers, attendees and exhibitors.

The participants ranged the entire career span ~ from an exceptional high school student presenter to seasoned industry professionals.

Taking place during the World Cup quarter-finals, it was hard to distinguish the difference between the speaker applause and cheering for the goals scored while watching World Cup during breaks!

CHIPcon 2026

"CHIPcon 2026 was a great success. The conference brought together leaders and innovators to explore the megatrends shaping the future of semiconductor technology, focusing on chiplet-based heterogeneous integration and advanced packaging. We sincerely thank our speakers, sponsors, and attendees for their tremendous support and look forward to continued collaboration as we drive the next wave of innovation together." ~ Ou Li, UTAC and Ken Wu, Delos Data

Thank you to the organizers for supporting CHIPcon 2026:  
General Co-Chairs: Ou Li, UTAC and Ken Wu, Delos Data
Organizing Committee: Rozalia Beica, Rapidus | Eelco Bergman, Saras Micro | Habib Hichri, Ajinomoto | Scott Jewler, UTAC | Anu Ramamurthy, Microchip | Jan Vardaman, TechSearch International

ThermCon 2026

“This Symposium brought together participants from around the world, from academia, research institutions, and industry, for a focused exchange and in-depth interactions on semiconductor thermal management, in an immersive environment.  Innovations in areas ranging from thermal design methodology, to thermal management materials, cooling modules, and metrology and testing, were presented by key players of the eco-system. Critical challenges and future roadmaps were outlined and discussed through presentations, keynotes, and panel discussions.”  ~ Dongkai Shangguan, Thermal Engineering Associates, Inc.

Thank you to the organizers for supporting ThermCon 2026:  
General Chair: Dongkai Shangguan, Thermal Engineering Associates, Inc.
Organizing Committee:
Kevin Cox, Tektronix | Vikas Gupta, ASE | Ryan Mayberry, Indium Corp. | Keishi Okamoto, Rapidus | Risa Miyazawa, IBM | Sundar Narayanan, Applied Materials | Bill Ishii, Sumitomo Electric USA | Yujie Meng, Solstice

IMAPS is proud to be an organizing partner for the IDSPS exhibition and technical program scheduled for December 6-9, 2026 in Visakhapatnam, India. The Indian Global Semiconductors to Systems, Research & Technology Conference will bring global industry and academic leaders together with 600–700 expected participants. The technical focus will be in two strategic areas: Advanced Packaging for AI and Integrated Power Electronics for Electric Vehicles.

The Exhibition Zone offers a dynamic platform for organizations to showcase innovations, technologies, and solutions shaping the future of the semiconductor and electronics ecosystem. Connect with India's rapidly growing semiconductor ecosystem, understand India's role in the global value chain, and highlight your design tools, materials, substrates, and components.

Exhibitors can choose from 3 tiers, as well as sponsorship opportunities. Stall sizes available: 4m × 2m | 3m × 2m | 2m × 2m. 

For questions about exhibiting – contact Brian Schieman, IMAPS Executive Director, at bschieman@imaps.org

From Chiplets to System: Architecting the Future of Advanced Integration

Counting down ... IMAPS CHIPcon is coming to Santa Clara, California July 6-8. Take a look at the currently confirmed program highlights:



PANEL SESSIONS

 "Examine the Impact of AI on Design: From Tools to Test"
(Moderator: E. Jan Vardaman Vardaman, TechSearch International) 

"Scaling Panel Level Fanout" 
(Moderator: Rozalia Beica, Rapidus)

TECHNICAL SESSIONS
💠 Chiplets Design to System Integration Flow
💠 Emerging Packaging Technology and Applications (*CPO, Glass PLP, EMIB, CoWoP, CoPoS)
💠 Advanced Assembly Manufacturing Process, Material and Equipment
💠 IC Package Test and Metrology

Plus four Professional Development Courses that will make you smarter!

Learn from the experts at these organization:

Visit the CHIPcon page

Speakers: 🎤 Dr. David Ekhaguer, CSE at L3 Harris Technologies: UAS Long Endurance Battery Architecture Harvesting Approaches                             🎤 Stephanie Moore, University Florida: Laser-Machined Interposer with Diamond-Coated Capillary Surfaces for Hotspot Mitigation in 3D Heterogeneous Integration (3DHI) Packaging 🎤 C. Mike Newton, Founder/Managing Partner, NewTec Initiatives:  3D-Printed Electronics; Integrated Thermal Sensors Development and Digital Workflow for In-Situ Monitoring of Turbine Engine Systems Hosted at: Vertex Applied Innovation Hub 2495 Palm Bay Rd NE Palm Bay, Florida 32905 Time 11:00-1:00 Lunch is provided with registration

Lunch Sponsor: 

 

		IMAPS announces its supporting sponsorship of the 29th Annual Components for Military & Space Electronics Conference & Exhibition (CMSE 2026), taking place April 28–30, 2026 at the Marriott Renaissance Los Angeles Airport Hotel.   IMAPS plays a critical role in connecting engineers, researchers and industry leaders across the high-reliability electronics supply chain. Our support of CMSE underscores the conference’s importance as a trusted technical forum for military and space applications where performance, reliability and mission assurance are non-negotiable. For nearly three decades, CMSE has served as the industry’s premier venue for addressing real-world challenges in component design, qualification and deployment across avionics, aerospace and defense systems. With peer-reviewed technical sessions, expert-led tutorials, keynote presentations and a focused exhibition of leading suppliers, CMSE 2026 delivers practical insight that bridges advanced research with implementation in the field. Together, IMAPS and CMSE provide a vital platform for the microelectronics community to collaborate, share knowledge and advance the technologies that support national defense and space exploration.

TECHNICAL PROGRAM:

Keynote Addresses:
Microelectronics: Critical Enabler for Innovation in Commercial and Military Systems — Devanand K. Shenoy, Ph.D. (IBM Research)
Ultra-Low Loss & Precision Passive Components for Quantum Computing — Dennis M Zogbi (Paumanok Publications)

Tutorials:
• Advanced Microelectronic Component Engineering Principles & Practices
• Introduction to Electronics Failure Analysis
• Advances in 2.3D Fan Out Wafer Level Packaging
• Military Standards, JEDEC Updates, and New Specifications

Lunch & Learn Speaker:
Ahmed Busnaina, Ph.D. — High-Throughput Additive Manufacturing of Microelectronics

Technical Presentations:
• Low Inductance Bulk Capacitors
• Using AEC-Q Semiconductors in Military & Aerospace
• MLCC Product Grades: Commercial to Space
• Wire Bonding & Ultrasonic Smart Welding for Space
• High Reliability outgassing and RGA
• COTS Integration: Success & Challenges in Mission Critical Systems
• Solder Column Reliability in Extreme Cold

And many more practical, experience-driven talks covering core component engineering challenges.

The IMAPS Symposium 2026 Technical Committee is seeking original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span 3 days of sessions on:
🔹 Advanced Packages & Structures (Heterogeneous Integration, HPC, AI)
🔹 Advanced Interconnect, Bumping & Bonding Technologies
🔹 High Reliability, RF/MW, MEMS/Sensors/Flexible, WLCSP, FOWLP, Novel SIP Structures, EV/eVTOL
🔹 Enabling Materials & Advanced Equipment and Processes
🔹 Design & Modeling, AI Enablement, CPI and Metrology
🔹 Interactive Poster Session

This highly regarded annual conference will bring together industry engineers, top experts, researchers and students involved in semiconductor packaging.  Join us September 28 - October 1, 2026 at the Encore Boston Harbor in Boston, Massachusetts.

Submit your abstract

Visit the Symposium event page

Check out the newly released details for the most comprehensive technical program and exhibition for microelectronics and advanced packaging.

We are excited to hear from these keynote speakers:

🎤 Overcoming Critical Challenges in Glass Core Substrates for Next-Generation Chiplet and CPO Applications - Yoshiki Takahashi (AGC Inc.)
🎤 Future of AI Hardware Enabled by Advanced Packaging - Raja Swaminathan (AMD)
🎤 Power Packaging for AI/Data Center from Grid to Core - Thorsten Meyer (Infineon)
🎤 Sandeep Razdan (NVIDIA)

The technical sessions will cover everything you need to know about advanced packaging:

~ Assembly Process Development
~ Interconnect, Assembly, and Reliability
~ Thermal Management and Power Delivery
~ Component to System Integration & Metrology
~ Modeling / CPI / Machine Learning / AI / Design
~ Advanced Substrate and Interposer Technologies
~ MEMS, Sensors, and Harsh Environment Packaging
~ Materials and Processes for Cost and Sustainability
~ Additive Manufacturing and 3D Packaging Innovations
~ Advanced Materials and Reliability for High-Performance Packaging
~ Advanced Interconnects, Panel-Level, and Heterogeneous Integration

Visit the DPC 2026 page for full details.

The IMAPS Executive Summit Silicon Valley (September 24-25) was a huge success!

Impressive attendance, vibrant energy, and two days of outstanding presentations and discussions showcased the innovation and momentum driving the future of advanced packaging.

A heartfelt thank you to the keynotes, panelists, and moderators for sharing their insights and vision:

🎤 Keynote Speakers
Daniel Armbrust, Co-Founder & Director, Silicon Catalyst 
Geoffrey Tate, Technology Strategy Advisor, Board Member Ayar Labs 
Henri Richard, President, Rapidus Design Solution 
Near Margalit, GM & VP, Optical Systems Division, Broadcom 
Preeth Chengappa, Head of Industry, Semiconductor & Physics, Microsoft 
Shahin Farshchi, CEO, Lux Capital 

🧠 Moderators who led insightful panels and fireside chats: 
 Ali Ghiasi (Quantum) • Eelco Bergman (Saras MicroDevices) • Françoise von Trapp (3D InCites) • Shin-Puu Jeng (Applied Materials) • Tarun Verma (Silicon Catalyst)

💡 Panelists who brought bold ideas and deep expertise:
Ankur Aggarwal (Celestial) • Bardia Pezeshki (Avicena) • Bilal H. (Yole Group) • Farhang Yazdani (Broadpak) • Florian Herrault (PseudolithIC) • Gamal Refai-Ahmed, PhD (AMD) • Gang Duan (Samsung Electro-Mechanics) • Guilian Gao (Adeia) • Habib Hichri (Ajinomoto Fine-Techno USA) • Kuldip Johal (MKS Atotech) • Michael Stewart (M12, Microsoft Ventures) • Nicholas Harris (Lightmatter) • Ramakanth Alapati (YES) • Risto Puhakka (TechInsights) • Robert Lin (Manz) • Steven Verhaverbeke (Applied Materials) • Tim Olson (Deca Technologies) • T. O. E. (Thintronics) • Vivek Raghunathan (Xscape Photonics)

🙏 A special thanks to the sponsors — Rapidus Corporation US, Thintronics®, NAMICS Corporation, and Manz Asia

📌 Topics covered included:
Startup-driven innovation and VC investment
Strategic convergence in advanced packaging
Chiplet adoption and innovation across the ecosystem
Co-packaged optics and photonics
The coming Agentic AI transformation

👏 Finally, thank you to all attendees for your thoughtful questions and active participation. Your engagement made this summit truly special — a perfect blend of strategic vision, technical depth, and collaborative networking.

📢 Stay tuned for future IMAPS Silicon Valley activities! If you’re interested in getting involved or collaborating, please connect!

The IMAPS/GEA Onshoring Workshop was exceptionally well attended, with a packed room and standing-room-only sessions at times—an indication of the high level of interest and relevance of the content. This wasn’t just “fluff”; the workshop delivered substantive discussions and actionable insights.

Now more than ever, strengthening our assured microelectronics industrial base and leveraging domestic capabilities to deliver working hardware is critical to advancing both national and economic security. This workshop was an important step in bringing together the right expertise, industry leaders, and government stakeholders to make that vision a reality.

Day 2 Highlights: Deep Technical Insights

The second day, open only to U.S. citizens with passports, began with a comprehensive briefing on on-shore advanced packaging capabilities—both those currently being established and those already demonstrating ecosystem readiness.

- Industry Updates: Micross Components, SkyWater Technology Foundry, Greensource, Calumet Electronics, TTM Technologies, and Draper presented detailed updates on RESHAPE and DPA Title III programs, demonstrating significant U.S. Government and industry investment in onshoring advanced packaging technologies.

- DARPA Next-Gen Manufacturing: Michael Holmes, DARPA Managing Director for the Next Generation Manufacturing Program (NGMM), delivered a keynote outlining plans to establish game-changing 3D Heterogeneous Integration (3DHI) capabilities, including low-volume, on-shore prototyping and manufacturing. (For those interested, the NGMM Summit is in October: https://www.darpa.mil/events/2025/ngmm-summit).

- DARPA Minitherms: Dr. Yogendra Joshi, Program Manager for DARPA’s 3D Minitherms program, joined teams from HRL Laboratories, Teledyne Scientific, and Northrop Grumman to showcase working prototypes and breakthrough thermal management techniques for highly integrated microsystems.

- These sessions underscored DARPA’s reputation for solving “DARPA HARD” challenges that push the boundaries of technology for the warfighter.

Day 3 Highlights: DIB Leadership & Packaging Roadmaps

Day 3 opened with a keynote from Dr. Carl McCants, Principal Engineer at Intel Government Technologies, who brings decades of DARPA and DoD leadership experience. His talk launched the Defense Industrial Base (DIB) Advanced Packaging session, followed by capability briefs from L3Harris, RTX, Lockheed Martin, and Northrop Grumman.

- The National Science Foundation (NSF) Engine Project, based in Florida, provided updates on an imminent NSF RFI aimed at supporting advanced packaging development.

- The Florida Semiconductor Institute shared its expertise in advanced failure analysis and other capabilities critical for troubleshooting microsystem reliability and root cause analysis.

The workshop concluded with a powerful session featuring Dr. Tim Morgan, Technical Director for the DoD Microelectronics Commons, who discussed prototyping, lab-to-fab transitions, and advanced packaging initiatives.

- Presentations from several regional hubs—including SWAP (Southwest Advanced Prototyping), California DREAMS (Defense Ready Electronics and Microdevices), NORDTECH (Northeast Regional Defense Technology), and SCMC (Silicon Crossroads Microelectronics Consortium)—provided updates on progress and future opportunities.

- A key takeaway: the Microelectronics Commons team plans to release its next Call for Projects in conjunction with its annual meeting this October (https://microelectronicscommons.org/events/).

Closing Note
The IMAPS/GEA Onshoring Workshop succeeded in connecting U.S. Government stakeholders, industry leaders, and technical experts to drive actionable strategies. It showcased substantial ongoing investments, collaborative programs, and a unified commitment to building a resilient, on-shore advanced packaging ecosystem to support the warfighter.

Get ready for one of the most anticipated events in advanced semiconductor packaging!

Announcing an IMAPS Executive Summit ~ September 24 and 25 

Advanced Packaging 2025: Market Momentum & Investment Outlook
Powering the Next Wave of Semiconductor Innovation

Organized by the IMAPS Silicon Valley Chapter  Hosted at Rapidus Corporation in Santa Clara, California

"This high-impact event will bring together leaders from across the ecosystem — investors, startups, analysts, industry experts and decision-makers — to explore how advanced packaging is redefining innovation and market leadership. I am grateful to be part of this initiative and looking forward to the discussions, insights, and connections that will help shape the future of semiconductors."  Co-Chair Rozalia Beica, Field CTO Packaging Technologies at Rapidus Design Solutions

Designed for senior executives and strategic stakeholders, the program offers:
◊ Actionable insights into emerging market dynamics and capital flows
◊ Expert perspectives on packaging’s evolving role in enabling next-gen solutions
◊ Curated networking with peers shaping the semiconductor landscape

Position your organization at the forefront of innovation and investment. 
Discover where advanced packaging is headed—and how to lead the way.

September 24 will cover Vision, Investment and Strategy
September 25 will focus on Innovations in 3D Chiplets, Photonics, and Agentic AI

Registration is open and sponsorships are available.

To learn more, visit the event page

Now Accepting Abstracts Seeking speakers for the upcoming Florida event: Advanced Technical Workshop & Tabletops  |  Heterogeneous Integration - System in Package September 23, 2025 OC Building - 194 NeoCity Way, Kissimmee, FL

This workshop will bring together the scientists, engineers, manufacturing, academia, and businesses who are involved in smart sensors, systems and advanced packaging technology. The program and tabletop exhibits will enable discussion and presentations on the latest semiconductor-based design, process and materials for smart sensor and photonic technologies.

Submit an abstract for this event - topic areas to consider:

• Fan-Out Wafer-Level Packaging (FOWLP)
• Silicon and Glass Substrates/Interposers
• Hybrid Bonding
• Chiplet Technology
• Additive Manufactured Electronics (AME)
• Interconnect Materials
• Novel Die Interconnect
• Digital workflow & Cybersecurity
• Design, Simulation and Modeling
• In Situ Metrology & Machine Learning
• Digital Twin,
• CHIPS and SHIPS
• On Shoring
• TSV’s & TGV’s

Florida Chapter page

Abstract Submission page

IMAPS Italy

Photonic Packaging

4-5 November 2025

In presence, Politecnico di MIlano Bovisa, Energy Department, Via Lambruschini 4

Submit your abstract to info@imaps-italy.it (due by August 25, 2025)

Topics of interest include:

Packaging for Semiconductor lasers
Modulators
Silicon Photonics
MEMS Micromirrors
LEDs
New materials for Photonics packaging
Applications include Sensors, telecom and datacom
Artificial intelligence
Quantum computing
Advance sensing
Biophotonics
Automotive lighting etc

Join us for Advances in Polymers with Jeff Gotro

Tuesday, July 1 · 11:45am - 1pm PDT

Location:
AI Technology (Formerly EMD Performance Materials)
6555 Nancy Ridge Dr.
San Diego, CA 92131

Title: Advances in Polymers

Speaker bio: Jeff Gotro, Ph.D., is the President and Founder of InnoCentrix, LLC. InnoCentrix provides a wide range of consulting services to the polymer industry. Jeff has over forty years of experience in polymers having held scientific and leadership positions at IBM, AlliedSignal, Honeywell International, National Starch Electronic Materials as VP of R&D, and InnoCentrix. He has published four book chapters including Thermosets in the Encyclopedia of Polymer Science & Technology, John Wiley & Sons, 2017. Jeff has published over 50 papers in technical journals and conference proceedings. Jeff has a Bachelor of Science in Mechanical Engineering and Materials Science from Marquette University and a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science (polymer chemistry, physics, and characterization).

The IMAPS CHIPcon conference will be held July 7-10, 2025, at the Marriott in downtown San Jose, California.  This event will focus exclusively on the innovative device integration approaches, technology developments, solutions, and business trends enabling the continued advancement in semiconductor device (system) performance. CHIPcon 2025 will offer cutting-edge presentations from scientists, technologists and business leaders across the globe with expertise in high performance computing, networking, automotive, cellular, and mobile market (consumer) segments. 

“The adoption of chiplet-based, heterogeneously integrated device architectures has clearly reached critical mass. Initially for high performance compute and AI accelerators and now expanding to other devices and applications as the benefits of this approach are recognized,“ said Eelco Bergman, CHIPcon Co-General Chair. “In organizing CHIPcon 2025, our objective was to bring together leading industry experts to address the challenges and opportunities for enabling broad based adoption of chiplet architectures and establishing a viable design and manufacturing ecosystem. We’re confident that we’ve achieved our goal and look forward to welcoming our industry colleagues to an another outstanding IMAPS event.”

CHIPcon 2025 will explore the current state of the art in design, simulation, packaging, test, process, and material technologies supporting the integration and delivery of a complete semiconductor system or subsystem solution.  Attendees will be exposed to thought-provoking advanced device and package structures with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.

Ou Li, Co-General Chair states, “We’re delighted to welcome attendees to CHIPcon 2025, returning to San Jose this year! The event is moving to a new venue that offers ample space and amenities to support our technical program and exhibits. This year’s program features professional development courses, keynotes from leading market and industry experts, two insightful panel discussions, and six technical sessions. Topics will include chiplet integration and design flows, chiplet ecosystem development, device integration and packaging technology, test and metrology, emerging materials and process tools, and—new this year—optical interconnects and silicon photonics.”

The keynote lineup includes: Ashkan Seyedi (NVIDIA) - “AI Inference Scaling Through Advanced Packaging Interconnect”; Mukund Chavan (Rivian) - "Modern Autonomy Compute Challenges & Opportunities for Disaggregation”; and Mario Morales (IDC) - “Semiconductor Outlook: Intersection of Company Leadership, Policy, and Innovation”.  The panel sessions will focus on "Transforming Chiplet Technology to Large Scale Manufacturing – Challenges and Opportunities" and “Chiplet Ecosystem, The Road to Democratizing Chipset Adoption”.

Technical sessions will cover:
• Chiplet Integration & Design Workflows
• Chiplet Ecosystem Development & Enablement
• Chiplet Integration Packaging Technology
• Test, Metrology, and Data Analytics for Heterogeneously Integrated Devices
• Advanced Packaging Materials & Process Technologies
• Optical Interconnect & Silicon Photonics

As the world’s leading semiconductor companies continue to push the limits of process technology, the industry is experiencing a marked shift in device design and architectures to overcome the performance, economic, and time-to-market expectations faced by advanced semiconductor solution providers. CHIPcon is a platform to focus on the opportunities for the expanded adoption of chiplet-based devices in not only data center applications, but also in the automotive, industrial, enterprise, and consumer/client markets. The conference will examine the technical and commercial challenges faced, and what is being done to overcome these to support the development of a vibrant and viable design and manufacturing ecosystem. 

Join the New England Chapter for an Evening Chapter Event

June 18 

Forgione Engineering – Mechanical Engineering & Product Development Consultants

The 51st IMAPS New England Chapter Symposium and Expo will be held on May 6th at the Boxborough Regency Hotel & Conference Center in Boxborough, Massachusetts. Join us for a day of learning, networking, and fun. The chapter’s premier event contains several Technical Tracks, a Poster Session, accessible Exhibit Hall, and our renowned Buffet Luncheon. Be certain to stay for the afternoon festivities, hors d’oeuvres, cocktails, and raffle prizes. 

There are still a few booths available in the hall and we are looking for a couple of timely papers to round out the technical sessions. Track topics:
~ Additively Manufactured Electronics
~ Advanced Packaging
~ Advanced Materials, Processes & Thermal Challenges
~ Interconnect Technology
~ Photonics Packaging
~ RF/Microwave
~ Interactive Dialogue Poster Session

Device Packaging Conference 2025 far exceeded expectations and had outstanding results. The new location at the Sheraton Grand at Wild Horse Pass in Phoenix allowed us to grow the Conference in its 21st year: adding a 4th technical track, increasing the exhibition by 18 additional 8x10 booths, and welcoming a record number of attendees. We received overwhelming positive feedback about the beautiful venue and the indoor/outdoor vibe with many of the meals and events held outside.

2024 was a record year for DPC with 762 attendees and this year's attendance skyrocketed to 1,056. IMAPS leadership was elated with this 39% increase in participation.

This year had a big focus on AI, covered by an evening panel and our Global Business Council plenary session. The program ran 4 concurrent technical tracks, including two full tracks on emerging technologies. Our keynote sessions were full to capacity with engaging presentations from IBM, Absolics, ScaleFlux, and Arizona State University/SHIELD.

The busy international exhibit hall drew in the entire industry supply chain and is always a critical compliment to the conference’s global technical program. Our leadership team is already reviewing our 2026 meeting space allocations to potentially add additional booths to expand to an even larger exhibit hall in March 2026 when we return to Wild Horse Pass.

We were thrilled with the significant student participation this year from Arizona State University and the University of Arizona. 100+ students participated in our professional development courses and had the ability to speak directly with our subject matter industry experts. ASU, U of A and Chandler Unified School District participated with tabletop exhibits. This summer, Chandler Arizona’s Hamilton High School (in partnership with U of A) is kicking off the nation's first Career and Technical Education Program in Semiconductor Manufacturing. We are super excited about this high level of student activity and growing the industry’s future workforce.

	"Special thanks to my Professor, Dr. Hongbin Yu, for providing the opportunity to attend this insightful conference! Looking forward to applying these learnings in semiconductor reliability, AI hardware acceleration, and advanced packaging innovations." ~ Sriniketh Purisai Ramanujam (Arizona State University Masters Student)
	"Kudos to IMAPS for encouraging students to attend the terrific Professional Development Courses to learn all about the exciting new developments in advanced packaging of semiconductor components and how these new technologies underpin the production of new Al and High-Performance Computing chips!" ~ University of Arizona’s Center for Semiconductor Manufacturing

Our evening interactive poster session was a hit with 25 posters presented in a beautiful outdoor setting overlooking the reservation and desert backdrop. The posters were followed by the 3D InCites Back Yard Olympics - a fun team competition with six games and a lot of laughs.  Congratulations to NAMICs, the Gold winning team.

DATE CHANGE ANNOUNCEMENT

The IMAPS/IPC Onshoring Workshop has been rescheduled to September 8-11 due to government travel restrictions.  The new registration will open shortly, hotel block is open for reservations.

The workshop will bring Government agencies, the DIB (Defense Industrial Base) and Advanced Packaging and Assembly providers together to discuss their efforts to onshore advanced packaging.  The mission of this workshop is to engage our workforce community to identify the newly created Advanced Packaging programs which address US Government and Defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain.  Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III), and DARPA will be briefing on their advanced packaging programs

Location:
Sheraton Pentagon City Hotel  |  Arlington, Virginia

Visit the EVENT PAGE 

Organized by IMAPS France

 18th European Advanced Technology Workshop on Micropackaging and Thermal management 

Hotel Mercure Vieux Port - La Rochelle, France

Thermal management remains a crucial constraint in electronics packaging and is a mandatory aspect in every industry – aerospace, automotive, consumer, industrial, military - technology roadmap worldwide.  The workshop will present some of the latest improvements in thermal management solutions at system level, in power electronics, in materials, in modelling and in techniques for characterizing and testing materials. It will also present some innovative cooling solutions such as two-phase technologies and liquid cooling.

For registration, please connect to website: THERMAL 2025 - IMAPS Europe

SAVE THE DATE | March 3, 2025

This IMAPS Taiwan online seminar on Advanced Packaging Technologies will delve into the cutting-edge innovations in the field, including hybrid bonding, multi-chip integration, and SiC power modules.  It will serve as a valuable platform for IMAPS Taiwan experts to collectively explore the latest advancements, address the challenges, and envision the future trajectory of this transformative field.

Registration will open soon.  Visit the EVENT PAGE for details.

Present at the leading conference for microelectronics packaging

CALL FOR ABSTRACTS CLOSING FEBRUARY 3

Here's your opportunity to present at IMAPS Symposium 2025 in San Diego.  We are seeking abstracts for our 5-track technical program and poster session. This year's new track re-alignment provides an enhanced organization of thematic areas.

The IMAPS 2025 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. Abstracts are due February 3.

Visit the Symposium 2025 page for details.

The 25th European Microelectronics Packaging Conference (EMPC 2025) will be held in Grenoble (France), from September 16-18, 2025. The event is organized by IMAPS Europe and co-sponsored by IEEE EPS.

Held biennially, the EMPC will feature a high-quality technical program, a large exhibition, and exciting evening events. Professional development courses will be offered on Monday, September 15, 2025. The conference focuses on the latest developments in electronic packaging, covering industry trends, integration, new materials, thermal management, and sustainable electronics

Authors are invited to submit an abstract of 400 - 800 words by January 27, 2025. The content must be original (unpublished), non-confidential, and non-commercial. The Call for Papers, abstract template and submission guidelines can be found on the website. Abstracts are welcomed covering the following topics:

• Advanced Packaging and System-Integration
• Materials and Processes
• Design, Modelling and Reliability
• Markets and Developments
• Special Topics (Power Electronics/ Medical Electronics/ Green Electronics)

IMAPS New England Technical Meeting on Wednesday, February 12, 2025

Boxboro Regency Hotel & Conference Center

in Collaboration with SMTA Boston & IEEE Microsystems

SCHEDULE (times approximate)

5:30 PM ~ Registration, Socializing, Networking

6:30 PM ~ Dinner Buffet

7:00 PM ~ PRESENTATION

“Sustainable Additive Manufacturing of Micro and Nanoscale Electronics”

Speaker:  Ahmed A. Busnaina
William Lincoln Smith Professor, Distinguished University Professor and Director
NSF Nanoscale Science and Engineering Center for High-Rate Nano-Manufacturing, Northeastern University

REGISTER

The Wire Bonding Workshop 2025 program is now available with an agenda that includes:

~ Technical Presentations
~ Keynote: "Valuable Insights in Fine Bonding Wire"
~ Tutorial: "Physic of Wire Bonding and Process Optimization"
~ Exhibits and Sponsor/Exhibitor Presentations

If you are involved in the wire bonding space, please join us February 3-4 in San Diego.
Early registration rate and the hotel block end January 10 ~ register now!

Thank you to our sponsors Hesse Mechatronics, Inc. and Topline Corporation.

Visit the event page

Both events to take place March 3-7, 2025 in Phoenix, Arizona

Device Packaging Conference - The event with the most advanced packaging content this winter

The 21th Annual Device Packaging Conference (DPC 2025) will be held March 3-6, 2025, at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona.  This esteemed event brings together industry engineers, researchers and top experts involved in advanced packaging and microelectronics assembly with a multi-faceted technical program and unique networking events.

This year’s General Chair, Amy Lujan with SavanSys, comments: “2025 will be an exciting year for Device Packaging. To kick off the conference’s third decade, we’re in a new location that gives us room to grow our exhibit hall and technical program. In addition to our popular tracks focused on 2D/3D heterogeneous integration, flip chip, and fan-out / wafer-level packaging, there will be a greater focus on emerging technologies and applications that are driving advancements in packaging.”

The technical content includes an unrivaled, concurrent 4-track program and interactive poster session, with 116 speakers.  Attendees will hear from keynote speakers from Absolics, ASU / SHIELD USA, IBM, and ScaleFlux.  An evening panel discussion is planned on “Preparing for the Coming AI Winter” and a business plenary session will focus on “Scaling of AI from Datacenter to Consumer”.

Attendees can also register for 17 Professional Development Courses that will be held on Monday, March 3. These focused courses provide a learning opportunity for looking to enhance their skills and knowledge, or those new to the industry.

A sold-out exhibit hall will showcase the latest products, technologies, and applications.  Registration includes networking opportunities that promote attendee interaction: welcome and exhibit hall receptions, group lunches, poster session happy hour, and the 2nd annual 3D InCites Back Yard Olympics following the poster session.  A post-conference golf scramble will be offered to raise funds for the IMAPS Microelectronics Foundation.

In 2024, DPC welcomed the highest attendance in its 20-year history.  With the expanded facility, 2025 is expected to be record breaking once again.  Visit the DPC 2025 page for details and registration.

Advanced Packaging for Medical Microelectronics Workshop

On March 5-7, this advanced technology workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. It will draw invited experts in the fields of medicine, medical devices, biomaterials, microelectronics, semiconductor packaging, and product assembly and will cover topics involving technologies, products, strategies, current and emerging markets, and collaborations in areas such as Disease Detection, Materials, Assembly and Applications/Products. 

The event will kick off with a combined poster session (with DPC 2025) on March 5, followed by the technical program on March 6 and 7.

Three keynotes will present on: “Inspire: A Story of Growth” (Dave Dieken, Inspire Medical Systems), “RF Packaging and Integrated Antennas for Low-Cost Medical Radar Sensor Systems” (Ivan Ndip, Fraunhofer IZM/Brandenburg Univ. of Technology) and “The Economics of Small Medical Implants” (Rex Hales, Cirtec Medical).

A discount is available if attending both the Medical and DPC events.   To learn more, visit the Medical workshop page.