Technology Crossover Agenda
PROGRAM AT A GLANCE
Monday, April 26
3 LIVE Professional Development Courses (PDCs)
Tuesday, April 27
3 LIVE Plenary Speakers
6 LIVE Keynote Speakers
5 Author's Roundtable
Sessions with LIVE Q&A
On-Demand Technical Sessions
Wednesday, April 28
3 LIVE Plenary Speakers
5 LIVE Keynote Speakers
1 LIVE Invited Speaker
4 Author's Roundtable
Sessions with LIVE Q&A
On-Demand Technical Sessions
Thursday, April 29
3 LIVE Plenary Speakers
3 LIVE Keynote Speakers
2 LIVE Invited Speakers
1 Author's Roundtable
Sessions with LIVE Q&A
On-Demand Technical Sessions
PROGRAM & AGENDA
MONDAY, APRIL 26, 2021

ON-DEMAND ALL DAY: Technical Presentations

PDCs: LIVE Classroom-Style Tutorials with a Narrow Educational Focus Taught by the Best in the Industry.
10:00 am - 12:00 pm Eastern

(Additional registration required)
PDC 1: MAKING AND QUALIFYING RELIABLE EXTREME ENVIRONMENT ELECTRONICS
Today’s most challenging applications of electronics technology require operation in the harshest of environments. Electronics have left the desktop and air conditioned computer room to enter environments ranging from the deepest ocean depths to the vastness of space. These environments combine extreme temperatures with extreme pressures, high levels of shock and vibration, and exposure to damaging chemicals. Applications as diverse as avionics/planetary exploration (Venus: 460C surface, 90 atm pressure, H2SO4), energy exploration (T > 150C, high pressure, corrodants, drilling shock), and underhood automotive propulsion (T > 165C, vibration, road salt) require new materials and mechanical design solutions that address thermal management, stress management, fatigue resistance, corrosion resistance, durability, reliability, maintainability, and sustainability. In addition, temperatures are rising for many power electronic systems as well, with the combination of higher power density modules and the availability of high temperature stable semiconductor devices. This presentation will discuss the latest work in the areas of wide bandgap semiconductor reliability, high temperature interconnection including copper wire bonding, lead-free attach material synthesis, 3D integrated thermal packaging, and advanced manufacturing of power electronics – all focused on designing, manufacturing and qualifying electronics for reliable use in the most extreme environments.

Patrick McCluskey, University of Maryland, College Park
Dr. McCluskey is Professor and Leader of the Design and Reliability of Systems Division in the Mechanical Engineering Department at the University of Maryland, College Park. He has published extensively in the area of packaging and reliability of electronics and microsystems for high power and extreme environments, including editing/co-editing three books and authoring over 150 technical articles and book chapters with over 3300 citations. He is a fellow of IMAPS, a member of the Board of Directors of IMAPS, and the General Chair of the IMAPS High Temperature Electronics Conference (HiTEC). He is also a senior member and member of the Board of Governors of IEEE EPS.

(Additional registration required)
PDC 2: ADVANCES IN HIGHLY THERMALLY CONDUCTIVE ORGANIC POWER PACKAGING
New Epoxy Resin Composite Dielectric (ERCD) films for single and multilayer organic substrates can reach high thermal conductivity (10W/mK), high temperature (300C), and high voltage (40kV/mm) with thicknesses from 80m to 120m, and are ideal for signal and power packaging. The thermal conductance of 120m at 8W/mK surpasses 500m Al2O3 as a substrate material. Multilayering brings to power packaging the opportunity to manage common-mode currents in high-frequency switching by Wide Band Gap (WBG) devices, such as power GaN, and extended for mixed signal electronics. The attendee will gain knowledge of material characteristics, design rules for use along with a list of fabricators, and be presented with two design examples.
Douglas Hopkins, North Carolina State University
Dr. Hopkins is a professor in Electrical and Computer Engineering, Director of the Laboratory for Packaging Research in Electronic Energy Systems (PREES), which is part of the NSF FREEDM Systems Center, and is an affiliate faculty member in the Center for Additive Manufacturing and Logistics CAMAL, at North Carolina State University. He has over 20 years of academic and industrial experience focused on high-frequency, high density power electronics with emphasis on packaging. He received his Ph.D. in Electrical Engineering from Virginia Tech, and spent his early career at the R&D centers of GE and Carrier Air-Conditioning Companies in advanced power electronics systems for military and commercial applications. He has published over 130 journal and conference articles, a number recognized with awards and is an IMAPS Fellow.
(Additional registration required)
PDC3: THERMAL AND DYNAMIC STRESS FAILURES IN ELECTRONIC AND PHOTONIC PACKAGING: PREDICTION AND PREVENTION
Typical stress failures caused by elevated thermal and/or dynamic loadings are addressed and discussed, with an emphasis on the high-temperature electronic and photonic packaging, the role of predictive modeling and, particularly, analytical (mathematical) and probabilistic modeling, and possible solutions to the typical reliability problems are considered and addressed.
Ephraim Suhir, Portland State University
Ephraim Suhir is on the faculty of the Portland State University, Portland, OR, USA, Technical University, Vienna, Austria and James Cook University, Queensland, Australia. He is also CEO of a Small Business Innovative Research (SBIR) ERS Co. in Los Altos, CA, USA. He is Life Fellow of IMAPS, IEEE, ASME and SPIE. He received many professional awards, including 1996 Bell Laboratories Distinguished Member of Technical Staff (DMTS) Award, 2019 IEEE EPS Field award and 2019 IMAPS Lifetime Achievement awardTUESDAY, APRIL 27, 2021

ON-DEMAND ALL DAY: Technical Presentations

PLENARY SESSION: LIVE
CICMT Keynote Presentation with Q&A
Jens Müller, Technische Universität Ilmenau
HiTEC Keynote Presentation with Q&A
John Bultitude
APEPS Keynote Presentation with Q&A
Power 3D IC Heterogeneous Integration
Bob Conner, X-Celeprint

HITEC: Circuits 1
Chair: Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS
CICMT: Design, Modeling, Simulation, Characterization & Reliability
Chair: Zhifu Liu
APEPS
Invited Keynote Presentations
Matt Francis, Ozark Integrated Circuits, Inc.
Rana Alizadeh, University of Arkansas
Power 3D IC Heterogeneous Integration
Brian Zahnstecher, President & Founder, PowerRox LLC
Authors Roundtable with Q&A
Cheng-Po Chen, GE Research
Andarawis Emad, GE Global Research
Roy Sajib, University of Arkansas
Kuei-Chih Feng
Frank Sandoval, Heraeus Electronics
Alexander Schulz, TU Ilmenau
Zhaoyi Zeng, University of Electronic Science and Technology of China
Author announcement
coming soon!

HITEC: Capacitors
Chair: John Bultitude
CICMT: Devices for Emerging Technologies
Chair: Ulrich Schmid
APEPS
Invited Keynote Presentations
Alex Teverosky, Jacobs
Ammar Kouki, Ecole de Technologie Supérieure
Speaker announcement
coming soon!
Authors Roundtable with Q&A
Roger Brewer, Lockheed Martin
Daniel Tyler, Exxelia USA, Inc.
Adrian Goldberg, Fraunhofer Institute for Ceramic Technologies
Charles Lin, Bridge Semiconductor Corporation
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Steffen Ziesche, Fraunhofer IKTS
Author announcement
coming soon!
WEDNESDAY, APRIL 28, 2021

ON-DEMAND ALL DAY: Technical Presentations

PLENARY SESSION: LIVE
HiTEC Keynote Presentation with Q&A
Aris Christou
APEPS Keynote Presentation with Q&A
Heterogenous Component Integration for Low-Power Modules and Sub-Systems
Pulugurtha Markondeya Raj, Florida International University
CICMT Keynote Presentation with Q&A
Heli Jantunen, University of Oulu

HITEC: Semiconductor Devices
Chair: Patrick McCluskey, University of Maryland, College Park
CICMT: Functional Materials for Passive / Active Devices (II)
Chair: Heli Jantunen, University of Oulu
APEPS
Invited Keynote Presentations
David Esler, GE Global Research
Shweta Agarwala, Aarhus University
MagIC - Heterogeneous Integration of Magnetics for Power Supply on Chip
Cian O'Mathuna,
Tyndall National Institute
Authors Roundtable with Q&A
Martijn Duraij, Techincal University of Denmark
John Harris, University of Arkansas
Sonia Perez, Ozark Integrated Circuits, Inc.
Arman Ur Rashid, University of Arkansas
Manuela Junghaehnel, Fraunhofer Institute for Organic Electronics
Martin Letz, SCHOTT AG
Ardalan Nasiri, University of Arkansas
Yongke Yan, Pennsylvania State University
Smart Ultrasonic Welding - A Versatile Interconnection Technology For Power Electronics Packaging
Matthias Hunstig,
Hesse Mechantronics

HITEC: Packaging
Reliability & Materials
Chair: Colin Johnston
CICMT
Chair: Dan Krueger
APEPS
Invited Keynote Presentations
Liangyu Chen
Mr. Yamashita
Speaker announcement
coming soon!
Authors Roundtable with Q&A
Stephanie Booth (Alain Izadnegahdar), SAIC-NASA Glenn
Nicholas Chiolino, Ozark Integrated Circuits, Inc.
Guangyu Fan, Indium Corporation of America
Patrick McCluskey, University of Maryland, College Park
Keith Perrin, Hexagon Manufacturing
Harold Snyder, Physical Solutions
Hua Xia, Hermetic Solutions Group
Hongwen Zhang, Indium Corporation
Heli Jantunen, University of Oulu
Shenhou Li, Tsinghua University
Huixing Lin, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Haiyi Peng, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Johannes Schur, Technische Universität Ilmenau
Hiroyuki Takahashi
Ellen Tormey, Ferro Corporation
Xiaogang Yao, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Author announcement
coming soon!
THURSDAY, APRIL 29, 2021

ON-DEMAND ALL DAY: Technical Presentations

PLENARY SESSION: LIVE
APEPS Keynote Presentation with Q&A
Packaging research of Si-SiC hybrid compact high-power modules
Fang Luo, Spellman HV Electronics Lab, Stony Brook University
CICMT Keynote Presentation with Q&A
Akihiko Sakamoto, LTCC Materials
HiTEC Keynote Presentation with Q&A
Michael Hamilton

HITEC: Circuits 2
Chair: Harold Snyder, Physical Solutions
CICMT: Material Processing and Device Manufacturing (II)
Chair: Soshu Kirihara
APEPS
Invited Keynote Presentations
Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS
Jing Guo, Xi'an Jiaotong University
Development of Organic High Power Packaging - Then and Now
Raymond Fillion
Authors Roundtable with Q&A
Piers Tremlett, Microchip Technology, Inc.
Philip G. Neudeck, NASA Glenn Research Center
Beate Capraro, Fraunhofer Institute for Ceramic Technologies and Systems
Cathleen Kleinholz, TU Ilmenau
Frank Polese, Oasis Materials Company LP
Author announcement
coming soon!