Technology Crossover Agenda

                                         

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PROGRAM AT A GLANCE

                   
             

 Monday, April 26 

                        

Access to recorded Technical Presentations On-Demand opens! 

Take note of any questions you may have and bring them to the Authors Roundtables over the next few days

                           

 Tuesday, April 27 

                            

LIVE Plenary Speakers
LIVE Keynote Speakers
LIVE Invited Speaker
5 Author's Roundtable 
Sessions with LIVE Q&A
On-Demand Technical Sessions

                        

 Wednesday, April 28 

                            

LIVE Plenary Speakers
LIVE Keynote Speakers

LIVE Invited Speaker
4 Author's Roundtable 
Sessions with LIVE Q&A
On-Demand Technical Sessions

                                   

 Thursday, April 29 

                            

LIVE Plenary Speakers
LIVE Keynote Speakers

LIVE Invited Speakers
1 Author's Roundtable 
Sessions with LIVE Q&A
On-Demand Technical Sessions


                             

PROGRAM & AGENDA


These Three Major Events will be Hosted Simultaneously from April 26 - 29, 2021

All LIVE content will be recorded and promptly uploaded to the Virtual Conference Portal for replay through June 1, 2021

* Full Conference Registrants Only *


    HiTEC (High Temp Elec)         CICMT (Ceramics)        APEPS (Pwr Pkging)


Your login credentials will come to you via email from noreply@imapscrossover.org 
Monday, April 26 between 8:00AM - 10:00AM Eastern

If you register after the conference begins you will receive your Welcome Email at a slight delay

AnchorMONDAY, APRIL 26, 2021

     

                       
   
Access to ON-DEMAND Technical Presentations OPENS!
Available April 12 - June1, 2021
Full Conference Registrants Only - Delivered through the Virtual Conference Portal

               On-Demand Technical Presentations Catalog                             



Professional Development Courses (PDCs) - CANCELLED
 

Anchor

TUESDAY, APRIL 27, 2021

                    

ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021
Full Conference Registrants Only - Delivered through the Virtual Conference Portal


           

              On-Demand Technical Presentations Catalog              


 PLENARY SESSION  10:00 am - 11:45 am Eastern

Plenary Presentation for Each Conference Followed by Q&A                       

     

           
10:00 am - 10:15 am Eastern
Opening Remarks
                        
10:15 am - 11:00 am Eastern

 CICMT Plenary Presentation with Q&A 

LTCC- and LTCC-based Multi Material Technologies for Microelectronic and Microsystem Applications
Jens
 MüllerTechnische Universität Ilmenau
                         

11:00 am - 11:45 am Eastern

 HiTEC Plenary Presentation with Q&A 

High Temperature Multilayer Ceramic Capacitors (MLCCs) for Power Applications
John Bultitude
, KEMET Corporation


11:45 am - 12:30 pm Eastern

 APEPS Plenary Presentation with Q&A 

Power 3D IC Heterogeneous Integration
Bob Conner, X-Celeprint 
              

1:00 pm - 2:15 pm Eastern
TUESDAY, EARLY AFTERNOON SESSION: LIVE


HITEC: Circuits 1

Chair: Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS

CICMT: Design, Modeling, Simulation, Characterization & Reliability

Chair: Jens Müller, 
Technische Universität Ilmenau


APEPS

Chair: Doug Hopkins, NCSU

                  
1:00 pm - 1:30 pm Eastern
Invited Keynote Presentations

Smart Nodes for High Temperature: Design, Process and Integration

Matt FrancisOzark Integrated Circuits, Inc.

LTCC Interposers for Double-Sided Power Electronic Modules

Rana AlizadehUniversity of Arkansas


Packaging Considerations for Energy Harvesting Applications

Brian ZahnstecherPowerRox LLC

                           
1:30 pm - 2:15 pm Eastern
Authors Roundtable with Q&A

 HiTEC Roundtable 

Cheng-Po ChenGE Research
Andarawis EmadGE Global Research


 CICMT Roundtable 

Alexander SchulzTU Ilmenau

 APEPS Invited Speaker

Invited Speaker - 1:30pm-1:55pm
Digital Design and Evaluation of  WBG  Power Electronics

Christian Uhrenfeldt,
Aalborg University


2:30 pm - 3:45 pm Eastern
TUESDAY, LATE AFTERNOON SESSION: LIVE


HITEC: Capacitors

Chair: John Bultitude, KEMET Corporation

CICMT: Devices for Emerging Technologies

Chair: Ulrich Schmid, TU Wien 


APEPS

                     
2:30 pm - 3:00 pm Eastern
Invited Keynote Presentations

Effect of High Temperature Storage on AC Characteristics of Polymer Tantalum Capacitors

Alex Teverosky, Jacobs

Recent Advances in LTCC-Enabled Field Programmable RF Circuits

Ammar KoukiEcole de Technologie Supérieure

                                  
3:00 pm - 3:45 pm Eastern
Authors Roundtable with Q&A

 HiTEC Roundtable 

Daniel TylerExxelia USA, Inc.

 CICMT Roundtable 

Adrian GoldbergFraunhofer Institute for Ceramic Technologies
Steffen Ziesche, Fraunhofer IKTS


4:00 pm - 5:15 pm Eastern  

TUESDAY, EVENING SESSION: LIVE



HITEC: Capacitors

CICMT: Functional materials for passive/active devices (I)

Chair: Markus Eberstein, TDK Sensors


APEPS

                                        
4:00 pm - 4:30 pm Eastern
Invited Keynote Presentations
  

Passive Multilayer Components for Higher Operating Temperatures: Ni-Cu-Zn Ferrites for Monolithic and Integrated Multilayer Inductors

Joerg Toepfer, Ernst-Abbe-Hochschule Jena

   
4:30 pm - 5:15 pm Eastern
Authors Roundtable with Q&A
  

 CICMT Roundtable 

Lina HeuserBAM
Kathrin ReinhardtFraunhofer IKTS

   
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WEDNESDAY, APRIL 28, 2021

                          
                       

     
ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021

Full Conference Registrants Only - Delivered through the Virtual Conference Portal


                 

            On-Demand Technical Presentations Catalog               

        




PLENARY SESSION: LIVE 10:00 am - 12:30 pm Eastern

Plenary Presentation for Each Dedicated Conference Followed by Q&A                             

                           
                                
10:00 am - 10:15 am Eastern
Opening Remarks
                
10:15 am - 11:00 am Eastern

 HiTEC Plenary Presentation with Q&A 

Diamond and GaO Devices 
Aris Christou, University of Maryland

                           

11:00 am - 11:45 am Eastern

 APEPS Plenary Presentation with Q&A 

Heterogenous Component Integration for Low-Power Modules and Sub-Systems
Pulugurtha Markondeya Raj, Florida International University
                                  

11:45 am - 12:30 pm Eastern

 CICMT Plenary Presentation with Q&A 

Ultra Low Permittivity Materials
Heli Jantunen
, University of Oulu
                                   

1:00 pm - 2:15 pm Eastern                           

WEDNESDAY, EARLY AFTERNOON SESSION: LIVE



HITEC: Semiconductor Devices

Chair: Patrick McCluskey, University of Maryland, College Park

CICMT: Functional Materials for Passive / Active Devices (II)

Chair: Heli Jantunen, University of Oulu


APEPS

Chair: Doug Hopkins, NCSU


                           
1:00 pm - 1:30 pm Eastern
Invited Keynote Presentations

Extreme Temperature SiC Power Semiconductor 

David EslerGE Global Research

A New Paradigm in Printed Electronics through Ceramic Materials 

Shweta Agarwala, Aarhus University

MagIC - Heterogeneous Integration of Magnetics for Power Supply on Chip

Cian O'Mathuna,
Tyndall National Institute

                                   
1:30 pm - 2:15 pm Eastern
Authors Roundtable with Q&A

 HiTEC Roundtable 

Martijn DuraijTechincal University of Denmark
John HarrisUniversity of Arkansas
Sonia PerezOzark Integrated Circuits, Inc.


 CICMT Roundtable 

Ardalan Nasiri, University of Arkansas

 APEPS Invited Speaker

Invited Speaker:  1:30pm-1:55pm

Smart Ultrasonic Welding - A Versatile Interconnection Technology For Power Electronics Packaging

Matthias Hunstig,
Hesse Mechantronics

2:30 pm - 3:45 pm Eastern                

WEDNESDAY, LATE AFTERNOON SESSION: LIVE


HITEC: Packaging
Reliability & Materials

Chair: Colin Johnston, Oxford University 

CICMT: Material Processing and Device Manufacturing (I)

Chair: Dan Krueger, Honeywell  


APEPS

                               
2:30 pm - 3:00 pm Eastern
Invited Keynote Presentations

Upscaling of 500C Durable SiC JFET-R Integrated Circuits

Philip G. NeudeckNASA GRC

Slot Array Antenna by Using SIW Made by LTCC Technology

Daisuke Yamashita

                              
3:00 pm - 3:45 pm Eastern
Authors Roundtable with Q&A

 HiTEC Roundtable 

Liangyu ChenOAI/NASA GRC
Stephanie Booth (Alain Izadnegahdar)SAIC-NASA Glenn
Nicholas ChiolinoOzark Integrated Circuits, Inc.
Patrick McCluskey, University of Maryland, College Park
Harold SnyderPhysical Solutions
Hua XiaHermetic Solutions Group

 CICMT Roundtable 

Johannes Schur, Technische Universität Ilmenau
Chao MaFerro Corporation


AnchorTHURSDAY, APRIL 29, 2021

 

                   


                         

     
ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021

Full Conference Registrants Only - Delivered through the Virtual Conference Portal


                  

             On-Demand Technical Presentations Catalog              




     
PLENARY SESSION: LIVE 10:00 am - 12:30 pm Eastern                          
10:00 am - 10:15 am Eastern
Opening Remarks
     
10:15 am - 11:00 am Eastern

 APEPS Plenary Presentation with Q&A 

Packaging Research of Si-SiC Hybrid Compact High-power Modules
Fang Luo, Spellman HV Electronics Lab, Stony Brook University
                 

11:00 am - 11:45 am Eastern

 CICMT Plenary Presentation with Q&A 

LTCC Technology for Precise Electronic Devices
Akihiko Sakamoto, LTCC Materials
                               

11:45 am - 12:30 pm Eastern

HiTEC Plenary Presentation with Q&A 

Packaging & Integration Technologies & Challenges for Cryogenic & Quantum Systems
Michael Hamilton
, Auburn University
                                  

1:00 pm - 2:15 pm Eastern   

THURSDAY, AFTERNOON SESSION: LIVE



HITEC: Circuits 2

Chair: Harold Snyder, Physical Solutions

CICMT: Material Processing and Device Manufacturing (II)

Chair: Soshu Kirihara, Osaka University  


APEPS

Chair: Doug Hopkins, NCSU


                                      
1:00 pm - 1:30 pm Eastern
Invited Keynote Presentations

A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300C

Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS

Recent Development of Microwave Dielectric Materials Fabricated by Cold Sintering Process

Jing Guo, Xi'an Jiaotong University

Development of Organic High Power Packaging - Then and Now

Raymond Fillion

                             
1:30 pm - 2:15 pm Eastern
Authors Roundtable with Q&A

 HiTEC Invited Speaker 

Invited Speaker:  1:30pm-1:55pm
High Temperature Sensors Interface Circuitry and Control Systems,  Components and PCB Assemblies

Piers TremlettMicrochip Technology, Inc.

 CICMT Roundtable 

Cathleen Kleinholz, TU Ilmenau
Lukasz Kosior
Pulugurtha Markondeya RajFlorida International University


APEPS Invited Speaker

Invited Speaker:  1:30pm-1:55pm

Advances in Highly Thermally Conductive Organic Power Packaging

Douglas Hopkins,
North Carolina State University


                               
Conference Close
Wrap Up Meeting With Conference Chairs / Lessons Learned