Technology Crossover Agenda
PROGRAM AT A GLANCE
Monday, April 26
Access to recorded Technical Presentations On-Demand opens!
Take note of any questions you may have and bring them to the Authors Roundtables over the next few days
Tuesday, April 27
3 LIVE Plenary Speakers
6 LIVE Keynote Speakers
1 LIVE Invited Speaker
5 Author's Roundtable
Sessions with LIVE Q&A
On-Demand Technical Sessions
Wednesday, April 28
3 LIVE Plenary Speakers
5 LIVE Keynote Speakers
1 LIVE Invited Speaker
4 Author's Roundtable
Sessions with LIVE Q&A
On-Demand Technical Sessions
Thursday, April 29
3 LIVE Plenary Speakers
3 LIVE Keynote Speakers
2 LIVE Invited Speakers
1 Author's Roundtable
Sessions with LIVE Q&A
On-Demand Technical Sessions
PROGRAM & AGENDA
These Three Major Events will be Hosted Simultaneously from April 26 - 29, 2021
All LIVE content will be recorded and promptly uploaded to the Virtual Conference Portal for replay through June 1, 2021
* Full Conference Registrants Only *
HiTEC (High Temp Elec) CICMT (Ceramics) APEPS (Pwr Pkging)
Your login credentials will come to you via email from noreply@imapscrossover.org
Monday, April 26 between 8:00AM - 10:00AM Eastern
If you register after the conference begins you will receive your Welcome Email at a slight delay
MONDAY, APRIL 26, 2021
Access to ON-DEMAND Technical Presentations OPENS!
Available April 12 - June1, 2021
Full Conference Registrants Only - Delivered through the Virtual Conference Portal
Professional Development Courses (PDCs) - CANCELLED
TUESDAY, APRIL 27, 2021
ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021
Full Conference Registrants Only - Delivered through the Virtual Conference Portal
On-Demand Technical Presentations Catalog
Plenary Presentation for Each Conference Followed by Q&A
CICMT Plenary Presentation with Q&A
LTCC- and LTCC-based Multi Material Technologies for Microelectronic and Microsystem Applications
Jens Müller, Technische Universität Ilmenau
HiTEC Plenary Presentation with Q&A
High Temperature Multilayer Ceramic Capacitors (MLCCs) for Power Applications
John Bultitude, KEMET Corporation
APEPS Plenary Presentation with Q&A
Power 3D IC Heterogeneous Integration
Bob Conner, X-Celeprint
HITEC: Circuits 1
Chair: Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS
CICMT: Design, Modeling, Simulation, Characterization & Reliability
Chair: Jens Müller,
Technische Universität Ilmenau
APEPS
Chair: Doug Hopkins, NCSU
Invited Keynote Presentations
Smart Nodes for High Temperature: Design, Process and Integration
Matt Francis, Ozark Integrated Circuits, Inc.
LTCC Interposers for Double-Sided Power Electronic Modules
Rana Alizadeh, University of Arkansas
Packaging Considerations for Energy Harvesting Applications
Brian Zahnstecher, PowerRox LLC
Authors Roundtable with Q&A
HiTEC Roundtable
Cheng-Po Chen, GE Research
Andarawis Emad, GE Global Research
CICMT Roundtable
Alexander Schulz, TU Ilmenau
APEPS Invited Speaker
Invited Speaker - 1:30pm-1:55pm
Digital Design and Evaluation of WBG Power Electronics
Christian Uhrenfeldt, Aalborg University
HITEC: Capacitors
Chair: John Bultitude, KEMET Corporation
CICMT: Devices for Emerging Technologies
Chair: Ulrich Schmid, TU Wien
APEPS
Invited Keynote Presentations
Effect of High Temperature Storage on AC Characteristics of Polymer Tantalum Capacitors
Alex Teverosky, Jacobs
Recent Advances in LTCC-Enabled Field Programmable RF Circuits
Ammar Kouki, Ecole de Technologie Supérieure
Authors Roundtable with Q&A
HiTEC Roundtable
Daniel Tyler, Exxelia USA, Inc.
CICMT Roundtable
Adrian Goldberg, Fraunhofer Institute for Ceramic Technologies
Steffen Ziesche, Fraunhofer IKTS
TUESDAY, EVENING SESSION: LIVE
HITEC: Capacitors
CICMT: Functional materials for passive/active devices (I)
Chair: Markus Eberstein, TDK Sensors
APEPS
Invited Keynote Presentations
Passive Multilayer Components for Higher Operating Temperatures: Ni-Cu-Zn Ferrites for Monolithic and Integrated Multilayer Inductors
Joerg Toepfer, Ernst-Abbe-Hochschule Jena
Authors Roundtable with Q&A
CICMT Roundtable
Lina Heuser, BAM
Kathrin Reinhardt, Fraunhofer IKTS
WEDNESDAY, APRIL 28, 2021
ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021
Full Conference Registrants Only - Delivered through the Virtual Conference Portal
On-Demand Technical Presentations Catalog
PLENARY SESSION: LIVE 10:00 am - 12:30 pm Eastern
Plenary Presentation for Each Dedicated Conference Followed by Q&A
HiTEC Plenary Presentation with Q&A
Diamond and GaO Devices
Aris Christou, University of Maryland
APEPS Plenary Presentation with Q&A
Heterogenous Component Integration for Low-Power Modules and Sub-Systems
Pulugurtha Markondeya Raj, Florida International University
CICMT Plenary Presentation with Q&A
Ultra Low Permittivity Materials
Heli Jantunen, University of Oulu
WEDNESDAY, EARLY AFTERNOON SESSION: LIVE
HITEC: Semiconductor Devices
Chair: Patrick McCluskey, University of Maryland, College Park
CICMT: Functional Materials for Passive / Active Devices (II)
Chair: Heli Jantunen, University of Oulu
APEPS
Chair: Doug Hopkins, NCSU
Invited Keynote Presentations
Extreme Temperature SiC Power Semiconductor
David Esler, GE Global Research
A New Paradigm in Printed Electronics through Ceramic Materials
Shweta Agarwala, Aarhus University
MagIC - Heterogeneous Integration of Magnetics for Power Supply on Chip
Cian O'Mathuna,
Tyndall National Institute
Authors Roundtable with Q&A
HiTEC Roundtable
Martijn Duraij, Techincal University of Denmark
John Harris, University of Arkansas
Sonia Perez, Ozark Integrated Circuits, Inc.
CICMT Roundtable
Ardalan Nasiri, University of Arkansas
APEPS Invited Speaker
Invited Speaker: 1:30pm-1:55pm
Smart Ultrasonic Welding - A Versatile Interconnection Technology For Power Electronics Packaging
Matthias Hunstig,
Hesse Mechantronics
WEDNESDAY, LATE AFTERNOON SESSION: LIVE
HITEC: Packaging
Reliability & Materials
Chair: Colin Johnston, Oxford University
CICMT: Material Processing and Device Manufacturing (I)
Chair: Dan Krueger, Honeywell
APEPS
Invited Keynote Presentations
Upscaling of 500C Durable SiC JFET-R Integrated Circuits
Philip G. Neudeck, NASA GRC
Slot Array Antenna by Using SIW Made by LTCC Technology
Daisuke Yamashita
Authors Roundtable with Q&A
HiTEC Roundtable
Liangyu Chen, OAI/NASA GRC
Stephanie Booth (Alain Izadnegahdar), SAIC-NASA Glenn
Nicholas Chiolino, Ozark Integrated Circuits, Inc.
Patrick McCluskey, University of Maryland, College Park
Harold Snyder, Physical Solutions
Hua Xia, Hermetic Solutions Group
CICMT Roundtable
Johannes Schur, Technische Universität Ilmenau
Chao Ma, Ferro Corporation
THURSDAY, APRIL 29, 2021
ON-DEMAND Technical Presentations - Available April 12 - June 1, 2021
Full Conference Registrants Only - Delivered through the Virtual Conference Portal
On-Demand Technical Presentations Catalog
PLENARY SESSION: LIVE 10:00 am - 12:30 pm Eastern
APEPS Plenary Presentation with Q&A
Packaging Research of Si-SiC Hybrid Compact High-power Modules
Fang Luo, Spellman HV Electronics Lab, Stony Brook University
CICMT Plenary Presentation with Q&A
LTCC Technology for Precise Electronic Devices
Akihiko Sakamoto, LTCC Materials
HiTEC Plenary Presentation with Q&A
Packaging & Integration Technologies & Challenges for Cryogenic & Quantum Systems
Michael Hamilton, Auburn University
THURSDAY, AFTERNOON SESSION: LIVE
HITEC: Circuits 2
Chair: Harold Snyder, Physical Solutions
CICMT: Material Processing and Device Manufacturing (II)
Chair: Soshu Kirihara, Osaka University
APEPS
Chair: Doug Hopkins, NCSU
Invited Keynote Presentations
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300C
Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS
Recent Development of Microwave Dielectric Materials Fabricated by Cold Sintering Process
Jing Guo, Xi'an Jiaotong University
Development of Organic High Power Packaging - Then and Now
Raymond Fillion
Authors Roundtable with Q&A
HiTEC Invited Speaker
Invited Speaker: 1:30pm-1:55pm
High Temperature Sensors Interface Circuitry and Control Systems, Components and PCB Assemblies
Piers Tremlett, Microchip Technology, Inc.
CICMT Roundtable
Cathleen Kleinholz, TU Ilmenau
Lukasz Kosior
Pulugurtha Markondeya Raj, Florida International University
APEPS Invited Speaker
Invited Speaker: 1:30pm-1:55pm
Advances in Highly Thermally Conductive Organic Power Packaging
Douglas Hopkins,
North Carolina State University