Technology Crossover Agenda

High Temperature Electronics

CICMT (Ceramics)

Power Packaging 

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 Monday, April 26 

3 LIVE Professional Development Courses (PDCs)

 Tuesday, April 27 

3 LIVE Plenary Speakers
6 LIVE Keynote Speakers
5 Author's Roundtable 
Sessions with LIVE Q&A
On-Demand Technical Sessions

 Wednesday, April 28 

3 LIVE Plenary Speakers
5 LIVE Keynote Speakers
1 LIVE Invited Speaker
4 Author's Roundtable 
Sessions with LIVE Q&A
On-Demand Technical Sessions

 Thursday, April 29 

3 LIVE Plenary Speakers
3 LIVE Keynote Speakers
2 LIVE Invited Speakers
1 Author's Roundtable 
Sessions with LIVE Q&A
On-Demand Technical Sessions

PDCs: LIVE Classroom-Style Tutorials with a Narrow Educational Focus Taught by the Best in the Industry.
              

PDC 1: MAKING AND QUALIFYING RELIABLE EXTREME ENVIRONMENT ELECTRONICS

Today’s most challenging applications of electronics technology require operation in the harshest of environments. Electronics have left the desktop and air conditioned computer room to enter environments ranging from the deepest ocean depths to the vastness of space.  These environments combine extreme temperatures with extreme pressures, high levels of shock and vibration, and exposure to damaging chemicals.  Applications as diverse as avionics/planetary exploration (Venus: 460C surface, 90 atm pressure, H2SO4), energy exploration (T > 150C, high pressure, corrodants, drilling shock), and underhood automotive propulsion (T > 165C, vibration, road salt) require new materials and mechanical design solutions that address thermal management, stress management, fatigue resistance, corrosion resistance, durability, reliability, maintainability, and sustainability.  In addition, temperatures are rising for many power electronic systems as well, with the combination of higher power density modules and the availability of high temperature stable semiconductor devices. This presentation will discuss the latest work in the areas of wide bandgap semiconductor reliability, high temperature interconnection including copper wire bonding, lead-free attach material synthesis, 3D integrated thermal packaging, and advanced manufacturing of power electronics – all focused on designing, manufacturing and qualifying electronics for reliable use in the most extreme environments.
                  

Patrick McCluskey, University of Maryland, College Park

Dr. McCluskey is Professor and Leader of the Design and Reliability of Systems Division in the Mechanical Engineering Department at the University of Maryland, College Park.  He has  published extensively in the area of packaging and reliability of electronics and microsystems for high power and extreme environments, including editing/co-editing three books and authoring over 150 technical articles and book chapters with over 3300 citations. He is a fellow of IMAPS, a member of the Board of Directors of IMAPS, and the General Chair of the IMAPS High Temperature Electronics Conference (HiTEC).  He is also a senior member and member of the Board of Governors of IEEE EPS.
                          

              (Additional registration required)                       

PDC 2: ADVANCES IN HIGHLY THERMALLY CONDUCTIVE ORGANIC POWER PACKAGING

New Epoxy Resin Composite Dielectric (ERCD) films for single and multilayer organic substrates can reach high thermal conductivity (10W/mK), high temperature (300C), and high voltage (40kV/mm) with thicknesses from 80m to 120m, and are ideal for signal and power packaging. The thermal conductance of 120m at 8W/mK surpasses 500m Al2O3 as a substrate material. Multilayering brings to power packaging the opportunity to manage common-mode currents in high-frequency switching by Wide Band Gap (WBG) devices, such as power GaN, and extended for mixed signal electronics. The attendee will gain knowledge of material characteristics, design rules for use along with a list of fabricators, and be presented with two design examples.

Douglas Hopkins, North Carolina State University

         (Additional registration required)     

PDC3: THERMAL AND DYNAMIC STRESS FAILURES IN ELECTRONIC AND PHOTONIC PACKAGING: PREDICTION AND PREVENTION

Typical stress failures caused by elevated thermal and/or dynamic loadings are addressed and discussed, with an emphasis on the high-temperature electronic and photonic packaging, the role of predictive modeling and, particularly, analytical (mathematical) and probabilistic modeling, and possible solutions to the typical reliability problems are considered and addressed.

Ephraim Suhir, Portland State University

   
ON-DEMAND ALL DAY: Technical Presentations

CICMT Keynote Presentation with Q&A

Jens Müller, Technische Universität Ilmenau
                         

HiTEC Keynote Presentation with Q&A

John Bultitude

APEPS Keynote Presentation with Q&A

Power 3D IC Heterogeneous Integration
Bob Conner, X-Celeprint 
              

Matt Francis, Ozark Integrated Circuits, Inc.

Rana Alizadeh, University of Arkansas

Power 3D IC Heterogeneous Integration

Brian Zahnstecher, President & Founder, PowerRox LLC

Cheng-Po Chen, GE Research
Andarawis Emad, GE Global Research
Roy Sajib, University of Arkansas

Kuei-Chih Feng
Frank Sandoval, Heraeus Electronics
Alexander Schulz, TU Ilmenau
Zhaoyi Zeng, University of Electronic Science and Technology of China

Author announcement
coming soon!

Alex Teverosky, Jacobs

Ammar Kouki, Ecole de Technologie Supérieure

Speaker announcement
coming soon!

Roger Brewer, Lockheed Martin
Daniel Tyler, Exxelia USA, Inc.

Adrian Goldberg, Fraunhofer Institute for Ceramic Technologies
Charles Lin, Bridge Semiconductor Corporation
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Steffen Ziesche, Fraunhofer IKTS

Author announcement
coming soon!

HiTEC Keynote Presentation with Q&A

Aris Christou
                           

APEPS Keynote Presentation with Q&A

Heterogenous Component Integration for Low-Power Modules and Sub-Systems
Pulugurtha Markondeya Raj, Florida International University
                                  

CICMT Keynote Presentation with Q&A

Heli Jantunen, University of Oulu
                                   

David Esler, GE Global Research

Shweta Agarwala, Aarhus University

MagIC - Heterogeneous Integration of Magnetics for Power Supply on Chip

Cian O'Mathuna,
Tyndall National Institute

Martijn Duraij, Techincal University of Denmark
John Harris, University of Arkansas
Sonia Perez, Ozark Integrated Circuits, Inc.
Arman Ur Rashid, University of Arkansas

Manuela Junghaehnel, Fraunhofer Institute for Organic Electronics
Martin Letz, SCHOTT AG
Ardalan Nasiri, University of Arkansas
Yongke Yan, Pennsylvania State University

Smart Ultrasonic Welding - A Versatile Interconnection Technology For Power Electronics Packaging

Matthias Hunstig,
Hesse Mechantronics

Liangyu Chen

Mr. Yamashita

Speaker announcement
coming soon!

Stephanie Booth (Alain Izadnegahdar), SAIC-NASA Glenn
Nicholas Chiolino, Ozark Integrated Circuits, Inc.
Guangyu Fan, Indium Corporation of America
Patrick McCluskey, University of Maryland, College Park
Keith Perrin, Hexagon Manufacturing
Harold Snyder, Physical Solutions
Hua Xia, Hermetic Solutions Group
Hongwen Zhang, Indium Corporation

Heli Jantunen, University of Oulu
Shenhou Li, Tsinghua University
Huixing Lin, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Haiyi Peng, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Johannes Schur, Technische Universität Ilmenau
Hiroyuki Takahashi
Ellen Tormey, Ferro Corporation
Xiaogang Yao, Shanghai Institute of Ceramics, Chinese Academy of Sciences

Author announcement
coming soon!

APEPS Keynote Presentation with Q&A

Packaging research of Si-SiC hybrid compact high-power modules
Fang Luo, Spellman HV Electronics Lab, Stony Brook University
                 

CICMT Keynote Presentation with Q&A

Akihiko Sakamoto, LTCC Materials
                               

HiTEC Keynote Presentation with Q&A

Michael Hamilton
                                  

Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS

Jing Guo, Xi'an Jiaotong University

Development of Organic High Power Packaging - Then and Now

Raymond Fillion

Piers Tremlett, Microchip Technology, Inc.
Philip G. Neudeck, NASA Glenn Research Center

Beate Capraro, Fraunhofer Institute for Ceramic Technologies and Systems 
Cathleen Kleinholz, TU Ilmenau
Frank Polese, Oasis Materials Company LP

Author announcement
coming soon!