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                                                TECHNICAL PRESENTATIONS                                            

These will be delivered On-Demand for full conference registrants
 Available through the Virtual Conference Portal April 12th through June 1st

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    HiTEC (High Temp Elec)         CICMT (Ceramics)        APEPS (Pwr Pkging)


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Monday, April 26 between 8:00AM - 10:00AM Eastern

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  HiTECHigh Temperature Electronics Conference   


 General Co-Chairs: 
F. Patrick McCluskey, University of Maryland | mcclupa@calce.umd.edu
Colin Johnston, Oxford University | colin.johnston@materials.ox.ac.uk

 Technical Organizing Committee:  
Liangyu Chen, OAI/NASA GRC
Holger Kappert, Fraunhofer IMS

Callum Middleton, CSA Catapult

 HiTEC Session: Circuits 1 

These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Tuesday, 1:30PM - 2:15PM Eastern

 Chair:  Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS

4-20mA optical sensor at 300C using SiC and SOI integrated circuits
Cheng-Po Chen, GE Research

300C capable, high temperature optical communication
Andarawis Emad, General Electric Global Research


 HiTEC Session: Capacitors   

These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Tuesday, 3:00PM - 3:45PM Eastern

 Chair:  John Bultitude, KEMET Electronics

Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors
Daniel Tyler, Exxelia USA, Inc.


 HiTEC Session: Semiconductor Devices 

These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Wednesday, 1:30PM - 2:15PM Eastern

 Chair:  Patrick McCluskeyUniversity of Maryland, College Park

Enhancement Mode GaN-FETs in Extreme Temperature Conditions, Part I: Static Parasitic Parameters
Martijn Duraij, Technical University of Denmark

Enhancement Mode GaN-FETs in Extreme Temperature Conditions, Part II: Dynamic Parasitic Parameters
Martijn Duraij, Technical University of Denmark

Package Design and Analysis for Vertical GaN FET's
John Harris, University of Arkansas

Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
Sonia Perez, Ozark Integrated Circuits, Inc.


HiTEC Session: Packaging Reliability & Materials 
These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Wednesday 3:00PM - 3:45PM Eastern
 Chair: Colin Johnston, Oxford University

A 96% Alumina based Packaging System for 500C Test of SiC Integrated Circuits
Liangyu Chen, Ohio Aerospace Institute/NASA Glenn Research Center

Alternative Setup for Long-Duration Low-Frequency 600C Ambient Testing of Multiple SiC Integrated Circuits
Stephanie Booth, SAIC-NASA Glenn

470 Celsius Packaging System for Silicon Carbide Electronics
Nicholas Chiolino, Ozark Integrated Circuits, Inc.

Simulating the Effect of Rigid Frameworks on the Mechanical Properties of Transient Liquid Phase Sintered (TLPS) Alloys 
Patrick McCluskey, University of Maryland, College Park

A 300C High Reliability HALT/HAST Screening/Sorting Procedure for Ceramic Capacitors Part 2
Harold L. Snyder, Jr., Physical Solutions

DESIGNS FOR RELIABILITY AND FAILURE MODE PREVENTION OF ELECTRICAL FEEDTHROUGHS IN INTEGRATED DOWNHOLE LOGGING TOOLS
Hua Xia, Hermetic Solutions

  CICMT | Ceramic Interconnet and Ceramic Microsystems Technologies   

 General Chair: 
Steve Dai, Sandia National Laboratories 

 Technical Chairs: 
 Ulrich Schmid, TU Wien
Markus EbersteinTDK Sensors

 Technical Organizing Committee:  
Heli Jantunen, University of Oulu
Eung Soo KimKyonggi University  
Soshu Kirihara, Joining and Welding Research Institute Osaka University  
Daniel Krueger, Honeywell  
Zhifu Liu, Shanghai Institute of Ceramics of the Chinese Academy of Sciences
Jens MüllerTechnische Universität Ilmenau 
Uwe Partsch, Fraunhofer IKTS

 CICMT Session: Design, Modeling, Simulation, Characterization & Reliability 

These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Tuesday, 1:30PM - 2:15PM Eastern

 Chair:  Jens Müller, Technische Universität Ilmenau 

LTCC patch antenna array with embedded air cavities for5G mobile applications
Alexander Schulz, TU Ilmenau

 CICMT Session: Devices for Emerging Technologies 

These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Tuesday, 3:00PM - 3:45PM Eastern

 Chair:  Ulrich Schmid, TU Wien

Active and passive ceramic micro valves for fuel cell systems
Adrian Goldberg, Fraunhofer Institute for Ceramic Technologies

A 26 GHz-Band Air-Filled Substrate Integrated Waveguide Filter based on LTCC
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences

Characterization of Multilayer Ceramic based Sensor Solutions for on-turbine measurement
Steffen Ziesche, Fraunhoefer IKTS

 CICMT Session: Functional Materials for Passiv/Active Devices (I) 

These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Tuesday, 4:30PM - 5:15PM Eastern

 Chair:   Markus Eberstein, TDK Sensors

Sintering of silver - alkali zinc borate glass - composites
Lina Heuser, Bundesanstalt Materialforschung (BAM)

Photoimageable pastes for 5G applications
Kathrin Reinhardt, Fraunhoefer IKTS

 CICMT Session: Functional Materials for Passive/Active Devices (II) 

These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Wednesday, 1:30PM - 2:15PM Eastern

 Chair:  Heli Jantunen, University of Oulu

500C Capable, Weather-Resistant Electronics Packaging for Extreme Environment Exploration
Ardalan Nasiri, University of Arkansas


 CICMT Session: Material Processing and Device Manufacturing (I) 

These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Wednesday 3:00PM - 3:45PM Eastern

 Chair:  Daniel Krueger, Honeywell 

ULTCC composite materials with ultra-low permittivity
Heli Jantunen, Microelectronics Research Unit, University of Oulu

LTCC-based Circulators with integrated Sc-Hexaferrites
Johannes Schur, Technische Universität Ilmenau

M7 LTCC-Ag System for 5G Applications
Chao Ma, Ferro Corp.

 CICMT Session: Material Processing and Device Manufacturing (II) 

These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Thursday, 1:30PM - 2:15PM Eastern

 Chair:  Soshu Kirihara, Joining and Welding Research Institute Osaka University 

Implementation of SiCer Technology for Pressure Sensor Applicationsns
Cathleen Kleinholz, TU Ilmenau

Ultraprecise printing of micrometric conductive structures for MEMS packaging and integration
Lukasz Kosior,  XTPL SA (Piotr Kowalczewski)

Embedded-Die Packaging and Package-to-Flex Remateable Interconnections
Pulugurtha Markondeya Raj, Florida International University


 APEPS | Advanced Power Electronics Packaging Symposium 


 General Chair: 
Prof. Douglas C Hopkins, Ph. D
NCSU Packaging Research in Electronic Energy Systems (PREES)

 Technical Program Co-Chairs: 
Prof. Patrick McCluskey, University of Maryland

 Steering Committee: 
John Bultitude, KEMET Electronics;
Benson Chan, Binghamton University;
Bob Conner, X-Celeprint;
Rick Eddins, GE Aviation US;
Mike McKeown, Hesse Mechatronics;
Jason Rouse, Corning;
Brian Rowden, Oak Ridge National Lab


Smart Ultrasonic Welding - A Versatile Interconnection Technology For Power Electronics Packaging
Matthias Hunstig, Hesse Mechatronics

Material System Solutions for Power Module Assembly
Habib Mustain, Heraeus Electronics

Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules
Tzu-Hsuan Cheng, Douglas C. Hopkins, North Carolina State University

Shrinking Power Electronics Using Quilt Packaging
Robert J. Engelhardt Jr., Indiana Integrated Circuits LLC

A 1200V/650V/160A SiC+ Si IGBT 3-Level T-type NPC Power Module with Optimized Loop Inductance
Asif Imran Emon, Zhao Yuan, Amol Deshpande and Fang Luo

Power Electronics Application Trends and Reliability-Enhancing Material Technology
Joe Hertline, Indium Corporation

Study of Al Wire Bonds to understand cross-talk and current carrying capacity in WBG Power Module Design
Utkarsh Mehrotra, Adam Morgan, Douglas C. Hopkins, North Carolina State University

Chip Scale Power Transistor Packaging
Shaun Bowers, Amkor Technology, Inc.

Power Packaging Trends in Emerging 48V Ecosystem
Ajay Kumar Sattu, Amkor Technology, Inc.

Design of Subsystem Module Package for Power Distribution Network
HoJeong Lim, Amkor Technology, Inc. (Ruben Fuentes)

Investigation of Carbon Fiber TIM Gap Pad for Enabling Next Generation Automotive High-Power Systems
Jerry Wu, Dexerials America Corp.

Multi-Level Bridge Tapped Resonant Converter: A Pathway to High Power Density SSTs and its Packaging Challenges 
Pritam Das, ECE SUNY Binghamton