Technology Crossover | Technical Presentations
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TECHNICAL PRESENTATIONS
These will be delivered On-Demand for full conference registrants
Available through the Virtual Conference Portal April 12th through June 1st!
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HiTEC (High Temp Elec) CICMT (Ceramics) APEPS (Pwr Pkging)
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Monday, April 26 between 8:00AM - 10:00AM Eastern
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HiTEC | High Temperature Electronics Conference
General Co-Chairs:
F. Patrick McCluskey, University of Maryland | mcclupa@calce.umd.edu
Colin Johnston, Oxford University | colin.johnston@materials.ox.ac.uk
Technical Organizing Committee:
Liangyu Chen, OAI/NASA GRC
Holger Kappert, Fraunhofer IMS
Callum Middleton, CSA Catapult
HiTEC Session: Circuits 1
These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Tuesday, 1:30PM - 2:15PM Eastern
Chair: Holger Kappert, Fraunhofer Institute for Microelectronic Circuits and Systems IMS
4-20mA optical sensor at 300C using SiC and SOI integrated circuits
Cheng-Po Chen, GE Research
300C capable, high temperature optical communication
Andarawis Emad, General Electric Global Research
HiTEC Session: Capacitors
These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Tuesday, 3:00PM - 3:45PM Eastern
Chair: John Bultitude, KEMET Electronics
Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors
Daniel Tyler, Exxelia USA, Inc.
HiTEC Session: Semiconductor Devices
These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Wednesday, 1:30PM - 2:15PM Eastern
Chair: Patrick McCluskey, University of Maryland, College Park
Enhancement Mode GaN-FETs in Extreme Temperature Conditions, Part I: Static Parasitic Parameters
Martijn Duraij, Technical University of Denmark
Enhancement Mode GaN-FETs in Extreme Temperature Conditions, Part II: Dynamic Parasitic Parameters
Martijn Duraij, Technical University of Denmark
Package Design and Analysis for Vertical GaN FET's
John Harris, University of Arkansas
Silicon Carbide Junction Field Effect Transistor Compact Model for Extreme Environment Integrated Circuit Design
Sonia Perez, Ozark Integrated Circuits, Inc.
Liangyu Chen, Ohio Aerospace Institute/NASA Glenn Research Center
Stephanie Booth, SAIC-NASA Glenn
Nicholas Chiolino, Ozark Integrated Circuits, Inc.
Patrick McCluskey, University of Maryland, College Park
Harold L. Snyder, Jr., Physical Solutions
Hua Xia, Hermetic Solutions
CICMT | Ceramic Interconnet and Ceramic Microsystems Technologies
General Chair:
Steve Dai, Sandia National Laboratories
Technical Chairs:
Ulrich Schmid, TU Wien
Markus Eberstein, TDK Sensors
Technical Organizing Committee:
Heli Jantunen, University of Oulu
Eung Soo Kim, Kyonggi University
Soshu Kirihara, Joining and Welding Research Institute Osaka University
Daniel Krueger, Honeywell
Zhifu Liu, Shanghai Institute of Ceramics of the Chinese Academy of Sciences
Jens Müller, Technische Universität Ilmenau
Uwe Partsch, Fraunhofer IKTS
CICMT Session: Design, Modeling, Simulation, Characterization & Reliability
These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Tuesday, 1:30PM - 2:15PM Eastern
Chair: Jens Müller, Technische Universität Ilmenau
LTCC patch antenna array with embedded air cavities for5G mobile applications
Alexander Schulz, TU Ilmenau
CICMT Session: Devices for Emerging Technologies
These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Tuesday, 3:00PM - 3:45PM Eastern
Chair: Ulrich Schmid, TU Wien
Active and passive ceramic micro valves for fuel cell systems
Adrian Goldberg, Fraunhofer Institute for Ceramic Technologies
A 26 GHz-Band Air-Filled Substrate Integrated Waveguide Filter based on LTCC
Zhifu Liu, Shanghai Institute of Ceramics, Chinese Academy of Sciences
Characterization of Multilayer Ceramic based Sensor Solutions for on-turbine measurement
Steffen Ziesche, Fraunhoefer IKTS
CICMT Session: Functional Materials for Passiv/Active Devices (I)
These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Tuesday, 4:30PM - 5:15PM Eastern
Chair: Markus Eberstein, TDK Sensors
Sintering of silver - alkali zinc borate glass - composites
Lina Heuser, Bundesanstalt Materialforschung (BAM)
Photoimageable pastes for 5G applications
Kathrin Reinhardt, Fraunhoefer IKTS
CICMT Session: Functional Materials for Passive/Active Devices (II)
These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Wednesday, 1:30PM - 2:15PM Eastern
Chair: Heli Jantunen, University of Oulu
500C Capable, Weather-Resistant Electronics Packaging for Extreme Environment Exploration
Ardalan Nasiri, University of Arkansas
CICMT Session: Material Processing and Device Manufacturing (I)
These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Wednesday 3:00PM - 3:45PM Eastern
Chair: Daniel Krueger, Honeywell
ULTCC composite materials with ultra-low permittivity
Heli Jantunen, Microelectronics Research Unit, University of Oulu
LTCC-based Circulators with integrated Sc-Hexaferrites
Johannes Schur, Technische Universität Ilmenau
M7 LTCC-Ag System for 5G Applications
Chao Ma, Ferro Corp.
CICMT Session: Material Processing and Device Manufacturing (II)
These Session authors will be a part of the LIVE Authors Roundtable with Q&A on Thursday, 1:30PM - 2:15PM Eastern
Chair: Soshu Kirihara, Joining and Welding Research Institute Osaka University
Implementation of SiCer Technology for Pressure Sensor Applicationsns
Cathleen Kleinholz, TU Ilmenau
Ultraprecise printing of micrometric conductive structures for MEMS packaging and integration
Lukasz Kosior, XTPL SA (Piotr Kowalczewski)
Embedded-Die Packaging and Package-to-Flex Remateable Interconnections
Pulugurtha Markondeya Raj, Florida International University
APEPS | Advanced Power Electronics Packaging Symposium
General Chair:
Prof. Douglas C Hopkins, Ph. D
NCSU Packaging Research in Electronic Energy Systems (PREES)
Technical Program Co-Chairs:
Prof. Patrick McCluskey, University of Maryland
Steering Committee:
John Bultitude, KEMET Electronics;
Benson Chan, Binghamton University;
Bob Conner, X-Celeprint;
Rick Eddins, GE Aviation US;
Mike McKeown, Hesse Mechatronics;
Jason Rouse, Corning;
Brian Rowden, Oak Ridge National Lab
Smart Ultrasonic Welding - A Versatile Interconnection Technology For Power Electronics Packaging
Matthias Hunstig, Hesse Mechatronics
Material System Solutions for Power Module Assembly
Habib Mustain, Heraeus Electronics
Thermal Performance Comparison of DBC and ERCD for Single- and Double-Sided Power Modules
Tzu-Hsuan Cheng, Douglas C. Hopkins, North Carolina State University
Shrinking Power Electronics Using Quilt Packaging
Robert J. Engelhardt Jr., Indiana Integrated Circuits LLC
A 1200V/650V/160A SiC+ Si IGBT 3-Level T-type NPC Power Module with Optimized Loop Inductance
Asif Imran Emon, Zhao Yuan, Amol Deshpande and Fang Luo
Power Electronics Application Trends and Reliability-Enhancing Material Technology
Joe Hertline, Indium Corporation
Study of Al Wire Bonds to understand cross-talk and current carrying capacity in WBG Power Module Design
Utkarsh Mehrotra, Adam Morgan, Douglas C. Hopkins, North Carolina State University
Chip Scale Power Transistor Packaging
Shaun Bowers, Amkor Technology, Inc.
Power Packaging Trends in Emerging 48V Ecosystem
Ajay Kumar Sattu, Amkor Technology, Inc.
Design of Subsystem Module Package for Power Distribution Network
HoJeong Lim, Amkor Technology, Inc. (Ruben Fuentes)
Investigation of Carbon Fiber TIM Gap Pad for Enabling Next Generation Automotive High-Power Systems
Jerry Wu, Dexerials America Corp.
Multi-Level Bridge Tapped Resonant Converter: A Pathway to High Power Density SSTs and its Packaging Challenges
Pritam Das, ECE SUNY Binghamton