Technology Crossover | HiTEC, CICMT, APEPS


One online event + One registration = 

Three times the content, networking, and education!

   Registration   Program & Agenda   On-Demand Tech. Presentations Catalog   Speaker Planning   Corporate Partner Info 





 LIVE April 26 - 29, 2021 | Access to Virtual Conference Portal through June 1, 2021


Three star IMAPS conferences will align virtually in 2021 for an incredible attendee experience. The forces behind the International Conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect & Ceramic Microsystems Technologies (CICMT), and Advanced Power Electronics Packaging (APEPS) have joined for a special crossover technology extravaganza! 

           TRIPLE CONFERENCE FEATURES!           


 HiTEC (High Temp Elec)         CICMT (Ceramics)        APEPS (Pwr Pkging)

      Three Days of LIVE Joint Plenary Sessions
Over 50 recorded Technical Presentations On-Demand
Access to recordings of ALL LIVE content
 Available for replay for a full month! 

 + PLUS +

Separate Breakout Session in Each Crossover Area with...
LIVE Keynote & Invited Speakers
LIVE Author Roundtables for Audience Q&A to compliment the Technical Presentations 

LIVE Speakers for:
High Temperature Electronics


Plenary Speakers: 

John Bultitude

Aris Christou 

Michael Hamilton 

Keynote Speakers: 

Matt Francis

Alex Teverosky 

David Esler 

Holger Kappert 

Philip Neudeck

Invited Speakers: 

Piers Tremlett

LIVE Speakers for:
Ceramic Interconnect & Ceramic Microsystems Technologies


Plenary Speakers: 

Jens Müller 

Heli Jantunen 

Akihiko Sakamoto

Keynote Speakers: 

Rana Alizadeh

Ammar Kouki

Joerg Toepfer

Shweta Agarwala 

Mr. Yamashita 

Jing Guo 

LIVE Speakers for: 
Advanced Power Electronics Packaging


Plenary Speakers: 

Bob Conner 

Pulugurtha Markondeya Raj 

Fang Luo

Keynote Speakers: 

Brian Zahnstecher 

Cian O'Mathuna

Raymond Fillion

Invited Speakers: 

Christian Uhrenfeldt

Matthias Hunstig

Doug Hopkins


 LIVE Authors Roundtables with Q&A to complement the On-Demand Technical Presentations! 






 Monday, April 27 

Access to recorded Technical Presentations On-Demand opens! 

Take note of any questions you may have and bring them to the Authors Roundtables over the next few days


 Tuesday, April 27 


3 LIVE Plenary Speakers
LIVE Keynote Speakers

LIVE Invited Speaker
5 Author's Roundtable 
Sessions with LIVE Q&A
On-Demand Technical Sessions


 Wednesday, April 28 


LIVE Plenary Speakers
LIVE Keynote Speakers

LIVE Invited Speaker
4 Author's Roundtable 
Sessions with LIVE Q&A
On-Demand Technical Sessions


 Thursday, April 29 

LIVE Plenary Speakers
LIVE Keynote Speakers

LIVE Invited Speakers
1 Author's Roundtable 
Sessions with LIVE Q&A
On-Demand Technical Sessions




Register Here


Come for one, come for all! 

Each attendee registration includes joint access to all three technical conference programs.

Member, Non-member, Speaker/Chair, Student, and Early Career conference registration fees include:

  • Access to all live and on-demand keynotes, Author Round Rooms with Q&A and featured content beginning on April 26, 2021 for one (1) person.
    • All live content will be recorded and accessible through the Virtual Conference Portal until June 1, 2021.
  • One (1) download of the Crossover Proceedings.
    • Including full proceedings papers from the HiTEC Conference and from CICMT and APEPS (pending author submission) 
    • Proceedings delivered as a downloadable link to your registration email no later than May 20, 2021. 
  • IMAPS individual membership extension or membership renewal valid through one year from the registration date.
    *Does not apply to corporate or affiliate memberships
    *Does not apply to corporate or affiliate memberships





We invite organizations to join us for a reimagined Corporate Partnership experience.

Corporate Partners of the Technology Crossover event will enjoy exposure, advertising, and attendee connection opportunities relevant to the virtual atmosphere. Maintain or build your organization‘s presence, credibility, branding, and product/company updates with a creative suite of value-adding opportunities.

View the Partnership Guide for exposure opportunities, pricing and benefits details! 

The Technology Crossover Extravaganza (HiTEC, CICMT, APEPS) will NOT feature a virtual exhibit hall or virtual booths. 


EMA Design Automation



3D Incites

Semiconductor Packaging News