Technology Crossover | CICMT - HiTEC - Power Pkg

IMPORTANT EVENT NOTICE: 
The Technology Crossover 2021 will now be delivered virtually! IMAPS is welcoming the news of this change with an extended abstract submission deadline of January 13th. Corporate partnership opportunities will be shared soon. Click here to learn more about this change.


One online event

One registration  

Three times the content, networking, and education!

SUBMIT ABSTRACTS

 

Three International Conferences in One Place

Three star IMAPS conferences will align in 2021 for an incredible attendee experience. The forces behind the International Conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect & Ceramic Microsystems Technologies (CICMT), and Advanced Power Electronics Packaging (APEPS) have joined for a special crossover technology extravaganza. These three major events will be hosted simultaneously from April 26th-29th.

Come for one or come for all!

 

Each attendee registration includes joint access to all three conference technical programs, plus joint exhibition hall and networking activities for one low price.

LAST CALL FOR ABSTRACTS - NOW DUE: JANUARY 13, 2021

Sponsors and Exhibitors

 

Sponsorship partners can choose from function sponsorships, single-conference sponsorships, or a premier multi-conference level of exposure. More information about the virtual sponsorship opportunities will be released in January.