Technology Crossover | CICMT - HiTEC - Power Pkg
IMPORTANT EVENT NOTICE:
The Technology Crossover 2021 will now be delivered virtually! IMAPS is welcoming the news of this change with an extended abstract submission deadline of January 13th. Corporate partnership opportunities will be shared soon. Click here to learn more about this change.
One online event
Three times the content, networking, and education!
Three International Conferences in One Place
Three star IMAPS conferences will align in 2021 for an incredible attendee experience. The forces behind the International Conferences on High Temperature Electronics (HiTEC), Ceramic Interconnect & Ceramic Microsystems Technologies (CICMT), and Advanced Power Electronics Packaging (APEPS) have joined for a special crossover technology extravaganza. These three major events will be hosted simultaneously from April 26th-29th.