Technology Crossover - Thermal
Prof. Douglas C Hopkins, Ph. D
NCSU Packaging Research in Electronic Energy Systems (PREES)
Abstract Deadline Now: FEBRUARY 21
One of IMAPS longest-running annual events, the Thermal event has been upgraded to conference status in 2020!
Organized annually by IMAPS since 1992 in Workshop format, the Thermal conference specifically addresses current market needs and corresponding technical developments for electronics thermal management. Presentations on leading-edge developments in thermal management components, materials, and systems solutions for effectively dissipating heat from microelectronic devices and systems are sought from industry and academia. The Workshop emphasizes practical, high-performance solutions that target current and evolving requirements in mobile, computing, telecom, power electronics, military, and aerospace systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on their novelty and innovative contributions to the industry knowledge.
Thermal & Power Solutions 2020 Conference Program
Abstracts have been solicited from the following areas:
- Market Drivers: Understanding thermal challenges and business / economic drivers that influence change in electronic systems design and manufacturing and how these impact thermal design requirements. Developing market trends, market segmentation, cost drivers and reliability factors are examples of topics that set the framework for where and what types of new technical solutions are viable.
- Multi-Die Packaging: Advanced packaging technologies, such as System-In-Package, Multi-Chip Module and Multi-Package Module, stacked-die, etc. provide significant opportunities for miniaturization and performance enhancements. These technologies also can introduce significant thermal and interconnect challenges that must be balanced against those benefits.
- Mobile and Handheld Devices and the Internet-of-Things (IoT): Wearables, mobile and medical devices, small displays, tablets and notebooks are increasingly critical for our interconnected world. These devices often introduce unique component- and system-level thermal management challenges that require novel design approaches and materials.
- Wireless and Telecom Infrastructure: High performance telecom hardware have challenging component and system level requirements that require technical advances to meet the evolving needs for routers, networked systems, base stations, etc.
- Power Semiconductor Thermal Components, Systems, and Solutions: Developments in IGBT thermal management and packaging strongly influence advances in electronic and electrical drive systems. These advances are increasingly important in the Electric Vehicle/Hybrid Electric Vehicle and renewable energy markets.
- Mil/Aerospace: Emerging military and aerospace systems, including avionics, RF, and microwave components and modules for phased array radar, countermeasures, and other systems, require advanced thermal management as well as high-temperature materials and packaging.
- System-Level Cooling: The thermal design of complex systems, such as high-performance computing systems, relies on extensive component- and system-level thermal management analysis to address the broad spectrum of issues that entail a comprehensive system design.
- Data Center Cooling: Data center cooling includes a variety of design optimization activities including cooling provisioning, airflow control, temperature distribution and migration paths that range from forced air convection to system liquid cooling.
- Liquid cooling, Phase-change, and Refrigeration: Advanced cooling methods that use liquid, latent heat and/or active cooling provide opportunities for enhanced performance and design flexibility. Effective designs must balance these advantages against factors including life-cycle cost, reliability and serviceability impact.
- Thermal Interface Materials (TIMs) and Testing: Advanced thermal interface materials that may include organic, metallic, graphitic materials in bulk form as well as nanoscale are enabling significant advances in the thermal management of high-performance processors, memory, telecom, IGBT, RF, and microwave components and systems. Effective testing and reliability methods and standards are critical in determining the suitability of a TIM for a given application.
- CTE-Matching and High Thermal Conductivity Materials: Metallic, ceramic and composite materials have been engineered to exhibit excellent thermal conductivity with controlled coefficient of thermal expansion (CTE) properties to allow for better matching with GaN, SiC, silicon or ceramic materials to reduce thermal stresses in component packaging.
Abstract Deadline Now: FEBRUARY 21