Technology Crossover - HiTEC

HiTEC Sponsor:

 

 

General Co-Chairs:
F. Patrick McCluskey, University of Maryland 
mcclupa@calce.umd.edu

Colin Johnston, Oxford University 
colin.johnston@materials.ox.ac.uk

Organizing Committee:
Liangyu Chen, OAI/NASA GRC
Holger Kappert, Fraunhofer IMS
Randy Normann, Perma Works

SUBMIT ABSTRACTS
Abstract Deadline Now: FEBRUARY 21
HiTEC 2020 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics Assembly and Packaging Society, HiTEC 2020 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.



HiTEC 2020 Conference Program

SUBMIT ABSTRACTS
Abstract Deadline Now: FEBRUARY 21

 

Papers will be presented on, but not limited to, the following subjects:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
Packaging:
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal
management

Circuits:
- Analog
- Digital

- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
Passives:
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
Reliability:
- Failure
mechanisms
- Experimental and
modeling results