Technical WebinarSeries: 9December


IMAPS Live Technical Webinar Series 



Speaker Joe Hertline of Indium Corporation

December 9th | 12:00-12:45pm Eastern | MS Teams


As the industry continues to embrace electrification, especially in automotive power modules and RF communication, a number of design challenges are emerging that impact the critical reliability performance for the final product. Uniform bondline thickness within assembly solder joints has a direct link to reliability, as an uneven bondline can result in early cracking and solder layer delamination. In Power Electronics: Improve Bondline Control & Reliability with a Reinforced Matrix Solder Solution, Hertline will examine how InFORMS®, a reinforced matrix solder composite preform, delivers uniform bondline control with superior mechanical strength, enhancing reliability by a factor of 2X while achieving the lowest cost of ownership.

Speaker: Joseph Hertline
Hertline is the Product Manager for Engineered Solder Materials focusing on Power Electronics applications. He is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. Prior to joining Indium Corporation in the spring of 2020, Hertline spent more than 10 years as an engineer and product manager in the electronics industry. Most recently, he was focused on developing and supporting tactical radio communications products.

Registration Details:
Registration is FREE for IMAPS members, including student members.
Non-member registration is $50.

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This webinar will be hosted via MS Teams. Registrants will receive an email prior to the start of the webinar with login instructions.