Technical Webinar Series: June 17


IMAPS Live Technical Webinar Series 



Speaker John Park, Cadence Design Systems

Wednesday, June 17, 2020 | 12:00pm – 12:45pm EASTERN | MS Teams


This webinar was recorded. IMAPS members can access the speaker presentation slides below, and request that the archived webinar recording be sent to you.

Click here to download John Park's presentation slides.

Click here to request the webinar recording (MP4).



Semiconductor foundries are accelerating their offerings for advanced packaging. This sea change in the advanced packaging market brings several important new solutions to the industry as well as significant design and analysis challenges for the packaging engineer. Many packaging professionals are becoming aware that the typical design flows used today for BGA packages have gaping holes when targeting the newer 2.5D-/3D-IC packaging technologies.  Get an overview of the trends and advancements for foundry-based 2.5D-IC, 3D-IC, and FOWLP solutions. Learn about the challenges  and benefits of the modernized design flow for foundry-based packaging.

Speaker: John Park
John Park brings over 35 years of design and EDA experience to his role as Product Management Director for Advanced Semiconductor Packaging at Cadence Design Systems. In this role, John leads a team responsible for defining cross-domain solutions and methodologies for IC, package & PCB co-design and analysis.