Technical Webinar Series: 1July
IMAPS Live Technical Webinar Series
CHIP-TO-CHIP INTEGRATION FOR HIGH BANDWIDTH MEMORY PROCESSOR INTERFACE
Wednesday, July 1, 2020 | 12:00pm – 12:45pm EASTERN | Webex
This webinar was recorded. IMAPS members can access the speaker presentation slides below, and request that the archived webinar recording be sent to you.
Click here to download Andy Heinig's presentation slides.
Click here to request the webinar recording (MP4).
Andy Heinig has been working at Fraunhofer since 2007. Currently, he is the head of the department efficient electronics. In this position, he leads national and international research projects in the field of advanced packaging and 2.5, 3D-integrated circuits. His research interests concern layout automation for 2.5/3D-integration of circuits, algorithms for pathfinding in 3D-systems and modelling of physical effects in the range of advanced packaging. Moreover, he acts as person responsible in different standardization organizations, e.g. the Si2 working group Chip-package-codesign.