Technical Webinar Series: 16Sept

 

IMAPS Live Technical Webinar Series 

 

ADVANCED HIGH DENSITY RIGID PACKAGING SUBSTRATES FOR RF AND MINIATURIZATION

Speaker Daniel Schulze, DYCONEX AG


October 28th | 12:00-12:45pm Eastern | MS Teams

 

This webinar presentation focuses on advanced rigid multilayer substrates comprised of high density ultra-thin build-ups using a material set with excellent RF properties for applications up to 60 GHz. The material offers low loss dielectric properties combined with a low thermal expansion coefficient and high dielectric strength, making it particularly suitable for miniaturized RF chip packaging for various fields of applications. On the basis of a demonstrator module, the functionality increase with this material combined with state-of-the-art manufacturing and testing processes will be shown. The discussion will cover features like enhanced resolution, vias, wire bond pitch, flip chip pitch, RF design, and predictable reliability.


Speaker: Daniel Shulze
Application Development Manager, DYCONEX AG, an MST company
Daniel Schulze has studied at the Technical University of Dresden and holds a diploma in electrical engineering. During his diploma thesis and an internship at the Georgia Tech Packaging Research Center, he got involved with working on optical waveguides embedded in PCBs. In 2005, he began as product engineer at DYCONEX AG. Since 2008, he has been an engineering manager at DYCONEX and is responsible for the product development of PCBs used in medical imaging, hearing aids, cochlear implants, industrial, and HF applications.






Registration Details:
Registration is FREE for IMAPS members, including student members.
Non-member registration is $50.

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This webinar will be hosted via MS Teams. Registrants will receive an email prior to the start of the webinar with login instructions.