Symposium Technical Speakers


TECHNICAL PRESENTATIONS

 

Over 75 technical presentations across 5 tracks and 17 session categories will be available for on-demand viewing beginning on October 6th. Posters will also be available for on-demand viewing, complemented by a live Q&A session on Thursday, October 8th. View the speakers and titles below!

SiP/SiM/CPI (System Solutions)

Track Chairs:
Kim Yess, Brewer Science; Suresh Jayaraman, Amkor Technology


Technical Committee:
Dev Balaraman, Wolfspeed; Karthik Dhandapani, Qualcomm; Lei Fu, AMD; Santosh Kudtarkar, Analog Devices; 
Fang Luo, University of Arkansas; Tarak Railkar, Qorvo; Urmi Ray, Consultant


SiP/SiM/CPI 

System in Package Landscape:  2020 & Beyond
Vaibhav Trivedi, Yole Development


Solder Joint Reliability Modeling of WLP and FOWLP with Crack Path Evaluation Method under Thermal Cycling
Dae-Suk Kim, Qualcomm (Karthikeyan Dhandapani)


Thermal Improvement in 3D Embedded Modules Quantified Using Copper Bar Vias
Manoj Kakade, Psemi (Mumtaz Bora)



Lithium Battery Cell Level Fusing with Aluminum Heavy Wire Bonds
Utkarsh Mehrotra, North Carolina State University (Arthur Brazzle, Douglas Hopkins, North Carolina State University; Michael McKeown, Hesse Mechatronics)


Modeling Methodology to Quantify Impact of Package Delamination on  Performance of High-Side Smart Power Switch Design
Min Chu, Texas Instruments, Inc. (Jie Chen, Abidur Rahman, Rajen Murugan)


Design Tools and Flows for the Chiplet Generation
John Park, Cadence Design Systems


Construction Kit of RF-Blocks in Package Technologies
Andy Heinig, Fraunhofer IIS/EAS


Electroplated High Performance EMI Shielding
Mustafa Oezkoek, Atotech Deutschland GmbH (Eckart Klusmann, Kuldip Johal)


Advanced No-clean Solder Paste for SIP Applications 
Santosh Kumar Rath, Heraeus Materials Singapore Pte. Ltd. ( Yam Lip Huei, Sylvia Sutino, Chieng Yu Yuan, Senthil Kumar Balasubramanian, Yee Ting Lo, Joel Agala, HanWen Zhang, Li-San Chan, Sungsig Kang; Sebastian Fritzsche, Heraeus Deutschland GmbH & Co. KG)

Invited Session: Heterogenous Integration Roadmap
Chair: Urmi Ray, iNEMI

HIR Overview and HIR Roadmap highlights
William Chen, ASE


5G Communications Chapter
Tim Lee, Boeing


Integrated Power Electronics Chapter
Patrick McCluskey, Univ of Maryland

Photonics Heterointegration
Amr Helmy, University of Toronto 


Supply Chain Chapter
Tom Salmon, SEMI



Wafer Level/Panel Level (Advanced RDL)

Track Chairs:
Beth Keser, Intel; Rey Alvarado, Qualcomm


Technical Committee:

Keith Best, Onto Innovation; Tong Cui, C&B Tech; Farhad Kiaei, Dupont; Masao TomikawaToray Research Center


Advanced Packaging Technologies for High Performance Compute
Session Chairs: 
Keith Best, Onto Innovation; Masao Tomikawa, Toray Research Center


Heterogeneous System-In-Package (HSIP) Technology
Charles Woychik, i3 Microsystems, Inc. (Robert Nead, Justin Borski)


Chip-Last, RDL-First, Fan-Out Panel-Level Packaging for Heterogeneous Integration
John Lau, Unimicron Technology Corp. (Cheng-Ta Ko, Tony Peng, Henry Yang, Tim Xia, Bruce Lin, JJ Chen)



Advances in Process, Materials, and Tools for FO-W/PLP
Session Chairs: 
Tong Cui, C&B Tech; Farhad Kiaei, HD Microsystems


Latest Technology of Epoxy Molding Compound (EMC) for FO-WLP
Masahiro Iwai, Sumitomo Bakelite Co.,Ltd.


6-Side Molded Panel-Level Chip Scale Package with Multiple Diced Wafers
John Lau, Unimicron Technology Corp. (Cheng-Ta Ko, Tzvy-Jang Tseng, Tony Peng, Henry Yang, Tim Xia, Bruce Lin)


High Frequency Dielectric Properties of Low Dk, Df Polyimides
Masao Tomikawa, Toray Research Center          




High Performance - High Reliability

Track Chairs:
Erica Folk, Northrop Grumman; Ivan Ndip, Fraunhofer IZM

Technical Committee:

Ken Kuang, Torrey Hills Tech.; Tim LeClairCerapax; Urmi Ray, Consultant; Zhenzhen Shen, Facebook; Konstantin Yamnitskiy, Intel


Invited Session: Co-Design
Session Chairs: Ivan Ndip, Fraunhofer IZM; Urmi Ray, INEMI

2.5D and 3D Polylithic Integration Technologies for Next Generation ICs
Muhannad Bakir, Georgia Tech

Co-designing/analyzing chip(let), package & board systems
John Park, Cadence Design Systems

Electrical and Photonic Networks for 2.5D Integrated Systems
Ajay Joshi, Boston University

Evaluation of System In Package implementation options in the chiplet world
Steven Watt, Zuken USA

Inductive-Coupling Wireless Bus Interface for Shape-Changeable Chiplet-Based Computers
Junichiro Kadomoto, University of Tokyo


Session Sponsored by:


MRSI Mycronic

Defense and Harsh Environment


Detecting a Security Breach and Pinpointing its Source
David Huntley, PDF Solutions

Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties
Jong Gi Lee, Samsung Electronics (Jin Soo Bae, Yeo-Hoon Yoon, Jun-Ho Lee, Kang-Young Cho)

             
Atomic Layer Deposition (ALD) conformal coating for robust and reliable protection of electronics and components in harsh environments
Rakesh Kumar, Specialty Coating Systems (Sawada Shuichi)    

                                                                                                                                                                              

Session Sponsored by:


Torrey Hills Technologies

RF and Power


Electromigration in Power Devices
Hao Zhuang, Infineon Technologies (Robert Bauer, Markus Dinkel)

             
AE Monitoring of Fatigue Damage of Al Ribbon Bonding for Power Electronic Devices During Power Cycling Test              
Katsuaki Suganuma, Osaka University (Chanyang Choe, Chuantong Chen)


Enhancement of ESD Performances of Silicon Capacitors for RFID Solutions
Sebastien Jacqueline, Murata (Catherine Bunel, Laurent Lengignon)


Wireless Sensor Platform for Nanosensor Interface Electronics
Bruce Kim, City University of New York


Reliability Modeling, Simulation and Testing

             
Reliability Simulation of Cu/Polymer interface in Fan-out Wafer Level Packaging
Yuji Okada, ASAHI KASEI Corporation (Atsushi Fujii, Yoshiharu Kariya, Kenta Ono)


Acceleration Factors and Life Predictions
Greg Caswell, ANSYS, Inc. (Chris South)





Advanced Packaging (Flip Chip/2.5D/3D/Optical)

Track Chairs:
Sandeep Sane, Intel; Frank Eberle, Northrop Grumman; Jaimal Williamson, Texas Instruments


Technical Committee:

Manish Dubey, Intel; Dan Krueger, Honeywell; Shubhada Sahasrabudhe, Intel; Tolga Tekin, Fraunhofer IZM; Jim Will, Micross


Flip Chip


Advanced Die-Beam alignment method for Laser-Assisted Bonding  
Wagno Alves Braganca Jr., JCET STATSChipPAC Korea (KyungOe Kim)


Characterization of sintered Cu Nanopaste for micro-bumping with Injection Molded Solder Technology
Toyohiro Aoki, IBM Research Tokyo (Eiji Nakamura, Sayuri Kohara, Chinami Marushima, Kuniaki Sueoka, Takashi Hisada, Ryota Yamaguchi)


Simulation and Experimental Study on IMS (Injection Molded Solder) Bumping with Expanded Resist Patterning for Reinforcement of Fine-pitch Capability
Risa Miyazawa, IBM Research Tokyo (Eiji Nakamura, Toyohiro Aoki, Chinami Marushima, Takashi Hisada)


Ultra-low residue Flux Application in RF Front End Package
Leo Hu, Indium Corporation

Heterogenous Integration & 3D


A Novel Approach to Mitigate Stress Induced Defects at Metal-Dielectric Interface in RDL for 3D IC Stacking
Amit Kumar, Bridging the Innovation Development Gap (BRIDG)       (Jose Chacon, Peter Gelzinis)


Hybrid Bonding of Via-middle TSV Wafer Fabricated Using Direct Si/Cu Grinding, Residual Metal Removal, CVD and CMP
Naoya Watanabe, AIST (Hiroshi Yamamoto, Takahiko Mitsui, Eiichi Yamamoto)


Evaluating Thermoset Resin Substrates for 3D Mechatronic Integrated Devices and Packaging
Felix Haeussler, Institute for Factory Automation and Production Systems (Simon Petillon, Johannes Dornheim, Shengxia Shen, Wolfgang Eberhardt, André Zimmermann, Jörg Franke)


Challenges in Placement Requirements for System in Package Integration
Chan Pin Chong, Kulicke & Soffa


DuPont(TM) GreenTape(TM) LTCC Materials for Wireless Electronic Devices
Brian Laughlin, DuPont Microcircuit Materials (Mark Easton, Kaylan Rapolu, Ken Souders, ChunAn Lu)


Ultra-thin Flip Chip Assembly for Heterogenous and Hybrid Integration
Douglas Hackler, American Semiconductor, Inc.

Interconnect


Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity
Ikumoto Raihei, C.Uyemura & Co., Ltd.


Methods to Reduce the Hierarchy of Interconnections in Electronic System
Dyi-Chung Hu, SiPlus Co.


Printed Interconnects & RF Devices for High Frequency Applications
Bryan Germann, Optomec


Parameter Optimization for Unstable Pin Bonding
Henri Seppanen, Kulicke & Soffa


Session Sponsored by:


MRSI Mycronic

Optical


Optimizing Package Yield and Reliability with X-ray Inspection
Sudhakar Raman, SVXR, Inc. (Michael Kwan, Rhiannon Brooks, Andrew Reid, Fred Duewer)



Optical Data Link Module for Data Transmission in Smart Catheters
Jian Li, Delft University of Technology (Vincent Henneken, Marcus Louwerse, Ronald Dekker)


Control of Advanced Packaging by Improved Optical Profiler Metrology           
Samuel Lesko, Bruker





Advanced Process & Materials (Enabling Technologies)

Track Chairs:

Benson Chan, Binghamton University; Mark Hoffmeyer, IBM

Technical Committee:

Doug Shelton, Canon; Kevin Demartini, DuPont; Jeff Gotro, Innocentrix; Douglas C Hopkins, NCSU; 
Michael McKeown, Hesse Mechatronics; Sylvain Pharand, IBM; Martin Schneider-Ramelow, Fraunhofer IZM; 
Aric  Shorey, Mosaic Microsystems; Gregg Berube, Heraeus Electronics Americas


Additive Manufacturing


Electroless Plating with UV Modification for Thermosetting Dielectric and Decay Suppression of High Frequency Transmission Property
Masaya Toba, Showa Denko Materials Co., Ltd. (Kazuyuki Mitsukura, Masaki Yamaguchi)


Packaging Issues and Solutions for Ultra-Low Power, High Efficiency GaN micro-LEDs for Battery Free, Sub-mm2, Smart IoT Systems
Frank Libsch, IBM T.J. Watson Research Center (Steve Bedell, Bucknell Webb, Arun Paidimarri)


A Novel Method for Characterization of Ultra Low Viscosity NCF Layers Using TCB for 3D Assembly
Giovanni Capuz, IMEC (Melina Lofrano, Carine Gerets, Fabrice Duval, Pieter Bex, Jaber Derakhshandeh, Alain Phommahaxay)

Advanced Substrates


Thin Glass Handling Solutions for Microelectronics Packaging
Aric Shorey, Mosaic Microsystems (Shelby Nelson, David Levy, Paul Ballentine)


Plasma Surface Engineering: An Enabling Technology Designed to Clean and Protect Printed Circuit Boards
Daphne Pappas, Plasmatreat USA (Sebastian Guist, Dhia Ben Salem, Plasmatreat GmbH)


Advanced Low Df Dry film Build-up Material on Glass Panel for 5G Application
Takenori Kakutani, TAIYO INK MFG. CO., LTD. (Zhong Guan, Yuya Suzuki, TAIYO INK MFG. CO., LTD.; Ali Muhammad, Serhat Erdogan, Atom Watanabe, Mohanalingam Kathaperumal, Madhavan Swaminathan, Georgia Institute of Technology)


Electrical Performance and Robustness of Ultrathin High-Density Carbon Nanofiber Capacitors on Silicon, Alumina and Glass Substrate Materials
Victor Marknäs, Smoltek AB (Vincent Desmaris, Amin M Saleem, Maria Bylund, Ricakrd Andersson, Elisa Passalacqua, Mohammed Shafiq Kabir)


Development of Dielectric Material Enabling Low Insertion Loss of Organic Substrates at Various Operational Temperatures
Tatsushi Hayashi, Sekisui Chemical Co., Ltd. (Watanabe Ryoichi, Lin Po Yu, Ichikawa Seiko)


Wire Bond & Advanced Interconnect


Cell Interconnections in Battery Packs Using Laser-assisted Ultrasonic Wire Bonding
Andreas Unger, Hesse Mechatronics (Matthias Hunstig, Michael Brökelmann, Dirk Siepe, Hans Hesse)


Evaluation of High Melting Point Lead-free Solder and Hybrid Sinter Paste as Attaching Material for Clip Bond Package
Fred Fuliang Le, Nexperia (Rinse van der Meulen, Yoon Kheong Leong, Manoj Balakrishnan, Zunyu Guan)


An Oxide Wear Model of Ultrasonic Bonding
Brandon van Gogh, Santa Clara University (Tioga Benner, Calvin Tszeng, Panthea Sepehrband, Santa Clara University; Henri Seppaenen, Kulicke & Soffa Industries, Inc.)


Wire Bonding: The Ultrasonic Bonding Mechanism
Lee Levine, Process Solutions Consulting


Wire-Bonding Reliability Evaluation
Hossein Akbari, Schlumberger


Control of Void Formation in Adhesively Bonded Joints in the Presence of Filler
Nina Dytiuk, Charles Stark Draper Laboratory, Inc.


Thermal


Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic Graphite
Riya Paul, University of Arkansas (Amol Deshpande, Fang Luo)


Novel TIM Solution with Chain Network Solder Composite
Ning-Cheng Lee, Indium Corporation (Runsheng Mao, Sihai Chen, Elaina Zito, Dave Bedner)



Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module
Tzu-Hsuan Cheng, NC State University (Utkarsh Mehrotra, Karan Maru, B. Jayant Baliiga, Subhashish Bhattacharya, Douglas Hopkins)


Increased System Performance in Mobile Electronics Utilizing Composites of High-Performance Insulation and Graphite
Mitchell Warren, W.L. Gore & Associates, Inc. (Julian Norley, John Allen, Jonathan Taylor, Lindsey Keen) 

    



Poster Presentations

Gate Driver Design in 1m SiC CMOS Process for Heterogeneous Integration Inside SiC Power Module
Affan Abbasi, University of Arkansas


Selective Laser Sintering of Glass-ceramic Bonds Using
a Defocussed ND:YAG Laser

Henry Lancashire, University College London
(Murawski Karol, Aristovich Kirill)


U.S.-China Trade War: The Tariff Effects on the Global OSAT Market       
Stephen Rothrock, ATREG, Inc.


The effect of Cu target pad roughness on the growth mode and void formation in electroless Cu films
Tobias Bernhard, Atotech Deutschland GmbH (Sebastian Zarwell, Edith Steinhäuser, Stefan Kempa, Frank Brüning)

Uptake Rate of Hydrogen Getter for Effectively Removing Outgassed H2  From Microelectronic Packages
Hua Xia, Hermetic Solutions Group (Jeffery Vriens, David DeWire)

High Heat Resistant Peelable Temporary Bonding Film and
New Debonding System with Xe Flash Light Irradiation

Yuta Akasu, Showa Denko Materials Co., Ltd. (Shogo Sobue,
Emi Miyazawa, Tetsuya Enomoto, Takashi Kawamori, Yasuyuki Oyama,
Ryoji Furutani, Yuki Nakamura)


Two-Layer Solder Resist Film with Low Young's Modulus for High Reliability
YingHsuan Chou, TAIYOINK MFG. CO.,LTD.
(Hidekazu Miyabe, Daichi Okamoto) 


New X-ray Tube Technologies for Advanced Imaging
Keith Bryant, KB Consulting


Optimizing Industrial Soldering Processes with Digital Twins
Keith Perrin, Hexagon Manufacturing


Advanced Micro-structural & Thermal Modeling for Energy Generating, Wearable, Electronics
Keith Perrin, Hexagon Manufacturing


Package-Friendly Al2O3 Passivation Development for Cost Effect
Cu Pad as Gold Replacement

Soojae Park, Samsung Electronics