Symposium Program


PROGRAM AT A GLANCE


IMAPS is pleased to announce the technical program for the IMAPS 2020: Always On virtual global event. Feature presentations and PDCs will be presented live! Technical presentations will be available on-demand. Posters will be available on-demand, with a live Q&A session to complement. Learn more below!

 

Friday, October 2nd

9:30am-11:30am Eastern

Professional Development Course
Separate registration fees required

Course B4:
Heterogeneous Integrations (SiPs)
John Lau, Unimicron Technology Corporation

Monday, October 5th

A special early access day! Log in early to enjoy a special selection of PDCs and swag giveaways from our exhibitors. 

11:00am-5:00pm Eastern

Pre-Show SWAG Day

One day only! Log-in ahead of the live programming for the opportunity to download swag from our sponsors and exhibitors. 

12:00pm-2:00pm Eastern

Professional Development Course
Separate registration fees required

Course A3:
5G/mmWave Package Development Requirements and Solutions
Urmi Ray, Consultant



2:00pm-4:00pm Eastern

Professional Development Course
Separate registration fees required

Course A4:
Polymers for Electronic Packaging
Jeffrey Gotro, InnoCentrix LLC

Tuesday, October 6th


10:00am-3:00pm Eastern

Virtual Exhibit Hall LIVE Show Hours

The virtual exhibit hall is available all hours of the day through the end of October. Connect with exhibitors live during these show hours via chat and/or face to face virtual meetings.

11:00am-11:30am Eastern

Opening Ceremonies and Symposium Welcome Message

11:30am-12:15pm Eastern

Keynote Presentation 

Advanced Packaging Architectures: Scaling for A Heterogeneous World

Babak Sabi
CVP and GM for Packaging, Assembly, and Test
Intel Corporation

Advanced Packaging Architectures are today widely acknowledged as being increasingly important to drive performance and cost improvements of microelectronics systems.  As a result, several innovative packaging architectures have been announced in recent years.  On-package integration provides a compact, power efficient platform for Heterogeneous Integration of diverse IP that support faster time to market and cost/yield benefits.  In this talk, I will describe current technology envelopes and future scaling directions for representative advanced packaging architectures. Key areas of focus will be (1) interconnect scaling, (2) power efficient high bandwidth signaling, (3) cost-optimized cooling and (4) advanced power delivery technologies.  The talk will conclude with a call for broad collaboration across industry and academia in multiple areas including technology R&D, design, standardization and supply chain development.  

Sponsored by:

12:15pm-1:00pm Eastern

Keynote Presentation 


Chiplets: Why AMD is Utilizing Chiplets, Some of the Challenges, and Where They May Take Us

Bryan Black
Senior Fellow
AMD

Recently AMD introduced the EPYC™ server solutions which utilize Chiplets to improve performance, cost, and power.  This talk will explore why AMD started using Chiplets, highlight some of the challenges, and wrap up with a discussion on where Chiplets may go and the technologies that will be required to implement future Chiplet based products. 

Sponsored by:

1:30pm-2:30pm Eastern

"One Year Later - What's Changed in 2020"
Moderator: Priya Mukundhan, Onto Innovation

A roundtable discussion hosted by the IMAPS Diversity and Inclusion Committee

Join Priya Mukundhan of Onto Innovation for a roundtable discussion with attendees and key conversationalists about how the events of 2020 have changed the diversity and inclusion landscape in the industry.

This session will be conducted via Zoom. Attendees are encouraged to participate in this discussion. No session pre-registration required! 

Sponsored by:

3:00pm-4:30pm Eastern

Panel Session:
The Future Advanced Packaging Ecosystem: Who Will Be in the Driver's Seat?

Jan Vardaman

Chair and Moderator:
E. Jan Vardaman, President, TechSearch International, Inc.

Panelists:
Koushik Banerjee, Intel Corp.
Dan Berger, GLOBALFOUNDRIES
Eelco Bergman, ASE
Mike Kelly, Amkor Technology
Khai Nguyen, NVIDIA
Craig Orr, Samsung
Ashkan Seyedi, HPE

As the industry moves to the next silicon nodes, new advanced semiconductor packaging developments are enabling the economic gains that were previously achieved with monolithic silicon scaling.  Co-design of IC and package becomes increasingly important.   The foundry plays an increasingly important role.  Development of a healthy eco-system is critical to providing solutions to meet our industry needs.  This panel will discuss the eco-system, challenges the industry faces, and the roles for the players.

Sponsored by:



Wednesday, October 7th


10:00am-3:00pm Eastern

Virtual Exhibit Hall LIVE Show Hours

The virtual exhibit hall is available all hours of the day through the end of October. Connect with exhibitors live during these show hours via chat and/or face to face virtual meetings.

11:00am-12:00pm Eastern

Keynote Presentation

Packaging Enabling Tomorrow‘s Realities

Ron Ho
Director, Silicon Engineering
Facebook

Facebook‘s explorations into systems for virtual and augmented reality make clear the importance of not only customized silicon hardware, but also advances in silicon packaging. In this talk we will share a vision of AR/VR and some of the computation and architectural challenges posed by AR/VR workloads and constraints.

Sponsored by:

12:00pm-3:00pm Eastern

Fraunhofer IZM & Fraunhofer USA Featured Workshop on System Integration

A live session featuring 9 speaker presentations and Q&A session.
Click here for the full program.

This is a feature workshop included in full-symposium registrations! Separate registration is NOT required.

3:00pm-4:00pm Eastern

IMAPS Student-Industry Roundtable Discussion
An industry panel followed by a Q&A session for students breaking into the industry.

Join moderator Erica Folk of Northrop Grumman for an interactive discussion between industry leaders and students focused on taking the next steps into your professional career. Hear from early, mid-, and senior-level microelectronics industry professionals about what they’re looking for in new hires, how to succeed in the modern workforce, and what to expect as you progress to the next level. Come with questions and begin your networking journey!

Moderator: Erica Folk, Northrop Grumman
Panelists/Q&A Team:

Beth Keser, Intel
Mark Gerber, ASE Group
Mary Pickens, Novelis
Nicole Wongk, Honeywell
Jenny Shen, Facebook
Dan Krueger, Honeywell


Sponsored by:

Thursday, October 8th


10:00am-3:00pm Eastern

Virtual Exhibit Hall LIVE Show Hours

The virtual exhibit hall is available all hours of the day through the end of October. Connect with exhibitors live during these show hours via chat and/or face to face virtual meetings.

11:00am-12:00pm Eastern

Keynote Presentation 

Silicon Detector Configurations for Optimizing Lidar Systems

Martin Weigert
Vice President & General Manager
Broadcom Limited

Silicon is the ideal detector material for a 905nm based Lidar System. Scalability, reliability, manufacturing capacity and well known wafer processes are clear advantages compared to III-V materials. Depending on the Lidar System approach a CMOS APD line array or a two dimensional array are possible. An interesting alternative is to use SiPMs optimized for 905nm.

Sponsored by:

12:00pm-12:45pm Eastern

Keynote Presentation 

mmWave Antenna in Package Needs More than a Package

Jeff Pauza, Mustapha Slamani, and Selaka Bulumulla
GlobalFoundries

As the world moves towards increasing 5G mmwave connectivity, the need for cost-effective and power-efficient phased array antenna systems is amplified.  This challenge can be addressed by the advantages of antenna integrated packages (AIPs). In developing antenna integrated packages (AiP), some of the factors to consider are package material properties at mmwave frequencies, design rules, heat removal method and of course, the price. Less noticeable, but still significant factors are mmwave wafer level probing and over the air testing for antenna characterization and AiP production. This presentation will discuss these factors and more to provide those considering AiP with a checklist of topics. 

Sponsored by:

1:00pm-3:00pm Eastern

Professional Development Courses
Separate registration fees required

Course A8:
The Evolution of Flip Chip Package Technology
Mark Gerber, ASE US, Inc.




2:30pm-5:00pm Eastern

Interactive Poster Session

Click here for the poster presentation titles and speakers.
Each poster presenter will be live for 15-20 minutes to take questions during this time.

Sponsored by:


Hermetic Solutions Group

Friday, October 9th - Friday, October 30th

This show is "Always On!" Content is archived onto the event web portal for on-demand viewing through the entire month of October.


On-Demand

Virtual Exhibit Hall

All exhibits will continue to be available for viewing during the archived period through the end of October. View and download exhibitor materials, videos, documents, and more!

Live chat and face-to-face connections will not be available during the archive period.

On-Demand

All Symposium Presentations

All content presented during the live show dates will be available on-demand in the content library during the archived period through the end of November. Catch up on or re-watch your favorite keynote addresses, the panel session, and featured live content. 

Technical presentations will also remain available for on-demand viewing.

Professional development courses are live only and not available for replay after the course concludes.