IMAPS Academy Course - SELECTION CRITERIA OF SURFACE FINISHES FOR OPTIMUM PERFORMANCE & BETTER RELIABILITY OF NEXT GENERATION DEVICE PACKAGING / ELECTRONIC ASSEMBLIES (5G-mmWAVE-6G DEVICES)
Cost: $169 IMAPS Member, $229 Non-member, $49 IMAPS Student Member
Instructor: Kunal Shah
Format: 4 Chapters, ~30-minute Course Videos
Course Description:
The advent and ongoing evolution of internet-enabled mobile devices has continued to drive innovations in the manufacturing and design of technology capable of high-frequency/high-density electronic signal transfer especially for next generation device packaging-electronic assemblies. The combined requirements for both fast, always-on data transmission, and small geometric form-factors can be difficult to satisfy without compromised performance and signal loss.
Selection of materials used in PCB manufacturing is critical for optimum performance of the electronic assembly. Among the primary factors affecting the integrity of high frequency signals is the surface finish applied on PCB copper pads – a need commonly met by technology manufacturers through the electroless nickel immersion gold process, ENIG. However, a well-documented limitation of ENIG is its insertion loss due to the inferior conductivity of nickel over copper, leading to higher conductor losses. Additionally, nickel’s ferromagnetic properties adversely affect circuit performance. The result is an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper.
The selection criteria of surface finish for 5G-mmWave-6G, high frequency, HDI, RF-Microwave applications, etc. (next generation wafer level packaging/PCB technologies) involves minimal insertion loss, long shelf life, cost-effective and high reliability. There are few gold based options (EPIG, EPAG, DIG, etc.) available in the market and their pros and cons will be discussed. There are traditional surface finishes (ImmAg, ImmSn, OSP, etc.) will also be compared and evaluated for high frequency-next generation devices. Moreover, an innovative nickel-less approach involving a proprietary nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer has shown superior benefits over contemporaries. Evaluation of signal integrity, cost, shelf-life and reliability of electronic assemblies will be discussed in details.
For current IMAPS members: You will be prompted to sign-in with your member login credentials prior to completing your course registration. After registering, you will receive a confirmation email with your course details. To access your courses once registered and logged-in at www.imaps.org, use the IMAPS ACADEMY > Academy CLASSROOM link under QuickLinks. You will then see your purchased courses under MY COURSES. Once complete you can find your certificates and additional details through your Academy profile.
For non-members: BEFORE completing your IMAPS Academy registration, click ‘join’ at the top of the IMAPS Academy website. When prompted, please select IMAPS Academy User as your member type. Once your member registration is complete, you can register for IMAPS Academy courses. Please note - You will be prompted to sign-in with your new member login credentials prior to completing your course registration(s). After registering, you will receive a confirmation email with your course details. To access your courses once registered and logged-in at www.imaps.org, use the IMAPS ACADEMY > Academy CLASSROOM link under QuickLinks. You will then see your purchased courses under MY COURSES. Once complete you can find your certificates and additional details through your Academy profile.
After registering, you will receive a confirmation email with your course details. To access all of the courses you have registered for, log-in at www.imaps.org and use the IMAPS ACADEMY link under QuickLinks. You will then see your purchased courses under MY COURSES, and once complete you can find your certificates and additional details through your Academy profile.
