San Diego Chapter

IMAPS & ACerS Joint Chapters of San Diego

OUR MISSION: 

San Diego Joint Chapters

The objective of the San Diego Joint Chapters is to provide a continuing forum for its members to improve the understanding of ceramic material, hybrid microelectronics, and microelectronic packaging and to encourage the exchange and dissemination of pertinent information.  The San Diego Joint Chapters organizes periodic meetings and symposia oriented toward topics of interest to its membership, in these and related technologies.  In addition to the technology exchange, the San Diego Joint Chapters provides its members the opportunity to network with former and potential future colleagues.  It allows its members to stay abreast of activities outside of their current organizations.

MEET THE BOARD

Official Chapter Website
 

NEXT EVENT: 

Evolution of mmWave, Semiconductors, Antennae/interfaces, eWLB, to 60GHz BGA derives and more...

Presented by: Vubiq Networks, Mike Pettus, Founder & CTO

Thursday, January 23, 2020

12pm - 1pm

Abstract:

History review of raw die mmWave ICs to wafer scale BGA, and with some associated packaging and mmWave antennas/interfaces. Further review of flip chip, wire/ribbon bonding, to finally using eWLB packaged devices which enabled an all SMT approach at the system level. Evolution of early integrated antennas to 60 GHz BGA devices. Applications will be shown for point-to-point mmWave links, chipless RFID, and wireless data centers.

 

Register HERE for tickets

Members: $20

Non-members: $25

Students with ID: $10

Logistics:

Location:

EMD Performance Materials

6555 Nancy Ridge Drive Suite #200

San Diego, CA 92131

Previous Meetings
View our previous technical presentation topics and abstracts, and download presentations that our speakers have made available to our community.
 

2019 Technical Presentations:

• High Efficiency RF/Microwave Power Amplifiers and Transmitters for 5G Communication - Ophir RF, Ramon Beltran, PhD

• DLP 3D Printing for Biomedical Applications - Dr. Wei Zhu, Allegro 3D

• Lunch & Learn Speaker Session

2018 Technical Presentations:

• Precise Characterization of Multipin Connectors - Enow Tanjong

• Microscale Universal Sensor System (MUSS) - Dr. Visarath In

• Precise High-Thoroughput Underfill Dispense In Chip-On-Wafer Packaging - Hanzhuang “Hannah” Liang, PhD

• High-Frequency Characterization of Chip Package Substrates - Professor Ege Engin (SDSU Dept. of Electrical & Computer Engineering)

2017 Technical Presentations:

• CPI & CBI Risks to FOWLP - Mark Nakamoto, Qualcomm

• RDL Multilayer Metallization Approaches for Through Glass Via Technology - Dr. Rouppen Keusseyan, SAMTEC

• James Webb Space Telescope: Parts, Materials, and Processes - Dr. Michael Vernoy, Northrop Grumman Aerospace Systems

• Intellectual Property Rights - An Edge to Monetize - Kam Li, Procopio

  • Download a copy of the presentation HERE

2016 Technical Presentations:

• TWT to GaN: Material and Design Challenges in Electronic Packaging - Iris Labadie, Kyocera International

• Modern Powder Consolidation Techniques for Producing Structural and Functional Ceramics - SDSU Graduate/PhD Student Panel

• Teardowns of IoT and Wearable Devices - Bill Cardoso, Creative Electron, Inc.

• How to Start up and Grow Your Microelectronics & Packaging Business? - Ken Kuang, Torrey Hills Technologies

  • Download a copy of Ken's presentation HERE

• New Material Systems to Meet Next Generation Packaging Requirements - Roupen Keusseyan, Triton Microtechnologies

2015 Technical Presentations:

• Nanofabricated Electronic Components - Carl Edwards, Space Micro

• FOWLP Technology and Application Space - Beth Keser, Qualcomm

• Packaging Consideration in Next Generation Active Array Modules - Paul Garland, Kyocera America

• Feature Resolution Capability for Stencil Printed Transient Liquid Phase Sintering (TLPS) Paste Interconnect Structures - Catherine Shearer, Ormet

• Recent Advances in Thermally Conductive Polymers - Jeff Gotro, Innocentrix, LLC

• CMOS Power Amplifiers - The Next Big Thing - Jim Cable, Peregrine Semiconductor

• Trends in RF Reliability Assessment - Roland Shaw, Accel-RF

 
2014 Technical Presentations:

• Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly - Dr. Andy Mackie, Indium Corporation

• Glass as a Core Packaging Platform for Next Generation Electronic Devices - Tim Mobley, Triton Microtechnologies

  • Download a copy of Tim's presentation HERE

• SiP Innovation: IC Packaging for the Next Big Thing - Rich Rice, ASE

  • Download a copy of Rich's presentation HERE

• Polymer Challenges in 2.5D and 3D Packaging - Dr. Jeff Gotro, InnoCentrix, LLC

• Large-Area Maskless Fabrication: Laser Interference Patterning and Direct Digital Manufacturing - Dr. Dajun Yuan, Torrey Hills Technologies

2013 Technical Presentations:

• Trends in Mobile Industry and Impact on Packaging and Integration - Urmi Ray, Qualcomm

• Package Demonstration of an Interposer with Integrated TSVs and Flexible Compliant Interconnects - Ivan Shubin, Oracle Labs

• Silicon On Sapphire and its Applications for High Frequency Switches - Ronald E Reedy, Peregrine