San Diego Chapter
IMAPS & ACerS Joint Chapters of San Diego
OUR MISSION:
San Diego Joint Chapters
The objective of the San Diego Joint Chapters is to provide a continuing forum for its members to improve the understanding of ceramic material, hybrid microelectronics, and microelectronic packaging and to encourage the exchange and dissemination of pertinent information. The San Diego Joint Chapters organizes periodic meetings and symposia oriented toward topics of interest to its membership, in these and related technologies. In addition to the technology exchange, the San Diego Joint Chapters provides its members the opportunity to network with former and potential future colleagues. It allows its members to stay abreast of activities outside of their current organizations.
MEET THE BOARD
Chair Bill Ishii bill@imaps.org | Vice-Chair & Programs Stu Weinshanker stu@askapa.com | Secretary Jerry Aguirre, Ph.D. | Treasurer James Haley jashaley@mac.com | Publicity Chair Mumtaz Bora mbora@psemi.com |
Membership Chair Tong Cui soluda101@gmail.com | Student Chair Ege Engin, Ph.D. aengin@sdsu.edu | IMAPS Adviser Chair Bill Ishii bill@imaps.org | Past President Iris Labadie iris.labadie@ga.com | ACerS Advisor Chair Wally Johnson wjohnso5@san.rr.com |
NEXT EVENT:
Evolution of mmWave, Semiconductors, Antennae/interfaces, eWLB, to 60GHz BGA derives and more...
Presented by: Vubiq Networks, Mike Pettus, Founder & CTO
Thursday, January 23, 2020
12pm - 1pm
Abstract:
History review of raw die mmWave ICs to wafer scale BGA, and with some associated packaging and mmWave antennas/interfaces. Further review of flip chip, wire/ribbon bonding, to finally using eWLB packaged devices which enabled an all SMT approach at the system level. Evolution of early integrated antennas to 60 GHz BGA devices. Applications will be shown for point-to-point mmWave links, chipless RFID, and wireless data centers.
Register HERE for tickets
Members: $20
Non-members: $25
Students with ID: $10
Logistics:
Location:
EMD Performance Materials
6555 Nancy Ridge Drive Suite #200
San Diego, CA 92131
Previous Meetings
View our previous technical presentation topics and abstracts, and download presentations that our speakers have made available to our community.
2019 Technical Presentations:
High Efficiency RF/Microwave Power Amplifiers and Transmitters for 5G Communication - Ophir RF, Ramon Beltran, PhD
DLP 3D Printing for Biomedical Applications - Dr. Wei Zhu, Allegro 3D
Lunch & Learn Speaker Session
2018 Technical Presentations:
Precise Characterization of Multipin Connectors - Enow Tanjong
Microscale Universal Sensor System (MUSS) - Dr. Visarath In
Precise High-Thoroughput Underfill Dispense In Chip-On-Wafer Packaging - Hanzhuang “Hannah” Liang, PhD
High-Frequency Characterization of Chip Package Substrates - Professor Ege Engin (SDSU Dept. of Electrical & Computer Engineering)
2017 Technical Presentations:
CPI & CBI Risks to FOWLP - Mark Nakamoto, Qualcomm
RDL Multilayer Metallization Approaches for Through Glass Via Technology - Dr. Rouppen Keusseyan, SAMTEC
James Webb Space Telescope: Parts, Materials, and Processes - Dr. Michael Vernoy, Northrop Grumman Aerospace Systems
Intellectual Property Rights - An Edge to Monetize - Kam Li, Procopio
Download a copy of the presentation HERE
2016 Technical Presentations:
TWT to GaN: Material and Design Challenges in Electronic Packaging - Iris Labadie, Kyocera International
Modern Powder Consolidation Techniques for Producing Structural and Functional Ceramics - SDSU Graduate/PhD Student Panel
Teardowns of IoT and Wearable Devices - Bill Cardoso, Creative Electron, Inc.
How to Start up and Grow Your Microelectronics & Packaging Business? - Ken Kuang, Torrey Hills Technologies
Download a copy of Ken's presentation HERE
New Material Systems to Meet Next Generation Packaging Requirements - Roupen Keusseyan, Triton Microtechnologies
2015 Technical Presentations:
Nanofabricated Electronic Components - Carl Edwards, Space Micro
FOWLP Technology and Application Space - Beth Keser, Qualcomm
Packaging Consideration in Next Generation Active Array Modules - Paul Garland, Kyocera America
Feature Resolution Capability for Stencil Printed Transient Liquid Phase Sintering (TLPS) Paste Interconnect Structures - Catherine Shearer, Ormet
Recent Advances in Thermally Conductive Polymers - Jeff Gotro, Innocentrix, LLC
CMOS Power Amplifiers - The Next Big Thing - Jim Cable, Peregrine Semiconductor
Trends in RF Reliability Assessment - Roland Shaw, Accel-RF
2014 Technical Presentations:
Ultra-Low Residue Semiconductor Fluxes Enabling Embedded and Low Form Factor Flip-Chip Assembly - Dr. Andy Mackie, Indium Corporation
Glass as a Core Packaging Platform for Next Generation Electronic Devices - Tim Mobley, Triton Microtechnologies
Download a copy of Tim's presentation HERE
SiP Innovation: IC Packaging for the Next Big Thing - Rich Rice, ASE
Download a copy of Rich's presentation HERE
Polymer Challenges in 2.5D and 3D Packaging - Dr. Jeff Gotro, InnoCentrix, LLC
Large-Area Maskless Fabrication: Laser Interference Patterning and Direct Digital Manufacturing - Dr. Dajun Yuan, Torrey Hills Technologies
2013 Technical Presentations:
Trends in Mobile Industry and Impact on Packaging and Integration - Urmi Ray, Qualcomm
Package Demonstration of an Interposer with Integrated TSVs and Flexible Compliant Interconnects - Ivan Shubin, Oracle Labs
Silicon On Sapphire and its Applications for High Frequency Switches - Ronald E Reedy, Peregrine