Power/HiTEC/CICMT Program Page
2023 HiTEC, CICMT & Power Electronics
April 17-20, 2023
Albuquerque Marriott Pyramid North | 5151 San Francisco Rd NE,
Albuquerque, NM 87109 USA
JOINT CONFERENCE PROGRAM AGENDA
A TECHNOLOGY CROSS-OVER EVENT!
Our CICMT, High Temperature, & Power Packaging Conferences come together for a great opportunity for you...
One location | One registration | Three times the content, networking, and learning!
Monday, April 17th
Professional Development Courses
Separate registration required
Each PDC available for $325 per course on/before March 24 | $425 per course March 24 and after.
PDC1: ADDITIVE MANUFACTURING FUNDAMENTALS WITH APPLICATIONS TO CHIP PACKAGING
Brian English, Engenius Micro
This PDC will present fundamental aspects of additive manufacturing with example applications in semiconductor chip packaging. Introductory material will review terminology, physics, benefits, and limitations with respect to machines, materials, design, and processes. Finally, we will review applications and examples applied to semiconductor chip packaging.
1:00pm-1:30pm
Lunch Break for PDC Participants
PDC2: FUNDAMENTALS OF HIGH TEMPERATURE ELECTRONICS
Patrick McCluskey, University of Maryland
Electronics are increasingly being used in applications requiring operation in ever harsher environments, including aerospace, electric vehicles, and energy exploration and generation. This course will cover the key aspects of designing electronic systems for thermal stability and mechanical/electrical reliability in environments with extreme temperatures. Key areas to be discussed include packaging wide bandgap semiconductor devices, sintered attach materials to replace solders, novel ceramic substrates, embedded thermal management, and heterogeneous integration.
Coffee Break for PDC Participants
PDC3: PACKAGING AND INTEGRATION OF WIDE-BANDGAP POWER SEMICONDUCTORS
Christina DiMarino, Virginia Polytechnic and State University
As electricity becomes more and more integrated into our everyday lives, demand for power electronics with improved efficiency, power density, reliability, manufacturability, and functionality for consumer electronics, data center, transportation, motor drive, renewable energy, and grid applications, among others, also increases. Wide-bandgap (WBG) power semiconductors are enabling power electronics to meet these growing demands, and are appearing in commercial products, from traction and solar inverters to chargers for portable electronics. However, new approaches to the packaging and integration of these devices are essential to unleashing their full potential.
This tutorial will review the challenges of packaging WBG power devices, current solutions and trends, and opportunities for further improvement. Topics that will be covered include design tools, materials, manufacturing processes, and package architectures, from low-voltage integrated packages to high-voltage, high-power modules. The opportunities and packaging challenges for future ultra-wide bandgap power devices will also be discussed.
Tuesday, April 18th
Registration Open
Breakfast
Opening Remarks – All Conference General Chairs
F. Patrick McCluskey, University of Maryland; Colin Johnston, Oxford University
Rita Mohanty, Henkel Corporation; Brian Rowden, Oak Ridge National Laboratory
Ammar Kouki, ETS (École de technologie supérieure)
8:30am-9:15am
KEYNOTE 1:
HIGH RELIABILITY ELECTRONICS FOR DEMANDING AIRCRAFT & HYPERSONICS APPLICATIONS
This talk proposed as a keynote provides an overview of the evolving and challenging demands electronics systems must deal with when installed on an Aerospace platform. Environmental concerns related to heat and vibration, increased utilization system power usage and the need to install electronics in parts of an aircraft that might be remote from readily accessible forms of cooling are examples that combine to form the challenge. Wide Band Gap (WBG) technology is now evolving as a higher temperature, robust material that may address some of these challenges. However, while WBG materials address the active device material for a power switching device, processor, etc. other issues must be considered in creating a compliant higher temperature and environmentally robust packaged device or system. This paper will examine some of these various issues and create a roadmap for future technology development items of interest.
A brief overview of a modern aircraft power system and the electrical usage needs that, in turn, drive thermal management challenges will first be provided as an Introduction and to set the stage. Ultra-Wide-Band-Gap (UWBG) materials and diamond concepts will also be discussed as the potential next revolutionary step on a path to high temperature electronics. Some resent results of an enabling materials research project with the University of Maryland in Robust Electronics Packaging will also be presented followed by a Conclusion including robust circuit board coating material concepts, nano-diamond coating studies and potential others for enabling high voltage and higher temperature operation.
Roger Brewer, Lockheed Martin
With 34 years of experience at Lockheed Martin, Roger started his career in Electrical Engineering at the Missiles and Space Systems Business Unit in Sunnyvale California supporting power component reliability assessments and investigations for a major Missile program. Since 1993, he has been with the Lockheed Martin Aeronautics Business Unit at both the Marietta Georgia and Ft. Worth Texas sites supporting aircraft power systems and related technology development for a variety of Aircraft, Advanced Development Programs and support to the LM Corporate Engineering and Enterprise strategy teams. He has provided several presentations and given talks, both at internal Lockheed Martin conferences and business engagements and industry energy and power conferences (SAE, IEEE, High Temperature Electronics and AIAA) outlining research being performed to improve aircraft power system performance in both existing and future platforms with a recent, specific emphasis on the wide-ranging benefits of high temperature enabled electronics for Military and Aerospace industries.
He is an AIAA Associate Fellow inducted in 2022 and a Technical Fellow (serving his second three-year term) as his primary position at Lockheed Martin in the Electrical Power Systems and High Temperature Electronics domains. He holds a Bachelor of Science Degree in Electrical Engineering from the University of Illinois and a Master of Science Degree in Electrical Engineering from North Carolina State University.
9:15am-10:00am
KEYNOTE 2: TBD
Jerome Teysseyre, onsemi | VP, Head of Onsemi New Packages Research, Development, and Engineering
10:00am-10:45am
Break with the Exhibitors
(Exhibit Hall opens 10:00am-7:00pm)
10:45am-11:30am
KEYNOTE 3:
DoD INTERESTS IN HIGH TEMPERATURE ELECTRONICS
Achieving low-power sensor control circuits operating in extreme temperatures (such as above 500oC) will require complimentary SiC P-type and N-type transistor technology. In general, traditional Silicon complimentary circuits cannot meet the temperature requirements for many DOD and commercial applications. SiC N-type devices have been in commercial production for many years supporting automotive applications, engine controls, power circuits, switching and other extreme condition applications. For SiC based devices, the manufacturing gap is high performance, high reliability SiC P-type devices to realize complimentary logic integrated circuits. An integrated circuit die must be packaged and assembly into an electronic sub-system for any application. The following presentation will review semiconductor device evolution to meet the extreme environment conditions. The SiC device technology will be presented in context with the Under Secretary of Defense for Research and Engineering (USD(R&E)) Critical Technology Areas. USD(R&E) identified 14 Critical Technology Areas that includes technology needs where extreme environment electronics will be important, specifically Hypersonics, Advanced Materials, Space, Directed Energy, and Microelectronics. As well, each DOD Agency has established a framework around technology focus areas to identify modernization needs. The U.S. Army established Modernization priorities that includes overlapping needs for extreme environment electronics; Next Generation Combat Vehicles, Long Range Precision Fires, and Future Vertical Lift that will have extreme environment electronics requirements. The presentation will summarize technology needs and DOD modernization priorities.
Eric Forsythe, US Army Research Laboratory, PM NextFlex and SEMI FlexTech Consortium
11:30am-12:15pm
KEYNOTE 4:
ALTERNATIVE PoF-BASED ACCELETED TESTING METHODS
Golta Khatibi, TU Wien – VIRTUAL PRESENTATION
12:15pm-2:00pm
Lunch Break & Networking with Exhibitors
TUESDAY AFTERNOON SESSIONS
| HiTEC | APPE | CICMT | |
H-TP1: Chairs: Emad Andarawis, GE Global Research, Linda del Castillo, NASA JPL | P-TP2: Chairs: Giri Venkataramanan, Univ of Wisconsin; Doug Hopkins, North Carolina State University | C-TP3: Chairs: TBD | |
| 2:00pm-2:30pm | An Update on High Temperature Tantalum Capacitor Technology Ron Demcko, Kyocera AVX (Daniel West, Ashley Stanziola, Ryan Messina) | Thermal, Reliability, and Isolation Characteristics of GE Aerospace Power Modules Shung Ik Lee, GE Aerospace (Darrell Grimes, David Reynolds, Liqiang Yang, GE Aerospace; Christopher Kapusta, GE Global Research) | How to Deliver Solderable Ceramic Substrates Igor Kadija, ECSI Fibrotools, Inc. |
| 2:30pm-3:00pm | High Temperature Film for Pulse Power and Power Conversion Capacitors Kirk Slenes, TPL Inc. | Press-pack SiC FET Module with Novel Monolithic Springs Ekaterina Muravleva, University of Nebraska-Lincoln (Bogac Canbaz, Liyan Qu, Jun Wang) | Technological Study of Lithographical Structuring of Metals on LTCC Uwe Ziegler, Technische Universität Ilmenau |
| 3:00pm-3:30pm | Thick Film Resistor System for High Temperature Applications Gregory Berube, Heraeus Precious Metals North America Conshohocken LLC (Frank Sandoval, Ryan Persons) | Reliability Testing and In-situ Failure Analysis of Wide Bandgap Power Electronic Device Moinuddin Ahmed, Argonne National Laboratory | Direct Write Printing of Gold Interconnects and Wirebond Pads for a Microshutter Array David Sessoms, Optomec (Kurt Christenson, Mike Renn, Optomec; Meng-Ping Chang, Beth Paquette, Carl Kotecki, NASA Goddard Space Flight Center) |
| 3:30pm-4:15pm | Break with the Exhibitors | ||
| 4:15pm-4:45pm | NEMS, Nanoelectromechanical Technology for High-Temperature and Radiation-Hard Electronics Piers Tremlett, Microchip (Dinesh Pamunuwa, University of Bristol) | Traction Inverter Packaging Ayush Lal, Aptiv | Shadow Masks as an Alternative Method to Lithography for the Structuring of Thin-film Layers on LTCC Substrates Heike Bartsch, Technische Universität Ilmenau (Nesrine Jaziri, Norayr Nessimian, Jens Müller) |
| 4:45pm-5:15pm | 400C Operating Temperature Non-Volatile Memory Based on Ferroelectric AlScN Daniel Drury, DEVCOM, U.S. Army Research Laboratory (Glen Fox, Fox Materials Consulting, LLC; Kei Yazawa, Geoff Brennecka, Colorado School of Mines; Emad Andarawis, GE Global Research; Brendan Hanrahan, DEVCOM, U.S. Army Research Laboratory) | American Made Challenge – TBD Alec Schulberg, National Renewable Energy Laboratory (NREL) | Millimeter-Wave Component Packaging and Interconnect Using Stacked Gold Stud Etienne Therriault, ETS (École de Technologie Supérieure) |
| 5:15pm-5:45pm | Understanding Performance Degradation Mechanism in High-temperature Tested T-gate, 140 nm Gate Length AlGaN/GaN HEMT Devices Ahmad Islam, Air Force Research Laboratory (Nicholas Sepelak, Adam Miesle, Dennis Walker, Antonio Crespo, Andrew Green) | Stereolithographic Additive Manufacturing of Ceramic Components for Energy Flow Modulations Soshu Kirihara, Osaka University (Fiona Spirrett) | |
| 5:45pm-7:00pm | Happy Hour with the Exhibitors | ||
Wednesday, April 19, 2023
WEDNESDAY MORNING TECHNICAL SESSIONS
| 7:00am-5:30pm | Registration Open | |||
| 7:00am-8:00am | Breakfast | |||
| HiTEC | APPE | CICMT | ||
8:00am – 8:05am General Chairs: | 8:00am – 8:05am General Chairs: | 8:00am – 8:15am General Chair: | ||
H-WA1: Chairs: Liangyu Chen, Ohio Aerospace Institute/NASA; David Shaddock, GE Global Research | P-WA2: Chairs: Chris Kapusta GE; Andy Longford, Panda-IMAPS UK | C-WA3: Chairs: TBD | ||
| 8:05am-8:45am | HiTEC KEYNOTE: Current Status of Ultra Wideband Gap Devices Aris Christou, University of Maryland | APPE KEYNOTE: Heterogeneous Integration of Power Electronics Circuits Fred Lee, Virginia Polytechnic and State University | 1st CICMT Speaker begins at 8:15am | |
| 8:15am-8:45am | Production of Printed Thermocouples Type T with CuNi and Copper Thick-film Pastes Stefan Körner, Fraunhofer IKTS (Henry Barth, Mirko Kirchhoff, Kathrin Reinhardt) | |||
| 8:45am-9:15am | Modeling a Lateral Mesa SiC JFET with Parasitic Bipolar effect for Simulation over an 800C Temperature Range Sonia Perez, Ozark Integrated Circuits (Jim Holmes, A. Matt Francis, Tom Vrotsos, Ian Getreu) | Application-based Lifetime Estimation of Power Semiconductor Devices Valeria Aucapina, Siemens (Matt Lacy, Advanced Energy; Joseph Proulx, John Oliva, Andras Vass-Varnai, Siemens) | Management and Recovery of Lost Thermal Energy for Environmentally Friendly High-Performance Electronics Nesrine Jaziri, Technische Universität Ilmenau (Alexander Schulz, Heike Bartsch, Jens Müller, Technische Universität Ilmenau; Fares Tounsi, École Nationale d'Ingénieurs de Sfax (ENIS)) | |
| 9:15am-9:45am | Gate Driver Design in 180 nm SOI CMOS Process for Heterogeneous Integration Inside SiC Power Khandoker Asif Faruque, University of Arkansas (Ayesha Hassan, Alan Mantooth) | Rapid Power Module Prototyping to Validate Multiphysics Simulation Models Joshua Major, National Renewable Energy Laboratory (Faisal Khan, Shuofeng Zhao, Sarwar Islam) | Modeling of Glass-Ceramic Materials and Components Brian Lester, Sandia National Laboratory | |
| 9:45am-10:15am | Recent Progress in Extreme Environment Durable SiC JFET-R Integrated Circuit Technology Philip Neudeck, NASA Glenn Research Center (David Spry, Michael Krasowski, Srihari Rajgopal, NASA Glenn Research Center; Liangyu Chen, Ohio Aerospace Institute; Carl Chang, HX5, LLC) | Multiphysics Modeling for Optimized Package Configuration of SiC MOSFETs Using Electromagnetic Field Analysis and Switching Analysis Ramchandra Kotecha, GE | Investigation of Tungsten Oxide as a Conducting Phase for Thick Film Resistors on Aluminum Nitride Ceramics Richard Schmidt, Fraunhofer IKTS (Manja Marcinkowski, Stefan Körner, Uwe Partsch) | |
| 10:15am-11:00am | Break with the Exhibitors (Exhibit Hall open 10:00am-4:30pm) | |||
| 11:00am-11:30am | High Temperature and Radiation Immune Non-Volatile Memory Technology Adam Gruszecki, University of Texas Dallas (Rohan Prasad, Leunam Fernandez-Izquierdo, Chadwin Young, University of Texas Dallas; Greg Yeric, Saurabh Suryavanshi, Cerfe Labs) | The Philippine Semiconductor Industry and the Use of Finite Element Analysis for Warpage Reduction Aristotle Ubando, De La Salle University (Roberto Louis Moran) | A Novel Mid-K Low Loss LTCC Dielectric for Microwave Filter Application Anton Polotai, Vibrantz Technologies (Keven Erskine, Julie Voak, Michael Brova, Yi Yang) | |
| 11:30am-12:00pm | MOSFET-based SiC Electronics for 600C+ Operation Emad Andarawis, GE Research (David Shaddock, Shubhodeep Goswami, Tammy Johnson) | Physics of Atomic Metal Welding in Ultrasonic Wire Bonding Henri Seppänen, Kulicke & Soffa Industries (Milad Khajehvand, Peter Klaerner, Kulicke & Soffa Industries; Panthea Sepehrband, Santa Clara University) | A New Paradigm in Electronics Materials and Devices Shweta Agarwala, Aarhus University | |
| 12:00pm-12:30pm | Vacuum Devices for Venus Larry Sadwick, InnoSys, Inc. (Jennifer Hwu, InnoSys, Inc.; Linda Del Castillo, Mohammad Ashtijou, Jet Propulsion Laboratory, California Institute of Technology) | High-performance HF Components with Photo-imageable Pastes Kathrin Reinhardt, Fraunhofer IKTS (Stefan Körner, Uwe Partsch) | ||
| 12:30pm-2:00pm | Lunch Break & Networking with Exhibitors | |||
WEDNESDAY AFTERNOON SESSIONS
| HiTEC | APPE | CICMT | |
H-WP1: Chairs: Colin Johnston, Oxford University; Brianna Klein, Sandia National Labs. | P-WP2: Chairs: Boyi Zhang, Delta; GQ Lu, Virginia Polytechnic and State University | C-WP3: Chairs: TBD | |
| 2:00pm-2:40pm | KEYNOTE: A Brief Status Update on Venus Long Lived Lander Technologies Gary Hunter, NASA Glenn Research Center | 1st APPE Speaker begins at 2:10pm | 1st CICMT Speaker begins at 2:10pm |
| 2:10pm-2:40pm | Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types Glenn Farris, Universal Instruments | Efficient Design of LTCC-based X-band Six-port Networks Using SIW Sabrine Idoudi, Ecole de technologie supérieure (Ammar Kouki, Ecole de technologie supérieure; Noureddine Boulejfen, Faculté des Sciences de Tunis) | |
| 2:40pm-3:10pm | Additive Prototyping for Rapid Circuit and Interface Development at 200C+ Jacob Kupernik, Ozark Integrated Circuits (Matthew Bakowski, Brandon Dyer, Walter Niblock, Anthony Francis) | Single Side Active Water Cooling of IGBT Using a Stellar DCB Cooler Thilo Vethake, Trumpf Photonics | A Mm-Wave Wideband LTCC Patch Antenna for 5G Applications Maryam Sadeghi, University of Calgary (Dawood Shekari Beyragh, Mohammad Helaoui, Fadhel Ghannouchi, University of Calgary; Ammar Kouki, École de technologie supérieure; Mohammad Sharawi, École Polytechnique de Montréal) |
| 3:10pm-3:40pm | Reliability Prediction for Circuit-boards in High Temperature Applications for the Power and Industrial Automation Markets Alejandro Sanchez, Henkel Corporation | Thermal Interface Materials for High Reliability and High Heat Flux Power Applications Bradley Seurer, Henkel Corporation (Radesh Jewram) | Hexagonal Ferrite Thick Films for Self-biasing Circulators Integrated in LTCC Microwave Modules Jörg Töpfer, Ernst-Abbe-Hochschule Jena (Manuel Heidenreich, Ernst-Abbe-Hochschule Jena; Wanja Gitzel, Arne Jacob, Technische Universität Hamburg-Harburg; Johannes Schur, Jens Müller, Technische Universität Ilmenau) |
| 3:40pm-4:30pm | Break with Exhibitors | ||
| 4:30pm-5:00pm | Electrical and Dielectric Characterizations of HTCC Electronic Packages for High Temperature Harsh Environment Applications Liangyu Chen, Ohio Aerospace Institute/NASA Glenn Research Center (Philip Neudeck, David Spry, Gary Hunter, NASA Glenn Research Center) | Package and Die Attach Material Comparisons for High Power GaN Devices Casey Krawiec, StratEdge Corporation (Erik Sanchez) | Fabrication of Oriented Hexagonal Ferrite Thick Films for Microwave Applications Beate Capraro, Fraunhofer IKTS; Dirk Schabbel, Fraunhofer Institute for Ceramic Technologies and Systems IKTS; Manuel Heidenreich, Jörg Töpfer, Ernst-Abbe-Hochschule Jena) |
| 5:00pm-5:30pm | Advanced Additive Manufacturing Thick-Film Techniques Harold Snyder, Physical Solutions | Vehicle Electrification and its Thermal Management Ayush Lal, Aptiv | Field Programmable Microwave Substrate and Applications to Reconfigurable Microwave Filters Langis Roy, Ontario Tech University (Hanyue Xu, Stephen Jeswinde Nuagah, Ying Wang) |
| 5:30pm-6:00pm | Effect of Thermal Aging on the Growth Kinetics of Intermetallic Compounds between Lead-free Solder and Cu Alloy Substrates Patrick McCluskey, University of Maryland (Gilad Nave) | On RIS Implementation in LTCC Technology Ines Amor, Ecole de technologie supérieure (Ammar Kouki) | |
OFFSITE ACTIVITY – TBD
Thursday, April 20, 2023
THURSDAY MORNING SESSIONS
| 7:00am-6:00pm | Registration Open | |
| 7:00am-8:00am | Breakfast | |
| HiTEC | Joint Session APPE & CICMT | |
8:00am – 8:15am General Chairs: | 8:00am – 8:05am General Chairs: | |
H-THA1: Chairs: Harold Snyder, Physical Solutions; Gregory Berube, Heraeus Precious Metals North America Conshohocken LLC | P/C-THA2: Chairs: David Rosenfeld, DuPont; Co-chair TBD | |
| 8:15am-8:45am | Effect of Heat Aging and Power Cycling on the Reliability of Sn-based Solders for Die Attach in Automotive Power Modules Bettina Ottinger, Vitesco Technologies Germany GmbH (Sebastian Koenig, Joshua Holverscheid, Sprenger Mario, Lars Mueller, Vitesco Technologies Germany GmbH; Jörg Franke, Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)) | Increased Efficiency for Wide Band Gap Devices Achieved with Power Semiconductor Embedding into Printed Circuit Boards Thomas Gottwald, Schweizer Electronic AG |
| 8:45am-9:15am | AuSn Preform Thickness’s Effect on Thermal Management in Semiconductor Laser Applications Jenny Gallery, Indium Corporation (Samuel Lytwynec) | Next Generation RF Packaging Ramesh Kothandapani, Materion (Sin Li Tan) |
| 9:15am-9:45am | Process Parameter Development of Preform based Transient Liquid Phase Soldering (TLPS) as a Die Attach Method for Automotive Power Modules Joshua Holverscheid, Vitesco Technologies Germany GmbH (Bettina Ottinger, Sebastian Thummert, Sebastian Koenig, Lars Mueller) | Predicting Tensile Failure Stress of Soldered Ceramics Kevin Strong, Sandia National Laboratories (Jamar Rogers, Scott Grutzik, Jeier Yang) |
| 9:45am-10:15am | Break in Foyer | |
| 10:15am-10:45am | Reducing High Temperature System Development Cycle Time and Cost with Additively Manufactured Connectors Matthew Bakowski, Ozark Integrated Circuits, Inc. (Walter Niblock, Jacob Kupernik, Matt Francis) | Aging and Relaxation Dynamics in Glass-Ceramics Measured by Temperature Dependent Raman Spectroscopy William Delmas, Sandia National Laboratory (Zachary Piontkowski, Steve Dai) |
| 10:45am-11:15am | Power and Data Interconnects for -65C to 1300C Applications Julianne Benson, Times Microwave Systems (Ritch Selfridge, Amphenol Aerospace) | An Evaluation on the Mechanical Performance and Electrical Conductivity of Electrically Conductive Film Adhesives with Glass Fabric Carriers Weiyu Zhang, Henkel Corporation (Yuan Zhao, Zhongwei Liu, Stone Cheng) |
| 11:15am-11:45am | Surface Passivation and Insulation for 3-D Stacking of SiC Integrated Circuits for High-temperature Applications | Thirsty for Chromium: Li-Al-SiO2 Glass-ceramic-to-metal Seal Reactions and Phase Formations with 304L Steel Joseph Boro, Sandia National Labs (Rachel White, Steve Dai) |
| 11:45am-12:45pm | Lunch Break | |
THURSDAY AFTERNOON TECHNICAL SESSIONS
| JOINT SESSION: High Temperature Electronics Conference (HiTEC) & Advanced Packaging for Power Electronics Conference (APPE) | |
H/P-THP1: Chairs: Patrick McCluskey, University of Maryland; Benson Chan, Binghamton University | |
| 12:45pm-1:25pm | KEYNOTE: High Temperature and Power Electronics at GE Research |
| 1:25pm-1:55pm | Copper Sintering for Power Electronics Applications Susanne Duch, Heraeus Deutschland GmbH & Co KG (Stefan Gunst, Heraeus Deutschland GmbH & Co KG; Habib Mustain, Heraeus Electronics) |
| 1:55pm-2:25pm | Versatile Silver Sintering Pastes for Improved Bond Performance and Simplified Handling David Rosenfeld, DuPont (Kazutaka Ozawa, Aya Satomi) |
| 2:25pm-2:45pm | Coffee Break in Session Room |
| 2:45pm-3:15pm | Rapid, Low Temperature and Low Pressure Assisted Large Area Bonding with Copper Sinter Paste for High Power Electronics Packaging Sri Krishna Bhogaraju, Institute of Innovative Mobility, Technische Hochschule Ingolstadt (Rodolfo Saccon, Gordon Elger, Institute of Innovative Mobility, Technische Hochschule Ingolstadt; Paul Paret, National Renewable Energy Laboratory; Dirk Busse, Alexander Dahlbüdding, Budatec GmbH) |
| 3:15pm-3:45pm | Investigation and Evaluation of High-Temperature Dielectric Materials for Power Electronics Applications Benjamin Lyon, Virginia Polytechnic and State University (Christina DiMarino) |
| 3:45pm-4:15pm | Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules Whit Vinson, University of Arkansas (David Huitink, Collin Ruby, Imam Al Razi, Alan Mantooth, Yarui Peng) |
| 4:15pm-4:30pm | Closing Remarks – Conference General Chairs Patrick/Colin, Rita/Brian, and Ammar/Dan |
| 5:00pm | TOUR AT OPTOMEC -- RSVPs REQUIRED (maximum attendees: 20) Description soon: Aerosol Jet machine demonstration |