Thanks to a great partnership between IMAPS and 3D InCites for the past several years, we are happy to share with you our podcast series from the IMAPS International Symposium, Device Packaging Conference and our CHIPcon (formerly the Advanced SiP Conference). These "conversations from IMAPS" are recorded live at our Conferences and produced by Francoise von Trapp of 3D InCites.
If you are part of an IMAPS event and would like to know more about participating in a live podcast, or sponsorship of a podcast, please contact info@imaps.org for details.
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3D InCites Podcast series
"CONVERSATIONS FROM IMAPS"
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IMAPS Device Packaging Conference 2024
MAR 2024 | Fountain Hills, AZ
Scott Hayes, Amy Lujan, Dan Berger, Zac Holman, Mark Litecky, Arvind Kumar, Hemanth Dhavaleswarapu
- IMAPS Global Business Council discussions: Dan Berger, Zac Holman, Mark Litecky
- The AI Explosion, Chiplets Architecture, and Enabling the Future of Moore's Law
- General Chair and General Chair Elect (2025) Talk About the History of the IMAPS Device Packaging Conference (DPC) and The Line-up for 2024 ~ the 20th year anniversary.
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Conversations from 2023 IMAPS International Symposium
OCT 2023 | Town & Country Resort, San Diego, CA
Francoise von Trapp, Erica Folk, Tarak Railkar, Kevin Anderson, Jeffrey Burns, C.P. Hung, Carlsbad High School Students
IMAPS 2023 saw an unprecedented 14 Professional Development Courses with one added in the topical area of AI. This year we were very pleased with the student participation: university booths, student speakers and posters, and visiting students from Carlsbad High School.
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Conversations from IMAPS 2023 Device Packaging Conference
APRIL 2023 | Fountain Hills, AZ
Francoise von Trapp, Chris Scanlan, Keith Felton, Choon Lee, Andy Mackie
At the 2023 IMAPS Device Packaging Conference, there were a lot of discussions about chiplet technology, both in panel discussions and in general conversations. In this episode, we pulled together several interviews in an attempt to demystify and define chiplets, how they are produced and interconnected, what challenges the industry faces, and what we need to do to overcome them.
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Conversations from 2022 IMAPS International Symposium
OCT 2022 | Hynes Convention Center, Boston, MA
Francoise von Trapp, Sze Pei Lim, Dean Payne, Lionel Kimerling, Anuradha Agarwal, Beth Keser
The IMAPS International Symposium was held in October, 2022 at the Hynes Convention Center in Boston MA. This year's Symposium theme was Packaging Technologies Enabling the New Normal, and featured 20 sessions in five technical tracks, plus an Interactive Poster Session. The technical program spanned three days of sessions with an emphasis on packaging technologies that serve 5G, High-Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond.
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Conversations from IMAPS Advanced SiP Conference 2022
JUNE 2022 | Doubletree Sonoma, CA
Francoise von Trapp, Chidi Chidambaram, Mark Gerber, Daniel Graff
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Conversations from IMAPS Device Packaging Conference 2022
MARCH 2022 | Fountain Hills, Arizona
Francoise von Trapp, Beth Keser, Erica Folk, Bob Conner, Abul Nuruzzaman, Darren Crum, Tom Smelker, Jim Will, John Lannon, 3D INCITES Awards Winners, James Haley
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Conversations from the IMAPS 2021 International Symposium
OCT 2021 | SEASON 1 EPISODE 13
Francoise von Trapp, Nicole Wongk,
Markus Patton, KT Moore, Andy Mackie, Dirk Friebel, Tom Gregorich, Jan Vardaman, and more...
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