IMAPS Medical 2025
IMAPS Advanced Packaging for Medical Microelectronics Workshop

March 5 - 7, 2025
Sheraton Grand at Wild Horse Pass | Phoenix, Arizona USA

co-located with IMAPS Device Packaging Conference 2025 (March 3 - 6)

The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in Phoenix, Arizona on Advanced Packaging for Medical Microelectronics on March 5-7, 2025. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage discussions involving technologies, products, strategies, current and emerging markets, and collaborations. This workshop is being held in conjunction with the Device Packaging Conference (DPC), starting with a combined poster session on Wednesday, March 5.  Medical Workshop attendees will have the opportunity to attend the Thursday, March 6 DPC Keynote sessions.  This three-day event will draw invited experts in the fields of medicine, medical devices, biomaterials, microelectronics, semiconductor packaging, and product assembly.   

Organizing Committee
Workshop Program
WEDNESDAY, MARCH 5
  
4:00 PM - 5:30 PMRegistration Open
  
6:00 PM - 8:00 PMCombined Poster Session with Device Packaging Conference
Hemapik Lawn
  
THURSDAY, MARCH 6
  
7:00 AM - 4:00 PMRegistration Open
  
7:00 AM - 8:30 AMContinental Breakfast
  
8:00 AM- 10:00 AMExhibitor Move In / Set Up
  
9:40 AM - 10:00 AMNetworking Coffee Break with Device Packaging Conference Attendees
  
 

SESSION: APPLICATION / PRODUCTS

Session Chair:

10:00 AM - 10:15 AMOpening Remarks - General Chair: Rick Elbert, Cicor
  
10:15 AM - 11:00 AMKEYNOTE: Inspire: A Story of Growth
Dave Dieken, VP Product Development – Inspire Medical Systems, Inc.
  
 Dave Dieken serves as VP Product Development at Inspire Medical Systems and has over 25 years of product development experience. Earlier in his career, he developed cardiac devices at Medtronic and baroreflex stimulation devices at CVRx. Since joining Inspire in 2015, he led the development of Inspire's patent remote device, SleepSync cloud-based patient management system, neural interface electronics, and closed-loop implantable system architecture. He currently leads Inspire’s growing product development organization. He is an inventor of over 40 U.S. patent applications and holds a B.S. in Electrical and Computer Engineering from the University of Wisconsin-Madison.
  
11:00 AM - 11:30 AMUltrasound Wireless Power Transfer (UWPT) Effectiveness in the Frequency, Transmitter-Received Dimensional Domains
Inder Raj Makin, Piezo Energy Technologies, LLC and A.T. Still University
  
11:30 AM - 12:00 PMSolid State Batteries Enable Miniaturization of Active Implanted Medical Devices
Denis Pasero, Ilika Technologies
  
12:00 PM - 1:00 PMLUNCH
  
1:00 PM - 1:30 PMHow To Meet the Requirements for Miniaturized Rechargeable Medical-Grade Batteries
Marcel Inauen, Wyon Swiss Batteries
  
1:30 PM - 2:00 PMMiniaturization, Biometrics and High-Density Precision Circuits within Liquid Crystal Polymer
James Rathburn, LCP Medical Technologies, LLC
  
2:00 PM - 2:30 PMAdvancing Active Medical Implants: The Role of Glass Encapsulation in SCHOTT Primoceler’s Proteon™ Packages for the Next Generation of Smart Devices
Ossi Lahtinen, SCHOTT Primoceler
  
2:30 PM - 2:45 PMSPONSOR PITCH: CIRTEC MEDICAL
  
2:45 PM - 3:15 PMCOFFEE BREAK
  
 

SESSION: MATERIALS

Session Chair:

  
3:15 PM - 4:00 PMKEYNOTE: RF Packaging and Integrated Antennas for Low-Cost Medical Radar Sensor Systems
Ivan Ndip, Fraunhofer IZM/Brandenburg University of Technology
  
  
4:00 PM - 4:30 PMAdvanced Flex Substrates for BioMedical Applications
Doug Hackler, American Semiconductor
  
4:30 PM - 5:00 PMVoid-free Silicone Encapsulations: Methods, test results and Advantages for Active IPGs Encapsulated with Silicone After Lead Attachment
Gary Johnson, CorTec GMBH
  
5:00 PM - 5:30 PMMulti-Anchored Membranes (MAMs) – A Theory of Silicone Encapsulation of ICs for Active Implantable Devices
Ahmad Shah Idil, UCL
  
5:30 PM - 7:00 PMCOCKTAIL RECEPTION WITH EXHIBITORS
  
FRIDAY, MARCH 7
  
7:00 AM - 8:00 AMREGISTRATION & CONTINENTAL BREAKFAST
  
8:00 AM - 8:15 AMWELCOME / INTRODUCTIONS
  
 

SESSION: ASSEMBLY

Session Chair:

8:15 AM - 9:00 AM

KEYNOTE: The Economics of Small Medical Implants
Rex Hales, IC Design Engineering Manager, Cirtec Medical

Smart Medical Implants, devices that include Integrated Circuits (ICs), is a $4.8 Billion market in 2024 and expected to grow at 18% through 2033. This growth is built around the technological advancements of the semiconductor industry which have enabled the size, power, and performance optimization necessary to make these devices viable. Semiconductor technology advancements and economics are driven by high-volume products. 1.8 billion phones, 250 million computers, 200 million TVs, and 80 million cars are produced per year, all of which have many ICs. Most medical implants never reach the kind of production volumes to take advantage of the economies of scale that the semiconductor industry expects, but they often need access to advanced technologies to meet their productization goals. This address discusses the business economics of developing an Application Specific Integrated Circuit (ASIC) for a Smart Medical Implant, with an emphasis on strategies to navigate the low-volume economic challenges.

 Rex Hales is the IC Design Engineering Manger for Cirtec Medical's Chandler site. He has been leading IC Design Teams since 1998 for applications including cochlear implants, dental x-ray, MEMs projectors, cell phone communication, and automotive radar. He is currently engaged in a wide range of Smart Medical Implant projects in various stages of development.
  
9:00 AM - 9:30 AMA High Channel Count Connector for Neural Interfaces
Travis Massey, Lawrence Livermore National Laboratory
  
9:30 AM - 10:00 AMPushing the Limits of Titanium and Glass in Medical Devices and Implants
Thomas Zetterer, SCHOTT AG Electronic Packaging
  
10:00 AM - 10:15 AMSPONSOR PITCH: PROMEX INDUSTRIES
  
10:15 AM - 10:30 AMCOFFEE BREAK
  
10:30 AM - 11:00 AMStrategies for Chip-Scale Packaging of Medical Device ICs
Rex Hales, Cirtec Medical
  
11:00 AM - 11:30 AMThe Flexibility of Wearables and Small Form-Factor Devices: The Art and Science of Adding Chips on Components That Flex
Dave Fromm, Promex
  
11:30 AM - 12:00 PMNew Approach of 3D Catheter Assembly Process Developed by AEMtec
Ingolf Schlosser, AEMtec USA Inc.
  
12:00 PMCLOSING REMARKS
  
1:00 PM(POSSIBLE) TOUR WITH ASU
Registration

*** If you’re also attending DPC 2025 , you are eligible for a discount  ($200 off member/non-member and speaker, $50 off students)  Please register for DPC 2025 and then add your Medical Workshop registration to receive the discount. ***

Member Rate
Before January 31, 2025
Member rate will increase to $795 beginning February 1. Lock in the lower rate now! 
$695
Non-Member Rate
Before January 31, 2025
Non-Member rate will increase to $995 beginning February 1. Lock in the lower rate now! 
$895
Speaker/Chair Rate
Before January 31, 2025
Speaker/Chair rate will increase to $595 beginning February 1. Lock in the lower rate now! 
$495
Student Rate
Before January 31, 2025
Student Non-Member rate will increase to $200 beginning February 1. Lock in the lower rate now! 
$125
Student Poster Presenters
Before January 31, 2025
Student Poster Presenter rate will increase to $150 beginning February 1. Lock in the lower rate now! 
$75
Tabletop Exhibits
Before January 31, 2025
Tabletop Exhibit rate will increase to $950 beginning February 1. Lock in the lower rate now!  (includes 1 booth personnel badge; additional discounted full badges available to exhibitors at $450/person 
$850
Sponsorships
Includes: 1 tabletop exhibit; 2 exhibit badges, print ad in programs,  flyer/giveaway distributed to all attendees, logo/advertisement  on event webpages and printed program 
$1750
Sponsors


 

Exhibitors

CERAMTEC

CIRTEC MEDICAL

CORTEC GMBH

DELO INDUSTRIAL ADHESIVES

DYCONEX AG

iNPACK a PCB TECHNOLOGIES CO.

PALOMAR TECHNOLOGIES, INC.

PROMEX INDUSTRIES

VALTRONIC TECHNOLOGIES (USA), INC

 
REGISTER TO SPONSOR/EXHIBIT
Hotel

Sheraton Grand at Wild Horse Pass (co-located with IMAPS Device Packaging Conference)
5594 West Wild Horse Pass Boulevard
Phoenix, Arizona 85226

Group Rate: $325/night

 
Online booking

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