University and High School Students Participate in IMAPS Symposium 2023 

This year's annual Symposium in San Diego saw beneficial participation from Universities and a visit from Carlsbad High School students.  Student involvement in IMAPS is critical to workforce development and the future of the microelectronics and packaging industry.

University Students

We were thrilled to have university students representing their schools in the Exhibit Hall:  San Diego State University, Binghamton University S3IP, University of California, Riverside and Arizona State University.  Some of them also presented papers or posters.

University participation video:  Students from SDSU, Binghamton University and Arizona State University talk about their experiences with IMAPS - presenting papers and posters, networking and career opportunities.

Carlsbad High School Students

IMAPS continued its popular STEM outreach program, inviting local high school robotic club students to attend the 2023 Symposium in San Diego.  Students from Carlsbad High School were treated to an insight into technology, future academic and career paths, and explored the exhibit floor to talk with companies and universities.

All the students felt very positive about their experience, commenting:

“Of all the STEM events I attended and experienced at school during my 4 years in high school, this was the best!  The speakers made me so excited about checking into an interesting future in microelectronics. I was unsure of what to do, but now have ideas on what to look into.”

“I want to work on incredible things like the speakers worked on and invent things to change the world!  Thank you very much IMAPS for doing this!”

“Now I understand a little better how our robots work. I never thought about it. I just thought we assembled it and did programming. I see how microelectronics make these things work.”

At the end of the visit, three of the Carlsbad High School students sat down for a podcast with Francoise von Trapp of 3D InCites. They chatted about their interactions at Symposium, what they plan to study in college, and how to make connections. 

Advancing Microelectronics Magazine Check out this issue featuring the Future Advanced Packaging Workforce and Student Talent in our High Schools and Universities.  This issue includes student papers and an article written by IMAPS 2023 Student Program Chairs Bill Ishii and Mike McKeown summarizing the STEM program student visit.

Future Events

University students:  join us at a future event - submit a paper or poster!

Device Packaging Conference in May (Fountain Hills, Arizona) -- email IMAPS for poster abstract submittal 
IMAPS Symposium in October (Boston, Massachusetts) -- abstract submission page