IMAPS proudly publishes a 6-issue magazine, a quarterly scientific journal, and a bounty of exclusive microelectronics research content from Society events each year. All IMAPS technical publications are available electronically through the IMAPSource Microelectronics Research Portal. This library of exclusive IMAPS content features downloadable versions of the Journal of Microelectronics and Electronic Packaging, and proceedings from IMAPS conferences and symposia. The Advancing Microelectronics magazine is available directly at www.imaps.org. As of May 2023, IMAPS has migrated its publications portal to an OPEN ACCESS platform to better serve our membership, and the broader global packaging industry!

	Advancing Microelectronics Magazine Advancing Microelectronics member magazine is published six times per year. Each issue focuses its articles and content on a relevant industry theme, as well as news from our chapters and industry members. Issues are openly accessible to any interested reader at no cost via the IMAPS homepage.
	Journal of Microelectronics and Electronic Packaging The JMEP is dedicated to publishing peer-reviewed papers in research, development, and the application relating to all aspects of microelectronics packaging, interconnect and assembly technologies. This journal covers materials, processes, reliability, design, systems, and applications in microelectronics assembly and packaging technologies of the present and future including 3D integration, Ceramic Interconnect, Soldering, Flip Chip, Wire Bonding, Encapsulation, RF and microwaves, MEMS, Photonics, Power/High Temperature Electronics, Printed Electronics, LED packaging, and Medical Electronics. As of May 2023, articles from JMEP are now available at IMAPSource.org in an OPEN ACCESS format to all IMAPS members and the broader packaging industry.
	International Symposium on Microelectronics Full-text abstracts from technical session speakers and select presentations from keynote speakers from the International Symposium on Microelectronics are available for download after the event each year. As of May 2023, all IMAPS proceedings are now available at IMAPSource.org in an OPEN ACCESS format to all IMAPS members and the broader packaging industry.
	Additional Conference Content Presentations from technical session speakers and select keynote speakers are available for download after each major conference, including the International Conferences on Device Packaging (DPC), High Temperature Electronics (HiTEN/HiTEC), and Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT). As of May 2023, all IMAPS conference proceedings and other files are now available at IMAPSource.org in an OPEN ACCESS format to all IMAPS members and the broader packaging industry.