CONFERENCE GENERAL CHAIRS
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HiTEN Organizing Committee:
Linda del Castillo, NASA JPL | Brianna Klein, Sandia National Labs. | Emad Andarawis, GE Aerospace Research (GEAR) | David Shaddock, GE Aerospace
Research (GEAR) | Liangyu Chen, Ohio Aerospace Institute/NASA | Holger Kappert, Fraunhofer IMS | Andy Longford, PandA Europe | Steve Riches, Tribus-D Ltd
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HiTEN Conference Focus:
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from around the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and Silicon On Insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.
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Welcome
Colin Johnston and F. Patrick McCluskey
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KEYNOTE: Future Research for HT Instrumentation for Geothermal Applications
Andrew Wright, Sandia National Laboratories
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Ceramic Sensor Elements for Geothermal Applications
Steffen Ziesche, Fraunhofer IKTS
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Additively Manufactured High Temperature Passive RF Components
David Shaddock, GE Aerospace Research
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Silicon Capacitors for Electric and Hybrid Electric Vehicles (xEV)
Catherine Bunel, Murata, CAEN, France
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KEYNOTE: An Emerging Silicon Carbide Ecosystem for Harsh Environment Electronics
Alan Mantooth, University of Arkansas
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Investigation of Ohmic Contacts and Resistances of a 4H-SiC CMOS Technology up to 500̊ C
Matthias Rommel, Fraunhofer Institute for Integrated Systems and Device Technology IISB
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SiC Complementary JFET Logic Gates: An Emerging Technology for High-Temperature Electronics
Mitsuaki Kaneko, Kyoto University
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3:30 PM – 4:00 PM
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Device Variability Compensation in High Temperature Electronics for Hall Sensing Applications
Jacob Kay, University of Durham
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Day 1 Closing Remarks
Colin Johnston and F. Patrick McCluskey
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4:15 - 5:30 PM
Happy Hour With Exhibitors
Pentland West
Tuesday, July 16, 2024
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Day 2 Welcome Remarks
Colin Johnston and F. Patrick McCluskey
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KEYNOTE: Diamond Electronics: Advances in Devices and Packaging for High Temperature Systems
Aris Christou, University of Maryland
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Extreme Temperature Operation of AIGaN High Electron Mobility Transistors
Brianna Klein, Sandia National Laboratories
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Progress Towards a GaN/AIGaN HEMT Foundry Technology for Fabrication of Stable RF Power Amplifiers Operating at 500̊ C
Jean-Paul Noel, National Research Council Canada
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High Temperature Ferroelectric Work and How it Related to High Temperature Non-Volatile Memory
Brendan Hanrahan, Army Research Laboratories
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KEYNOTE: The Problems of Wireless Temperature Measurement at 150C-325C - Progress with NEM Switch Technology
Piers Tremlett, Microchip Technology Inc.
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Electrification & Power Modules – Innovative High Reliability Solder Materials
Karthik Vijay, Indium Corporation
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ENEPIG Plated Integrated Circuit Die Pads for High-Temperature Reliability Bonding and Flip-Chip Packaging
Erick Spory, Global Circuit Innovations
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Day 2 Closing Remarks
Colin Johnston and F. Patrick McCluskey
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Day 3 Welcome Remarks
Colin Johnston and F. Patrick McCluskey
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KEYNOTE: Electronic Materials and Devices That Not Only Survive But Thrive in 500C Environments
Katherine Burzynski, Air Force Research Laboratory
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300 Degree Celsius Electronic Component Packaging
Andrew Wright, Sandia National Laboratories
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Review of Transient Liquid Phase Soldering Techniques
F. Patrick McCluskey
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Solid-State Bonding Using nanoporous Cu sheet on Au Surface-Finishing For Power Devices
Hiroshi Nishikawa, Osaka University
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Closing Remarks / Adjourn
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Delegate, Speaker/Chair, and Student registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and a download of the Proceedings Papers. Also includes a one-year
IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.
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Early Fee Through 6/17/24
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Advance/Onsite Fee After 6/17/24
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Tabletop Exhibit (IMAPS Member)
12 Tabletop Spots Available
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Tabletop Exhibit (Non-Member)
12 Tabletop Spots Available
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Premier Sponsorship (Includes Tabletop - Limit 3)
Includes 1 tabletop, 2 session badges, 2 exhibit personnel badges with meals, and advertisements
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Corporate Sponsorship (Includes Tabletop - Limit 8)
Includes 1 tabletop, 1 session badge, and 1 exhibit personnel badge with meals
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HOW TO REGISTER:
IMAPS MEMBERS
- If you are a member of IMAPS, go to www.imaps.org
and log in with your username and password. If you do not know your username, email kobrien@imaps.org. If you have
forgotten your password, click Forgot your password? to receive a link to reset your password. Logging in before registering gives access to member pricing and saves having to enter your contact information.
- Click on REGISTER above or from the event homepage.
- Complete your registration.
NONMEMBERS
- Click on REGISTER above.
- Complete your registration.
ACCOMMODATION INFORMATION:
HiTEN attendees will have the opportunity to reserve their overnight accommodations through the IMAPS Registration Portal. Below you will find additional information and links to the various properties.
Chancellors Court:
Featuring a Bed & Breakfast style and campus style accommodations, this is the perfect location to take advantage of all the city has to offer.
*Accommodations for 2 guests on 2 single beds in each room
KM Apartments:
Featuring a Bed & Breakfast style (walk next door to the Hotel for your breakfast), available rooms range from an Open Pan Studio and Compact Open Plan Studio to provide guests space for a working environment or a longer stay.
*Accommodations for 2 guests with UK double beds
KM Hotel:
Featuring
a Bed & Breakfast style and located next door to the KM Apartments, the KM Hotel offers modern accommodations in an enviable location that sits between Edinburgh's historic Old Town and lively Southside.
*Accommodations for 2 guests with UK double beds
Overnight Accommodation Cancellation Information:
Cancellation with written email notification to info@imaps.org on/before July 1, 2024 may receive a full refund. Overnight accommodation cancellations after July 1st will be refunded at 50%.
HiTEN Lodging Reservation Deadline: 6/17/24
Sleeping room availability and pricing cannot be guaranteed after this date. If you are unable to reserve rooms with IMAPS after June 17, we recommend searching directly with hotels for your booking.
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Charcroft Electronics Ltd.
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Frequency Management International
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Oneida Research Services, Inc.
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