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DPC 2025 Exhibit
 
IMAPS Device Packaging 2025 Exhibitor Page


The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. It is an international event organized by the International Microelectronics Assembly and Packaging Society and a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals. The 2025 conference will feature 4 keynote presentations, technical sessions on Heterogeneous: 2D and 3D Integration/Emerging Technologies/Fan-Out, Wafer/Panel Level & Flip Chip Packaging, an embedded Global Business Council Plenary Session, an interactive poster session, an evening panel discussion, and more. The Symposium includes the sold-out exhibit hall. All details on exhibit deadlines, deliverables, and exhibit kit are listed below.

Building on Our 2024 Success

With a record attendance of nearly 800 attendees (16% growth) including 220 participants locally from Arizona, it’s no surprise as there is a tremendous amount of advanced packaging activity in Arizona these days. We were thrilled to see close to 100 students, many from Arizona State University, attending the Professional Development Courses and conference sessions, as well as networking and making connections with industry experts. The bustling exhibit hall was once again sold out with 66 exhibitors.

Based on the success of 2024, IMAPS Device Packaging Conference will be at a new location that can accommodate more session rooms, exhibits and hotel rooms. We look forward to hosting Device Packaging 2025 on March 3-6, at the Sheraton at Wild Horse Pass in Phoenix, Arizona, a beautiful resort setting 14 miles south of Sky Harbor Airport.  

Exhibit Dates/Hours

Move In

March 3 (12PM-5PM) and March 4 (7AM-9AM)

Exhibit Hours

  March 4 10AM-6:30PM
March 5 10:30AM-4:30PM

Move Out

  March 5 4:40PM-8PM

Exhibit Space Details

Included in each booth (sponsors refer to sponsor package):

  • One (1) 8'x10' pipe-and-drape booth space
  • Basic WiFi Internet access
  • 1 - 6' Black Skirted Table, 2 chairs, wastebasket
  • Pre- and post-event attendee lists (PDF format)
  • Two registrations, either
  •   One (1) full conference badge and one (1) booth personnel badge - or-
  •   Two (2) booth personnel badges
  • The exhibit hall is carpeted

Not included in the booth package fee:

  • Carpeting (the exhibit hall is carpeted)
  • Utilities, such as electrical power, plumbing or air services
  • Furniture rentals, including tables and/or chairs
  • Audiovisual equipment, including monitors, televisions, and laptops
  • Lead retrieval services
  • Labor, including booth cleaning or setup/breakdown
  • Freight or handling charges of any kind
  • Any additional services not listed in the package inclusions above
DPC programExhibit Service Kit DPC 2025 Home Page

“Following the signing of the CHIPS and Science Act in 2022, IMAPS has experienced substantial growth in our technical program and exhibition (now sold out). With this surge in engagement from our corporate members and sponsors, we secured a new venue for Device Packaging 2025 that allows for enhancements to our program, exhibition and networking activities.”

Brian Schieman
IMAPS Executive Director

PO Box 14727, Pittsburgh PA 15234 | Email Us | 1-919-293-5000