ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. In a world running on semiconductor technology to achieve lifestyle, efficiency and sustainability goals, packaging innovation is at the heart of what ASE does.

Deca was born of a passion to transform the way the world builds advanced electronic devices. In our first decade, our 10X thinking brought to life exciting breakthroughs with M-Series™ and Adaptive Patterning®.

IBM offers chiplet and advanced packaging technology capabilities to supercharge innovations for AI and logic. By bringing multiple technologies together at the package level to increase performance and reduce cost, our frameworks provide a new paradigm for semiconductor innovations as well as a new pathway to meet AI’s increasing performance demands.  

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany.  

Amkor Technology is one of the world’s largest providers of high quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs.  

With over 20 years of experience, we have established our name as the technology leader in bond testing throughout the world. With 100% of our focus on bond testing, XYZTEC teams with customers to offer innovative solutions that address their specific bond test needs.  

Adeia Inc. (Nasdaq: ADEA), is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. With an extensive and growing portfolio of intellectual property covering hybrid bonding, advanced process nodes and advanced packaging technologies, Adeia licenses and partners with leading semiconductor companies worldwide.

NAMICS Corporation is a global technology leader of advanced materials for semiconductor devices and packages, passive components, and solar cells. Headquartered in Niigata, Japan, NAMICS serves its worldwide customers with subsidiaries in the USA, Europe, Taiwan, Singapore, Korea, Hong Kong, and China.

PacTech-Packaging Technologies GmbH, established 1995 and a group company of NAGASE & CO., LTD., manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level bumping & packaging contract manufacturing out of Nauen, Germany (HQ), and through the 100% subsidiaries PacTech USA Inc., Silicon Valley, USA and PacTech ASIA Sdn., Bhd., Penang, Malaysia.

The pace of innovation in electronics is constantly accelerating. To enable customers to deliver life-changing innovations faster and become market leaders, we are committed to delivering the world’s most comprehensive portfolio of electronic design automation (EDA) software, hardware, and services.

We are an emerging leader in high performance, packageintegrated, power delivery solutions for high-performance computing (HPC), artificial intelligence (AI) and advanced networking devices. We use our expertise and forward thinking to enable a new paradigm in power delivery network design that will allow these and other emerging applications to realize their full potential.

Our wide range of advanced product offerings support multiple semiconductor processing steps including single-wafer and batch wet cleaning, electroplating, thermal deposition, stress-free polishing, PECVD, ALD, and track equipment.

We are as innovative of a company as we are homegrown.
Founded in Bavaria in 1961, we have since grown into one of the largest globally distributed commercial adhesives manufacturers.

SETNA is the exclusive distributor for SET Device Bonders and Ontos Atmospheric plasma equipment in North America. SET has been the world leader in flip chip bonding since 1981 and has the most accurate and most flexible platforms in the world.  

Evatec offers a range of batch, cluster and inline platform
architectures equipped with evaporation, sputter, etch and PECVD source technologies according to application, substrate format and throughput requirements.  

MacDermid Alpha supplies leading-edge technologies that enable the highest-end device designers and manufacturers to meet the evolving and demanding needs of the semiconductor industry.  

Globally headquartered in Singapore, ASMPT is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, with a truly unique, broadbased portfolio that sets us apart from others.  

Heraeus Electronics is a leading manufacturer of materials for the assembly and packaging of devices in the electronics industry. The company develops material solutions for the automotive, power electronics and advanced semiconductor packaging market and offers its customers a broad product portfolio - from materials and material systems to services.  

TechSearch International, Inc. has a 36-year history of market and technology trend analysis focused on semiconductor packaging, materials, and assembly. The company provides market and technical analysis identifying key inflection points in advanced packaging technology.  

Neutronix-Quintel (NxQ) is the premiere US-based supplier of mask aligners and related photolithography equipment. From our corporate headquarters in CA to our production site in MA, we design, build and ship world-class mask aligners for Advanced Packaging, MEMS, Compound Semiconductors and many other applications around the world.

Metalor Technology USA, a part of Tanaka Precious Metals
family is uniquely positioned as the only global source of precious metal commodities and plating solutions with manufacturing sites and refineries throughout US, Asia, and Europe.

With a 45 year + heritage Micross Components began transforming specialty electronics by creating a global company with the broadest offering of products and services in the industry and quickly became recognized as the leading worldwide single-source supplier of specialty microelectronic components designed and manufactured to the highest quality standards.

Our objective is simple: solve your complex component assembly challenges. Promex has a long history in Silicon Valley dating from its founding in 1975.

Finetech’s high accuracy die bonding equipment supports the most precise and complex applications in advanced packaging, die attach and micro assembly. Sub-micron placement is possible with an extensive range of bonding technologies including thermocompression, ultrasonic, eutectic, epoxy, sintering, ACF/ACP, Indium, and precision vacuum die bonding.

Solutions, across the board. Henkel’s comprehensive LOCTITE®, TECHNOMELT®, and BERGQUIST® brand product portfolio comprises a variety of advanced formulations designed to support electrical connections, circuit assembly, ensure structural stability, provide essential protection, and facilitate efficient heat transfer,
all aimed at ensuring dependable and reliable performance across industries.