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Device Packaging 2025

The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. It is an international event organized by the International Microelectronics Assembly and Packaging Society and a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals. The 2025 conference will feature 4 keynote presentations, technical sessions on Heterogeneous: 2D and 3D Integration/Emerging Technologies/Fan-Out, Wafer/Panel Level & Flip Chip Packaging, an embedded Global Business Council Plenary Session, an interactive poster session, an evening panel discussion, and more.

General Chair:
Amy Lujan, SavanSys

General Chair-Elect:
Jason Rouse, Taiyo America, Inc.

Past General Chairs:
Scott Hayes, NXP
Nokibul Islam, JCET Group

  DPC 2025 will be co-located with the IMAPS Advanced Packaging for Medical Microelectronics Workshop  which kicks off with a combined poster session on Wednesday evening, March 5 and runs through Friday, March 7.
Building on Our 2024 Success

With a record attendance of nearly 800 attendees (16% growth) including 220 participants locally from Arizona, it’s no surprise as there is a tremendous amount of advanced packaging activity in Arizona these days. We were thrilled to see close to 100 students, many from Arizona State University, attending the Professional Development Courses and conference sessions, as well as networking and making connections with industry experts. The bustling exhibit hall was once again sold out with 66 exhibitors.

Based on the success of 2024, IMAPS Device Packaging Conference will be at a new location that can accommodate more session rooms, exhibits and hotel rooms. We look forward to hosting Device Packaging 2025 on March 3-6, at the Sheraton at Wild Horse Pass in Phoenix, Arizona, a beautiful resort setting 14 miles south of Sky Harbor Airport.

Call for Abstracts - Submit Today
Overall Technical Program

LAST CALL TO SUBMIT ABSTRACTS - ONLINE SUBMISSION SITE CLOSING SOON! 
Abstracts will be accepted along 3 technical track areas.  Those wishing to present their work at the Device Packaging Conference must submit a 500+ word abstract electronically using the on-line submission system at www.devicepackaging.org   No formal technical paper is required. A two- to six-page concise summary ("extended abstract") with text (figures and graphs included if necessary) will be required for the abstract booklet on January 31, 2025. A post-conference DOWNLOAD containing the full presentation material as supplied by authors will be emailed after the event to all attendees. Please contact Kristie Bowman by email at kbowman@imaps.org if you have questions. Learn More

Heterogeneous: 2D and 3D Integration
 The objective of this Technical Track is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and industry from around the world who have been working in the area of Heterogenous Integration required high density technologies. This track has been organized to allow for the presentation and debate of some of the latest advancements in Heterogeneous Integration technologies, both 2D and 3D.  This will bridge the gap between the back-end, wafer-level 3D integration and 2D Heterogeneous packaging, covering interposer-based products, both through-silicon-via (TSV) and High Density Fan-Out (HDFO), package-on-package (PoP), wafer-to-wafer, and die-to-wafer 3D approaches. Sessions will also address PCB based packaging approaches, like embedded die, embedded passives and advanced ultra-fine line wiring on substrates for RDL formation. Learn More

Emerging Technologies
Emerging technologies present unique packaging challenges, requiring innovative solutions. The topics of focus in this track are: Thermal, Automotive/High Reliability, Glass, Photonics/Optoelectronics, MEMS/Sensors, Additive Manufacturing, mmWave/RF, and 5G/6G/High Frequency. With the right packaging, these technologies could change the world. Learn More

Fan-Out, Wafer/Panel Level & Flip Chip Packaging
The objective of the Fan-Out, Wafer/Panel Level & Flip Chip Packaging Track is to have a unique forum that brings together scientists, engineers, and business professionals from commercial and R&D sectors around the world to discuss the most recent developments in flip chip and wafer level packaging, including panel-based processes. Learn More

SUBMIT YOUR ABSTRACT

 

DPC Speaker Informationbook your hotel (same venue as conference)Contact Us

“2025 will be an exciting year for Device Packaging. To kick off the conference’s third decade, we’re in a new location that gives us room to grow our exhibit hall and technical program. In addition to our popular tracks focused on 2D/3D heterogeneous integration, flip chip, and wafer-level packaging, there will be a greater focus on emerging technologies and applications that are driving advancements in packaging.”

Amy Lujan
SavanSys

PROFESSIONAL DEVELOPMENT COURSES

Professional Development Courses are supplemental 2-hour classroom-style tutorials with a narrow educational focus taught by the best in advanced packaging, with an industry perspective. The topics offered at Device Packaging 2025 are designed to help attendees broaden their scope of knowledge. 

These courses are offered on Monday, March 3, prior to Device Packaging 2025. Attendees must register for each course as an add-on to their overall symposium registration and (selecting no more than one course in each time slot). 

Make sure to review your preferred course's time slot before registration. Course fees are non-refundable.
Visit the PDC page for abstract information.

 8:00am - 10:00am

PDC1:
Fundamentals of Substrates for High-Frequency Packaging & Heterogeneous Integration (Part 1)
 Venky Sundaram, Habib Hichri, Ivan Ndip

PDC2:
Introduction to Chip Packaging Process and Materials 
Syed Ahmad

PDC3:
Wire Bond Physics & Process Optimization
Aashaish Shah

PDC4:
Co-Packaged Optics -Heterogeneous Integration of Photonic IC and Electronic IC
John Lau

10:30am - 12:30pm

PDC5:
Failure Analysis in Semiconductor Package Assembly
Tom Dory

PDC6:
Introduction to Fan-Out Wafer Level Packaging
Beth Keser

PDC7:
System-In-Package (SiP) - System Solutions through Miniaturization
Mark Gerber

PDC8:
Packaging Technologies, Materials and Applications of Antenna-in/on-Package
Ivan Ndip

1:00pm-3:00pm

PDC9:
Fundamentals of Substrates for High-Frequency Packaging & Heterogeneous Integration (Part 2)
Venky Sundaram, Habib Hichri, Ivan Ndip 

PDC10: 
Understanding the Cost of Fan-out Wafer Level Packaging
Amy Lujan

PDC11: 
Sensor Package: Heterogeneous Integration ante litteram
Marco Del Sarto

PDC12:
Introduction to Microelectronics and Semiconductors
Moody Dreiza

3:30pm - 5:30pm

PDC13: 
3D Package Technology and Assembly Processes
Tom Dory

PDC14: 
Advances in 2.3D Fan-out Wafer Level Packaging (FOWLP)
Beth Keser

PDC15:
The Evolution of Flip Chip Package Technology
Mark Gerber

PDC16:
Chiplet Design and Heterogeneous Integration Packaging
John Lau

Registration
We look forward to having you join us!
Member Rate
Before January 31, 2025
Member rate will increase to $950 beginning February 1. Lock in the lower rate now! 
$850
Register
Non-Member Rate
Before January 31, 2025
Non-Member rate will increase to $1,195 beginning February 1. Lock in the lower rate now! 
$1,095
Register
Speaker/Chair Rate
Before January 31, 2025
Speaker/Chair rate will increase to $695 beginning February 1. Lock in the lower rate now! 
$595
Register
Student Rate
Before January 31, 2025
Student Non-Member rate will increase to $350 beginning February 1. Lock in the lower rate now! 
$250
Register
PDC Classes (price per class)
Before January 31, 2025
PDC rate will increase to $425 beginning February 1. Lock in the lower rate now! 
$325 per PDC
Register

Exhibit/Sponsor

Device Packaging Exhibit and Technology Show

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging.
The Exhibit Hall is sold out for 2025!  Sponsor opportunities are still available. Email info@imaps.org for more information.

DPC 2025 Exhibitor Information

Meet our Sponsors

PO Box 14727, Pittsburgh PA 15234 | Email Us | 1-919-293-5000