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| CONFERENCE GENERAL CHAIRs |
CICMT General Chair
Soshu Kirihara, Joining & Welding Research Inst., Osaka Univ.
| | CICMT Past General Chair
Ammar Kouki, ETS (École de technologie supérieure)
Ulrich Schmid, TU Wien |
CICMT Technical Committee:
Hiroya Abe (Osaka University, Japan) | Paolo Colombo (University of Padova, Italy) | Fiona Spirrett (Osaka University, Japan) |
Jens Günster (BAM, Germany) | Minoru Osada (Nagoya University, Japan) | Alberto Ortona (SUPIS, Italy) | Hui-suk Yun (KIMS, Korea) |
Steve Dai, Sandia National Laboratories | Markus Eberstein, ASML | Heli Jantunen, University of Oulu | Daniel Krueger, Honeywell |
Jens Müller, Technische Universität Ilmenau | Uwe Partsch, Fraunhofer IKTS | Peter Uhlig, IMST |
| | | |
CICMT Conference Focus:
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in the technical program. The Ceramic Interconnect focuses on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems focus is on emerging applications and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.
Smart Additive Manufacturing, Design & Evaluation (Smart MADE) is recognized as a global discussion forum on Additive manufacturing and 3D printing technologies. These technologies are novel fabrication processes for advanced materials and components with multifunctional structures. In this approach, three-dimensional models are designed and created according to theoretical concepts using computer software, and two-dimensional cross sections are created by automatic slicing operations. In particular, computer aided design, manufacture and evaluation can be considered as smart additive processing. Various functional metal or ceramic components of dielectric or magnetic lattices to control electromagnetic fields, electrodes, or catalysts with large surface areas, and bio-materials components for medical applications, could also be developed. Large scale structural components for aerospace and other high temperature applications can be fabricated, without casting molds, with internal cooling path networks. This workshop focuses on superiority of design, efficient processing, and clear communication of results in the additive manufacturing and 3D printing processes.
Those wishing to present at the CICMT Conference must submit a 250 word abstract electronically, using the online submission form at: www.cicmt.org. A Final Manuscript of 4-8pages, two-column format is due 29 March 2024, for all accepted abstracts. Please send the final manuscript to kbowman@imaps.org
A Proceedings DOWNLOAD containing the submitted conference papers will be distributed to all attendees during the Conference, and a download of the speaker presentation slides will be sent following the Conference.
Proceedings papers will be assigned DOIs, archived into IMAPS Open Access Microelectronics Research Portal (www.IMAPSource.org), and fully citable. All papers will be presented and published in English. Speakers are required to pay a reduced registration fee. Selected papers will be invited to publish in IMAPS Journal of Microelectronics and Electronic Packaging or the International Journal of Applied Ceramic of ACerS after peer review.
Registration Fees & Information:
One registration fee provides access to both CICMT and Smart-MADE 2024. Registration fee also includes coffee & tea breaks, along with a lunch break.
*Registration and hotel reservations are now available to attendees on 10 December 2023 via the Nippon Travel Agency (NTA), Japan*.
Early: 60,000 JPY / $400.00 USD (until 12 March 2024)
Late: 70,000 JPY / $465.00 USD (until 12 April 2024)
Student: 30,000 JPY / $200.00 USD
BANQUET
The conference banquet will be held from 18:00-20:00 pm on 11th April 2024 in SALON AGOLA. This salon is located on the ninth floor of the conference venue, Osaka University Nakanoshima Center. The banquet fee is 10,000 JPY for one person, and it should be paid by 14:00 pm on 10th April 2024 through the registration site.
Hotel:
RIHGA Royal Hotel Osaka
5-3-68 Nakanoshima, Kita-Ku, Osaka 530-0005 Japan
