Advancing Microelectronics Magazine

IMAPS revealed an exciting new facelift to our hallmark member magazine Advancing Microelectronics! After decades of mailbox delivery, the magazine moved to a purely interactive digital format starting in 2020.

The print publication of Advancing Microelectronics has already been complemented by publication in the exclusive IMAPSource digital archives for several years. The archived version of each issue will remain accessible to members and nonmembers alike, but the primary delivery of the magazine is shifting to a new, highly interactive platform with enhanced tools for authors, readers, and advertisers.

This long overdue change is timely for our signature publication, but the value of IMAPS membership is rooted in connections. We believe that the enhancements ushered in by this format will improve the quality of our members’ connections to the industry, only adding to the member experience. We look forward to hearing your impressions of the new Advancing Microelectronics.

Interested in advertising or publishing a technical article in an upcoming issue? Contact info@imaps.org with questions and interest.

YOU CAN EXPECT:

Expanded technical content no longer subject to the restraint of page limitations
More cost-effective marketing and product promotions for our corporate members
Interactive content such as videos, event registration links, and direct connections to advertisers
OPEN ACCESS, and enhanced electronic readability

Browse the Issues

2024 Issues (Volume 51):
	Wire Bonding and Interconnect Materials Vol. 51, No. 5 Inside the Issue: Metastable Fine Grain Cu... Fine Gold and Coated-Ag Bonding Wire... Advanced 3D Integrated Circuit... Cause and Prevention of Large Void... Gas-free and Nano... Click here to read the Wire Bonding Issue!
	IMAPS 2024 Boston "Show Issue" Vol. 51, No. 4 Inside the Issue: IMAPS 2023 "Best of Track" Proceedings Papers: Optimized Die Preparation and Handling... Reliability Assessment of Indium Micro Bumps... Glass-Core Substrates for RF Heterogeneous... Study on the Manufacturability of XDFOI Package... Click here to read the IMAPS 2024 Boston Issue!

	Chiplets Vol. 51, No. 3 Inside the Issue: High Density Organic Substrates for Chiplet... Production Test Challenges & Simplification for Multi-Chiplet... Harnessing the Power of Chiplet Design... Click here to read the Chiplets Issue!

	Advanced Packaging for Power & High Temperature Vol. 51, No. 2 Inside the Issue: Investigations of Selected Influencing Process... Factoring Interacting Stress Mechanisms... Additive Prototyping... Investigation and Evaluation of High-Temperature... Recent Progress in Extreme Environment... Click here to read the Power & High Temp Issue!

	Device Packaging 2024 "Show Issue" Vol. 51, No. 1 Inside the Issue: Scalable Core Package for Power Module... Heterogeneous Packaging Technologies... Click here to read the Device Packaging Show Issue!

2023 Issues (Volume 50):
	The Future Advanced Packaging Workforce - Student Talent in our High Schools and Universities Vol. 50, No. 4 Inside the Issue: Conformal Silver Films... Stereolithographic Process... Adaptive Frequency Sampling... Click here to read the Future of Packaging Issue!

	IMAPS 2023 San Diego "Show Issue" Vol. 50, No. 3 Inside the Issue: Electromigration Risk Assessment... Impact of FCBGA Substrate... A Novel Hybrid Method to Integrate Delicate MEMS... Click here to read the IMAPS 2023 Show Issue!

	Heterogeneous Integration Vol. 50, No. 2 Inside the Issue: Heterogeneous IC Packaging... Assembly Solutions... DFT for Multi-Die Designs... Click here to read the Heterogeneous Integration Issue!

	Device Packaging "Show Issue" Vol. 50, No. 1 Inside the Issue: A Novel 2D/3D X-ray Microscopy... Advanced Glass Carriers... Incorporating Hierarchical Construction... Addressing Advanced IC Substrate... Click here to read the Device Packaging Show Issue!

2022 Issues (Volume 49):
	Chiplets Vol. 49 No. 6 Inside the Issue: State-of-the-Art and Outlooks for 2.3D IC Integration... Why the Packaging Community Needs to Embrace Assembly Design Kits... The Evolution of Moore’s Law Through Chipletized Architectures... Click here to read the Chiplets Issue!

	Advanced Packaging Processes and Materials Vol. 49 No. 5 Inside the Issue: How to Tailor Immersion Tin Plating for IC Substrate Applications.. Electrochemical Plating System Development of Nanotwinned Cu... Build-Up Materials with Low Insertion Loss/Fine Pitch Wiring... Photo-Imageable Dielectrics Enabling Structured MEMS... Click here to read the Materials Issue!

	IMAPS 2022 Boston - Show Issue Vol. 49 No. 4 Inside the Issue: Implementation of Trusted Manufacturing & AI-based Process... Ultrasonic Wire Bond Outlier Classification... Click here to read the IMAPS 2022 Issue!

	On-shoring of Packaging and Assembly Vol. 49 No. 3 Inside the Issue: State-of-the-Art Heterogeneous... Transforming the Supply Chain... Bridging Domestic Supply and Performance... Heterogeneous Integration Manufacturing... Click here to read the On-shoring Issue!

	*SPECIAL ISSUE: Optical Technology Integration* Vol. 49 Special Issue (Spring 2022) Inside the Issue: Sustainable Bandwidth Scaling... Optical Interconnect Challenges... 3D Sensing Package... Click here to read the Optical Special Issue!

	System-in-Package Vol. 49 No. 2 Inside the Issue: Advanced Fanout... Heterogeneous Chiplet Design... 3D-IC Design Challenges... Warpage Simulation... Empowering Front-End Cellular Innovations... Click here to read the SiP Issue!

	Device Packaging Vol. 49 No. 1 Inside the Issue: Heterogeneous IC Packaging... Effect of Silicon BEOL... Thermal Interface Materials... Click here to read the Device Packaging Issue!

2021 Issues (Volume 48):
	Advanced Materials Vol. 48 No. 5 (September-October 2021) Inside the Issue: Advanced Low Df Dry Film... Advanced No-Clean Solder Paste... Design of Undeerfill Materials... Click here to read the Advanced Materials Issue!

	IMAPS 2021 Show Issue Vol. 48 No. 4 (July-August 2021) Inside the Issue: Technical Program and PDCs Keynote Presentations In-Person Live Agenda On-Demand Presentations Click here to read the IMAPS 2021 Show Issue!

	Medical Device Technology Vol. 48 No. 3 (May-June 2021) Featured Articles: Fine-Volume Adhesive Jetting - Trends, Applications, and Capability in Medical Electronics Medical Implants - Getting Smaller but Going Further RF Technology in a Complete Glass Package Click here to read the Medical Device Technology Issue!

	Advanced System-in-Package (SiP) Vol. 48 No. 2 (March-April 2021) Featured Articles: Advanced Packaging and its Characterization for 5G mmWave Antenna in Package Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration 2-High Stacked Heterogeneous System-in-Package (HSIP) Modules Using Solder Assembly Solder Paste Attributes for System-in-Package (SiP) Assembly Click here to read the SiP Issue!

	Device Packaging "Show Issue" Vol. 48 No. 1 (January-February 2021) Featured Articles: Adaptive High Density RDL Technologies for Panel Level Packaging Fluxless Bonding Via In-Situ Oxide Reduction Advancements and Integration of Thin Glass Solutions Click here to read the Device Packaging Issue!

2020 Issues (Volume 47):
	Heterogeneous Integration Issue Vol. 47 No. 6 (November-December 2020) Inside: 48V Ecosystem and Power Packaging Trends High-Density Heterogeneous Integration for Implantable Electronic Systems An Ultra-Compact Transit Module through Additive Manufacturing Click here to read the Heterogenous Integration Issue!

	Advanced Materials Issue Vol. 47 No. 5 (September-October 2020) Inside: Challenges in Fine Feature Solder Paste Solder Paste for SiP Thermal Materials for Packaging Power Click here to read the Advanced Materials Issue!

	IMAPS 2020 Show Issue Vol. 47 No. 4 (July-Aug 2020) Inside: Semi-additive Process-based Cu Wirings Ferrites in Transfer Molded Power SiPs A Flexible Down-Converter for Satellite Communication Click here to read the Show Issue!

	Advanced SiP Special Issue Vol. 47 No. 3 (Summer 2020) Inside: How AiP Technology Helps Enable 5G Heterogeneous Integration Technologies Click here to read the Advanced SiP special issue!

	Prior issues will be added to the site soon.