| | Welcome to the International Microelectronics and Packaging Society, the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Worldwide, IMAPS offers educational and networking opportunities for industry professionals, packaging organizations, and students through technical conferences and workshops, professional development courses, IMAPSource microelectronics packaging research library, and local chapters. Exhibitions market the latest product and service applications of the current technology.
The Society covers a wide-range of technologies and topics critical to microelectronics assembly and packaging, including: on-shoring, heterogeneous integration, fan-out wafer level packaging, 2.5D/3D technologies, system-in-package, photonics/optical, power packaging, CPI, package design/modeling, interconnects, wire bonding, flip chip, MEMS, sensors, packaging for 5g/6g, RF/wireless, signal/power integrity, advanced materials, substrates and more.
IMAPS memberships are available for Corporations, Individuals and Students and provide many valuable benefits: technical, educational and speaking opportunities, networking, event discounts, and the Advancing Microelectronics magazine. For corporations: branding, press releases, discounted advertising, Jobs Marketplace, company listing in Industry Guide, and more. History
Founded in 1967 as ISHM, then merging with the International Electronic and Packaging Society (IEPS) in 1996, the Society has over 50 years of networking, education, and publication history. |
