April 14-17, 2025 HOTEL ALBUQUERQUE AT OLD TOWN | 800 RIO GRAND BLVD. nw | aLBUQUERQUE, nm 87104 USA
Our High Temperature, CICMT, and Power Packaging Conferences come together for a great opportunity for you.....one location, one registration, and three times the content, networking, and learning! The 2025 conference will feature
combined plenary and keynote presentations, along with specific technical afternoon sessions.
Organizing Committee
HiTEC General Chair: F. Patrick McCluskey, University of Maryland CICMT General Chair: David Huitink, University of Arkansas APPE General Co-Chairs: Rita Mohanty, Henkel Corp. and Brian Rowden, Oak Ridge National
Laboratory
Call for Abstracts
Those wishing to present at the Conference must submit a ~250 word abstract electronically no later DECEMBER 15, 2024, using the online submission form available by clicking here. Notice of Acceptance will be January 13, 2025. An optional Final Manuscript of 4-8 pages, two-column format is due February 14, 2025, for all accepted abstracts.
Please contact Kristie Bowman by email at kbowman@imaps.org if you have questions. A Proceedings DOWNLOAD containing the conference papers will be distributed to all attendees during the Conference.
Speakers are required to pay a reduced registration fee.
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an International Conference on Advanced Packaging for Power Electronics on April 14-17 in Albuquerque, New Mexico. The Conference will bring together technologists from
a diverse collection of disciplines in power semiconductor packaging, application development, reliability, modeling, process development, thermal management, and advanced materials/manufacturing to support the next generation of power
electronics development. Attendees and Exhibitors will be exposed to a variety of power applications and packaging solutions from board level integration to power packaging for distributed energy systems to encourage cross pollination
and insight of current and emerging market challenges and opportunities for collaboration.
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic
interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical program. The Ceramic Interconnect track focuses
on cost effective and reliable high-performance ceramic interconnect products for extreme environments in the automotive, aerospace, lighting, solar, and communication industries. The Ceramic Microsystems track focuses on emerging applications
and new products that exploit the ability of 3D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Multilayer ceramic, thin film, tape casting, thick film hybrid, direct
write, and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design, and application opportunities.
HiTEC 2025 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International
Microelectronics Assembly and Packaging Society, HiTEC 2025 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues
from around the world working to advance high temperature electronics.
Hotel Albuquerque at Old Town 800 Rio Grand Boulevard NW Albuquerque, NM 87104 USA
Individuals may contact the reservations team directly at 866-505-7829 and provide the group code/name: Group Code: 202504HITEC Group Name: 2025 HiTECH/CICMT/Power Conference
