Onshoring Workshop

IMAPS Advanced Technology Workshop on


STRATEGIES TO REVITALIZE THE 

ON-SHORE  PACKAGING AND ASSEMBLY DEFENSE INDUSTRIAL BASE 

October 3, 2022

Hynes Convention Center
900 Boylston St
Boston, MA 02115

www.imaps.org/onshoring

Co-located with IMAPS 2022 Symposium.

General Co-Chairs:

Jim Will, SkyWater Technology

Chris Riso, Booz Allen Hamilton Inc.

Organizing Committee:

Anthony BednarzLockheed Martin | Brandon Hamilton, Booz Allen Hamilton Inc. |

Mark Dimke, Sandia National Labs | Dave Shahin, Northrop Grumman

Speakers by Invitation Only

Overview:  The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve On-Shore Packaging and Assembly Capabilities on Monday, October 3, 2022, at the Hynes Convention Center, Boston, Massachusetts. This workshop will be followed by the IMAPS 2022 Symposium, October 3-6 at the same location. The mission of this workshop is to engage our workforce community to identify solutions, which address US Government and Defense requirements, critical to the onshoring of the microelectronic assembly and packaging supply chain.

Please view the Technical Program below which features: a SHIP keynote speaker and SHIP program speakers, plus several breakout sessions with speakers focused on Substrates & Materials Manufacturing, Enabling & Disruptive Technologies, Reliability, and Heterogeneous Integration, as well as two panel sessions on the Defense Industrial Base (DIB) Ecosystem, and Workforce Development.

.

MONDAY, OCTOBER 3
7:00am-5:30pmRegistration Open
7:00am-8:00amBreakfast
8:00am-8:15amOpening Remarks: Workshop Chairs     (Hynes Convention Center Room 210)
SHIP SESSION
KEYNOTE & SHIP SESSION

Session Chair: Chris Riso, Booz Allen Hamilton Inc.

8:15am-8:45am
KEYNOTE: DoD’S STATE-OF-THE-ART (SOTA) HETEROGENEOUS INTEGRATED PACKAGING (SHIP) PROGRAM

Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics 

8:45am-9:10am
SHIP DIGITAL

John Sotir, Intel

9:10am-9:35am
SHIP RF

Ted Jones, Qorvo

9:35am-10:00amThe Evolution of Moore's Law through Chipletized Architectures 
Tony Trinh, Mercury Systems
10:00am-10:30amSHIP SESSION Q&A 
10:30am-11:00amBreak
11:00am-12:00pm

PANEL DISCUSSION: DEFENSE INDUSTRIAL BASE (DIB) ECOSYSTEM
Moderator: Jim Will, SkyWater Technology     (Hynes Convention Center Room 210)


Panelists:
Helen Phillips, Northrop Grumman – Director Advanced Operations
Anthony Bednarz, Lockheed Martin – Engineering Project Manager, Advanced Sensors
Susan Trulli, Raytheon Technologies, RMD Advanced Microelectronics Solutions, Principal Engineering Fellow

Jim Vandevere, BRIDG

12:00pm-1:00pmLunch
SESSIONSSESSION 1: SUBSTRATES & MATERIALS MANUFACTURING
Session Chair:
Dave Shahin, Northrop Grumman

     (Hynes Convention Center Room 210)

SESSION 2: ENABLING & DISRUPTIVE TECHNOLOGIES
Session Chair:
Anthony Bednarz, Lockheed Martin

     (Hynes Convention Center Room 206)

1:10pm-1:35pm

Organic Substrate Process and Commercial Practices
Tomoyuki Yamada, Kyocera

Co-Packaged Optics (CPO) of Silicon Photonics Optical I/O Chiplet
Steve Groothuis, Ayar Labs 
1:35pm-2:00pm
Advances in Glass Interposers for (Beyond) 5G mmW Communications

Madhavan Swaminathan, Georgia Tech

Design and Manufacturing for Additive and Flexible Electronics
Patricia Beck, NextFlex

2:00pm-2:50pm

Panel Discussion: Onshoring Advanced Substrates & Materials
Meredith LaBeau, Calumet Electronics;
Habib Hichri, Ajinomoto USA;
Mike Gleason, GreenSource Fabrication;
Jim Haley, EMD Group;
John Swanson, MacDermidAlpha
2:00pm-2:25pm
Wafer Scale 3DHI for Next Generation RF Electronics

Jeff Herd, MIT Lincoln Laboratory



2:25pm-2:50pm
Heterogenous Electronic and Photonic Multi-Chip Module Platforms

Dave Kharas, MIT Lincoln Laboratory

SESSIONSSESSION 3: RELIABILITY
Session Chair:
Brandon Hamilton, Booz Allen Hamilton, Inc.

     (Hynes Convention Center Room 210)

SESSION 4: HETEROGENEOUS INTEGRATION
Session Chair: 
Mark Dimke, Sandia National Labs.

     (Hynes Convention Center Room 206)

2:50pm-3:15pmAdvanced Packaging Needs and Issues in Perspective of High-reliability Space Applications
Eric Suh, NASA JPL 
When Chips Become Systems
John Park, Cadence 
3:15pm-3:40pmLow Volume, High Mix R&D and High-Reliability Production
Scott List, Sandia National Labs.
Heterogeneous Integration of III-V Devices:  Successes and Challenges
John Lannon, Micross
3:40pm-4:05pm
Design for Manufacturing: Package Design Cleaning Compatibility for High Reliability Electronic Assembly
Tim Pearson, Collins
Establishing Domestic Heterogeneous Integration Capability

Alan Huffman, SkyWater Technology; Tim Olson, Deca Technologies

4:05pm-4:30pmBreak
4:30pm-5:30pm

PANEL DISCUSSION: WORKFORCE DEVELOPMENT     (Hynes Convention Center Room 210)
Moderator: John Lannon, Micross

Panelists:

Jim Vandevere, BRIDG
Darren J. Crum, Naval Surface Warfare Center, Crane Division
Jerry Roberson, Northrop Grumman

5:30pmClosing Remarks
5:30pm-7:00pmWELCOME RECEPTION
with IMAPS 2022 Symposium
All Workshop Attendees Invited!

     (Hynes Convention Center 2nd Floor Boylston Hallway)

ONLINE REGISTRATION OPEN

There are two ways to register for the Workshop on On-shoring.

  • On-shoring Registration Only – If you will only be attending the Workshop on On-shoring on October 3, click here to register.
  • On-shoring plus IMAPS 2022 Symposium Registration – If you register for both the Workshop on On-shoring and IMAPS 2022 Symposium, you receive a $150 discount on the On-shoring registration (students receive $25 discount). Please note that Professional Development Courses (PDCs) are the same date and time of On-shoring, so you will not be able to register for PDCs. Click here to register for both events.

HOTEL


Sheraton Boston Hotel
39 Dalton Street
Boston, MA 02199 USA
Single/Double: $259/night + taxes and fees

Hotel reservation deadline: September 2, 2022


CANCELLATION POLICY
Cancellations must be received 3-days (72 hours) prior to confirmed arrival date to avoid penalty fee equal to one night's room and tax. 





Booking in the Block

IMAPS sincerely appreciates your support by staying at the Sheraton Boston Hotel.  We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants. 

  • Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel

  • Easily accessible — staying in the host hotel means less travel time and overall convenience

REGISTRATIONAnchor  

ONLINE REGISTRATION OPEN for the following attendee registration categories. Early registration fees expire on September 2, 2022.

Registration TypeEarly (by Sept. 2)Sept. 3 and after
     Member$595$695
     Nonmember$795$895
     Speaker/Chair$395$495
     Student$100$150
Workshop Sponsorship (includes: 2 attendee registrations, full-page advertisement in program, logo/advertisement on event webpages, additional discounted full badges available to sponsors at $400/person)$3000
Break Sponsorship (includes: logo on event webpages & program, discounted full badges available to sponsors at $500/person)
$1200

There are two ways to register for the Workshop on On-shoring.

  • On-shoring Registration Only – If you will only be attending the Workshop on On-shoring on October 3, click here to register.
  • On-shoring plus IMAPS 2022 Symposium Registration – If you register for both the Workshop on On-shoring and IMAPS 2022 Symposium, you receive a $150 discount on the On-shoring registration (students receive $25 discount). Please note that Professional Development Courses (PDCs) are the same date and time of On-shoring, so you will not be able to register for PDCs. Click here to register for both events.