Device Packaging and Crossover Extravaganza Conferences Are Going Virtual



Two IMAPS Flagship Events are Going Virtual in Spring 2021
The International Conference on Device Packaging and the Technical Crossover Extravaganza will be hosted digitally in April 2021
 
 
RESEARCH TRIANGLE PARK, North Carolina, December 1, 2020:  The International Microelectronics Assembly and Packaging Society (IMAPS) has announced that it will deliver its first two spring 2021 events in virtual environments. The 17th International Conference on Device Packaging has been shifted to new dates and will be held April 12-15, 2021. The Technology Crossover Extravaganza will continue to be held on its originally scheduled dates of April 26-29, 2021. The crossover event features the International Conference on High Temperature Electronics (HiTEC), the IMAPS/ACerS 16th International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT), and the new Advanced Power Electronics Packaging Symposium (APEPS).

After continuing evaluation of the business, regulatory, and health impacts of COVID-19, the IMAPS Executive Council concluded that the safest and most successful spring events would meet our members and stakeholders where they are – at home.

“IMAPS has decided to move the spring conferences to virtual formats to protect the long-term health and safety of our community members,” shared IMAPS President Rich Rice. “Moving from face-to-face to online will allow schedule flexibility and the ability to connect with colleagues around the world. We look forward to these redesigned events and value our shared resilience.”

Preparations are under way to deliver these events in an engaging virtual atmosphere for attendees, speakers, and corporate partners. The calls for abstracts for these events have been extended through December 18th. Updated corporate partnership opportunities will be published in December, and registration details for prospective attendees will be announced in January.

Follow the links below for the most up-to-date information on the following affected events:

International Conference on Device Packaging (DPC 2021)

Technology Crossover Extravaganza Conferences:
International Conference on High Temperature Electronics (HiTEC 2021)
International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT)
Advanced Power Electronics Packaging Symposium (APEPS 2021)
 

For more information, please contact:

Michael O’Donoghue
Executive Director, IMAPS
modonoghue@imaps.org