3DI delivers a technology and innovation spotlight for engineers, researchers, manufacturers, and students across the microelectronics and advanced packaging sectors.  Content and media covers a variety of leading technologies, including device and chiplet packaging, advanced thermal solutions, AI driven packaging, 3D integration, heterogeneous integration, photonics/CPO, and next‑generation materials, to name a few.

3D InCites Now Powered by IMAPS ~ A Conversation About the Transition

Francoise von Trapp, Martijn Pierik and Jim Haley

In early 2026, IMAPS took over the "stewardship" of the trusted 3D InCites platform which was owned by Françoise von Trapp and her partner Martijn Pierik. Following Françoise’s retirement, the 3D InCites platform is now under the IMAPS portfolio, including its website, content library, and podcasts.  Francoise and Martijn talk about the 3DI journey from its beginning to a new chapter under the IMAPS umbrella.

3D InCites ~ IMAPS Vision for the Platform's Future

Eelco Bergman, Scott Hayes

Eelco Bergman (IMAPS VP of Marketing) and Scott Hayes (IMAPS Microelectronics Foundation Director) discuss the future vision for the 3D InCites media content platform, as well as the 3D InCites Scholorship Program for students.  

Learn more about the new IMAPS Corporate Member benefits offered on the 3DI website (profile, press releases, spotlights, and more)

Contact Adrienne Gerard if you are interested in contributing content to the 3DI platform.

Visit the 3D InCites website

What happens when AI diagnoses patients better than doctors? Where does artificial intelligence truly stand on the hype cycle? Is all this computational power actually benefiting society? These critical questions frame our fascinating discussion recorded live at IMAPS Device Packaging Conference in Phoenix, Arizona.

Join our expert panel featuring Hemanth Jagannathan (IBM Research), Mark Kuemerle (Marvell), and Kimon Michaels (PDF Solutions) as they tackle AI's most pressing challenges and opportunities. Their collective expertise reveals surprising insights about how AI is transforming industries while raising important considerations about its implementation.

The conversation explores AI's evolution from specialized technical applications in semiconductors to today's consumer-facing generative tools. Our experts draw fascinating parallels between AI and previous technological breakthroughs like laser technology, suggesting we've only scratched the surface of potential applications. They provide compelling examples from healthcare where AI systems demonstrate superior diagnostic capabilities by processing complex datasets beyond human capacity.

While acknowledging concerns around data accuracy, power consumption, and appropriate boundaries, the panel remains optimistic about AI's future. They emphasize that today's implementations represent merely the beginning of a transformative technology whose full impact remains largely unanticipated. Yet they also agree on applications where human judgment should remain primary – including, amusingly, matchmaking.

Dive into this thought-provoking conversation to understand why organizations must either leverage AI effectively or risk being outpaced by competitors who do.

~ Amy Lujan of SavanSys Solution (General Chair)

~ Tim Olson of Deca Technologies (Co-General chair of the Global Business Council session)

~ Jan Vardaman of TechSearch (Moderator for evening panel: "Preparing for the Coming AI Winter?")

DPC 2025 will be held March 3-6 in Phoenix, Arizona.

At IMAPS Symposium 2024 in Boston, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it’s very special to receive one, as it means many members have noticed their efforts. 

In this episode, Françoise von Trapp sits down with three of the award winners to talk about their IMAPS experience, at different stages of their careers.

Emma P Pawliczak was awarded the Steve Adamson Student Award. She is currently getting her Ph.D. at Binghampton University. 

Brandon Hamilton won the Emerging Leader Award, is a program manager at BAE Systems in Cedar Rapids Iowa

Dr. Phil Garrou won the Lifetime Achievement Award. He is an Advanced Packaging subject matter expert for DARPA and the DoD through his consulting company Microelectronic Consultants of NC (MCNC).  

Click to learn more about 3D InCites

This episode was recorded live at the IMAPS International Symposium in Boston MA.  Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD. 

Dev Palmer explains Chips Act's funding distribution and its impact on the semiconductor ecosystem. He emphasizes the importance of bridging research and industry and describes some of the programs key initiatives. Palmer highlights the need for collaboration across large and small businesses, academia, and nonprofits to achieve the Chips Act's ambitious goals, and shares the details of the recently announced Small Business Innovation Research (SBIR) program under the Biden Harris administration.

 Sandeep Sane, Head of Packaging at LightMatter, discusses the role of 3D optical integration in extreme compute scaling. He highlights the challenges in integrating silicon photonics into chip designs to provide high bandwidth at lower power, essential for AI and data centers. You’ll learn how 3D stacking addresses memory and logic competition on chips; and how chiplet-based architectures improve performance but increase power consumption. 

Craig Bishop of DECA and Brett Wilkerson of AMD discuss the evolution and applications of Redistribution Layer (RDL) packaging, particularly in high-performance computing and AI. They also highlightthe role of AI in enhancing packaging design and the future of AI applications, emphasizing the need for both centralized and edge computing to balance performance and power consumption.

In this podcast episode, Tarak Railkar (General Chair) and Benson Chan (General Chair Elect 2025) join Françoise von Trapp for a preview of the IMAPS International Symposium 2024, which takes place in Boston from September 30 to October 3, 2024. 

This year's symposium focuses on heterogeneous integration for paradigm-shifting microelectronics and photonics. It will feature a five-track technical program, special interactive sessions on onshoring, keynote speakers by industry leaders, and much more.  The symposium will also host a Bingo networking event to promote DEI, a career fair, student poster sessions, and off-site tours to MIT and MRSI Systems. 

Listen in to learn about:

The benefits of volunteering for IMAPS 
Networking and career opportunities 
The speaker and panel line-up

Visit the Symposium event page for program and registration.

Market Scale’s recent EXPERTS TALK roundtable “Training New Semiconductor Manufacturing Professionals is Key to Meet Coming Domestic Manufacturing Demand” explored the key question: What does the industry need to support the next generation of professionals, and where are the talent gaps? With the CHIPS Act expected to triple domestic semiconductor manufacturing capacity by 2032, the need for a skilled workforce is more urgent than ever.
 
Host Daniel Litwin talked with Beth Keser, Ph.D., former IMAPS President and VP of Manufacturing Technology at Zero ASIC; Rob Picken, SVP of Digital Transformation at Sourceability; Gustavo Sepulveda, Process Automation Business Head at Panasonic Connect North America; and Mark Granahan, Co-Founder and CEO of iDEAL Semiconductor.
 
"The CHIPS Act is making great strides in increasing semiconductor and packaging infrastructure and R&D in the USA. At IMAPS, we want to make sure packaging education for our future workforce is not forgotten." ~ Beth Keser, Ph.D.

		Thank you InBusiness Phoenix Magazine for publishing this article about the IMAPS Device Packaging Conference and it's increasing growth and success over the past 20 years. We are thrilled to host this event in the Phoenix area where the semiconductor industry is experiencing tremendous growth, expansion and opportunity! In March 2024, we will move to a larger venue with more meeting space and hotel rooms at the Sheraton at Wild Horse Pass in Phoenix, AZ.

The International Microelectronics Assembly and Packaging Society’s (IMAPS) recent Device Packaging Conference 2024 recently marked a significant milestone, not only celebrating its 20th anniversary this year with a record-breaking turnout but also upping the ante on Arizona’s booming semiconductor industry. Held in Fountain Hills, Arizona, the event saw a significant increase in attendance, with 762 participants, marking a 16% rise from the previous year and setting a new high in DPC’s 20-year history.

Arizona’s flourishing semiconductor industry played a pivotal role in this achievement, with 220 local participants showcasing the region’s vibrant advanced packaging activities. Notably, more than 50 students, many from Arizona State University, actively engaged in professional development courses, conference sessions, and networking opportunities with industry experts. Furthermore, 115 attendees, entirely new to IMAPS, joined as new members, demonstrating a growing interest and commitment to the industry’s development.

Click HERE to read the rest of the article.

3D InCites Podcasts

These podcast episodes were recorded live at IMAPS Device Packaging in Fountain Hills, AZ

The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law: Conversations

Several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. 

Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company, IBM and Hemanth Dhavaleswarapu of AMD, about chiplet application drivers, such as artificial intelligence. She then talks to Pooya Tadeyon, of Intel, to find out why we are moving to advanced packaging, and particularly chiplet architectures, to enable the future of Moore’s law. 

IMAPS Global Business Council: Repatriating the U.S. Semiconductor Ecosystem

The Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Françoise von Trapp speaks with representatives of the government, industry, and academia.

Dan Berger, National Advanced Packaging Manufacturing Program (NAPMP)
Zachary Holman, Arizona State University
Mark Litecky, Skywater 

Francoise von Trapp

Did you know that the Device Packaging Conference is turning 20 years old this year? The conference takes place March 19-21, in Fountain Hills, AZ.

To celebrate, Françoise von Trapp (3D InCites), Scott Hayes (General Chair) and Amy Lujan (General Chair Elect 2025) took a trip down memory lane in the latest 3D InCites podcast episode.

Listen in to find out:

~ Where the first-ever event was held and how many speakers participated
~ How DPC differs from the annual International Symposium
~ What topics this year's event will focus on
~ The keynote and GBC and panel topics
~ All the different networking and fundraising efforts 

"From wire bond to flip chip, fan-out to 2.5D interposers, and 3D ICs to chiplet architectures, IMAPS 2023 delivered the latest industry trends and technology advancements. Whether you were there to attend the sessions, check out what the exhibitors were showcasing, or catch up with colleagues, you did not leave empty-handed, but with a wealth of knowledge and inspiration...." read more HERE

Written by Phil Garrou

Chiplet-based system using an interposer. (Source: Cadence)

The week of July 10th IMAPS held its now annual reshoring conference jointly with the IPC.

We discussed the overall program agenda of the restoring conference in detail in IFTLE 559. As we discussed, attendance was set up for US / Canadian citizens only and included key members of the government agencies supporting advanced packaging reshoring, and the Defense Industrial Base (DIB), i.e users of the advanced packaging technologies and US-based outsourced semiconductor assembly and test service providers whose technologies are available to the DIB and the DoD. Presentations were by invitation of the committee.

On Monday afternoon we held two discussion groups on topics that we felt needed open group discussion: Namely chiplets and advanced substrates. The former was headed up by John Park of Cadence and Bob Patti of NHanced Semiconductor, and the latter by Jan Vardaman of TechSearch International, Inc. and Matt Kelly of the IPC.

The reshoring conference format was a new concept proposed by General Chair Crum, who suggested we not have the traditional panel sessions during which the panelists use up most of the time focusing on their pet topics and the audience asks very few questions. We sought to have two experts lead the conversation, but the topics discussed over these two-hour sessions were driven by the audience who had a chance to ask questions, challenge concepts and clarify their understanding of these topics.

Read the full article on 3DInCites