Rapidus to Produce 600mm × 600mm Large-Format RDL Panels

Rapidus recently underscored its bold decision to take on the challenge of producing 600mm × 600mm large-format RDL panels by leveraging display manufacturing technologies. Rapidus is developing 600-mm square ultra high-density interconnect panel-level packaging as an industry-leading carrier-substrate format for panel level parallel processing of multiple packages, aiming for interposer manufacturing with high throughput, lower cost and high reliability.

To support its packaging initiatives, Rapidus is building a cleanroom at the Seiko Epson Chitose facility in Chitose City, Hokkaido, and launched a back-end R&D hub called Rapidus Chiplet Solutions (RCS). There, Rapidus will enable 2-nm-generation semiconductor chiplet package design and manufacturing technology development, including mass-production technologies for chiplet packaging with automation. RCS will install pilot lines supporting flip-chip ball grid array (FCBGA), Si interposer, RDL and hybrid bonding processes, in addition to conducting R&D on mass-production methods including equipment automation

The mission is clear: Rapidus is redefining what Japanese manufacturing can achieve on a global stage.

Expert engineers ensure reliability and scalability with in-depth process knowledge and hands on-experience with semiconductor components. AmTECH specializes in process development, and manufacturing services for high end applications such as telecommunications, LiDAR, medical devices, and quantum computing.

Fully automated die bonding and dispensing systems
for microelectronics and optoelectronic packages with world-leading
flexibility, speed, accuracy and reliability

A trusted partner to the creators of tomorrow's products

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Introduction
Recently, WIN SOURCE, a leading global distributor of electronic components, achieved the 16th spot in the Top 50 Global Electronic Component Distributors list for 2024, as announced by Supply Chain Connect. This marks a two-place improvement from last year, symbolizing WIN SOURCE's outstanding performance and continuous growth in the industry, further solidifying its leadership position in the global market.

Since its inception in 1999, the company has been dedicated to providing high-quality electronic components and top-tier supply chain solutions to its clients. With a finely managed global supply chain network, WIN SOURCE effectively supports the electronic component demands of industries including smart devices, automotive electronics, 5G communications, the Internet of Things, and aerospace.

Leading Supply Chain Advantage
As a frontrunner in global electronic component distribution, WIN SOURCE boasts significant supply chain strengths. The company utilizes advanced data analytics and market insights to optimize inventory management and logistics, ensuring a stable and reliable product supply amidst market fluctuations and uncertainties. Moreover, through its intelligent supply chain system, WIN SOURCE enhances collaborations with suppliers, optimizing resource allocation for maximum efficiency.

Streamlined Procurement Process
At WIN SOURCE, customers can find solutions for common, obsolete, scarce, or discontinued products. By simply submitting a BOM (Bill of Materials) through WIN SOURCE's one-stop shopping platform, the company promptly responds with the required electronic components. This service liberates customers from concerns about market cycles, allowing them to focus more on technological innovation.

Comprehensive Supply Chain Solutions
WIN SOURCE offers an array of business solutions, encompassing global procurement, end-of-life management, cost control, shortage management, alternative solutions, and surplus inventory management. These solutions help clients effectively tackle various challenges within the supply chain, ensuring continuous production and swift market responses. Thanks to our global supply chain system and smart data solutions, WIN SOURCE addresses information asymmetries in electronic component procurement within the supply chain. With digital transformation, the company has integrated global supply chain data, enhancing visibility and transparency. Our real-time inventory monitoring system and advanced supply chain strategies optimize inventory management and supply chain efficiency, providing practical solutions for a wide range of customers, including EMS and OEMs in the electronics industry.

Upholding Core Values, Driving Service Innovation
WIN SOURCE's success is rooted in its core values: "Customer First," "Innovation Driven," and "Win-Win Cooperation." CEO Ethan Tsai stated, "Our leadership position is due to our continual innovation in supply chain strategies and technology-driven solutions. We are committed to delivering exceptional value to our customers." Through these values, the company not only optimizes service processes but also focuses on enhancing customer experiences. WIN SOURCE maintains close contact with its customers, actively responding to their needs and providing personalized solutions to ensure the efficient progress and success of their projects.

Conclusion
Looking ahead, WIN SOURCE will continue to strengthen collaborations with global manufacturers and suppliers, expanding its product lines and services. The company will also keep enhancing its supply chain management system and market expansion efforts to capture a larger market share with a more comprehensive product portfolio and more efficient services. Through ongoing efforts and innovation, WIN SOURCE is confident in maintaining its leadership in the global electronic component distribution sector, driving the continuous development of the electronics industry and creating greater value for its customers.

Advanced packaging advances next wave of innovation in global chips manufacturing

Tempe, Arizona - March 19, 2024
Arizona State University (ASU) and Deca Technologies (Deca), a premier provider of advanced wafer- and panel-level packaging technology, today announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.

The new Center for Advanced Wafer-Level Packaging Applications and Development is set to catalyze innovation in the United States, expanding domestic semiconductor manufacturing capabilities and driving advancements in cutting-edge fields such as artificial intelligence, machine learning, automotive electronics and high-performance computing.

The center will combine state-of-the-art advanced-packaging technology, equipment, processes, materials, expertise and training, fostering the development of new capabilities from proof of concept to pilot scale. ASU is the first university implementation of Deca’s M-Series™ fan-out and Adaptive Patterning® technologies under the Microelectronics Commons, a network of regional technology hubs coordinated to deliver on projects requested by the Department of Defense as part of the CHIPS and Science Act, the federal legislation which aims to expand America’s global leadership in microelectronics.

The new center will include integration with the university’s MacroTechnology Works center at ASU Research Park in Tempe and will provide enhanced capability that will advance projects within the ASU-led Southwest Advanced Prototyping (SWAP) Hub, part of the Microelectronics Commons.

“This is at the heart of the next generation of innovation in microelectronics and everything it enables,” said Zak Holman, vice dean for research and innovation for ASU’s Ira A. Fulton Schools of Engineering. “Deca has developed a unique technology, and ASU brings extraordinary capacity that will provide the resources to leverage Deca’s technology in ways that will be a differentiator for the work we are doing together through the SWAP Hub.”

The initiative also offers a workforce-development opportunity with ASU faculty and students engaging in the work being done, providing training for the growing number of technicians who are needed domestically, including in metro Phoenix, which is home to Intel, TSMC, Amkor and other companies.

In collaboration with Deca, ASU is committed to establishing onshore access to these advanced-packaging capabilities. This entails acquiring, installing and implementing a comprehensive set of process and metrology equipment at the facility, capable of accommodating both 200mm and 300mm device wafer formats, as well as 300mm M-Series molded fan-out wafers, providing unparalleled flexibility for a diverse range of customers and applications.

“With the industry’s leading fan-out technology1 as a foundation, we’re excited about the possibilities this new center brings to Arizona as well as the broader U.S. semiconductor industry,” commented Tim Olson, Deca’s founder and CEO. “Through ASU and Deca’s collaboration, unprecedented access for industry, academia, government and others opens the door to accelerate innovation and bolster U.S. technology leadership.”

Deca’s first-generation M-Series FOWLP is widely adopted in leading smartphones around the globe. The Gen 2 M-Series including Adaptive Patterning technology brings unprecedented scaling to higher densities for heterogeneous integration and chiplet applications.

About Deca Technologies

Deca is a leading provider of advanced-packaging technology to the semiconductor industry with M-Series fan-out and Adaptive Patterning. Deca has a growing list of industry-leading partners working on technology transfer and license agreements to gain access to the proven structures, processes, materials, equipment, design systems and know-how of the industry’s No. 1 volume fan-out technology. Starting with the highest quality and reliability in Gen 1 aimed at smartphone applications, and moving on to the growth of Gen 2 for chiplets and heterogeneous integration, Deca’s technologies are emerging as key industry standards for the future. For more information, visit www.thinkdeca.com. 1M-Series is the highest-volume fan-out technology, with over 5 billion devices in the field.

About Arizona State University

Arizona State University has developed a new model for the American Research University, creating an institution that is committed to access, excellence and impact. ASU measures itself by those it includes, not by those it excludes. As the prototype for a New American University, ASU pursues research that contributes to the public good, and it assumes major responsibility for the economic, social and cultural vitality of the communities that surround its campuses. For more information, visit asu.edu. For more information about ASU’s work in microelectronics, visit microelectronics.asu.edu.

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AnySilicon allows companies to easily find vendors anywhere in the world with specific domain expertise that matches their needs.

As a provider of individual services through to full turnkey manufacturing, Rochester offers a wide range of services including long-term wafer storage, wafer testing, die processing, design, package assembly, electrical testing of final goods, failure analysis, and reliability testing.

Through the AnySilicon platform, Rochester will have the opportunity to unlock a wide array of dynamic online marketing services that will effectively highlight its exceptional offerings and connect to decision-makers.

About Rochester Electronics

Rochester Electronics is the world’s largest continuous source of semiconductors–100% Authorized by over 70 leading semiconductor manufacturers.  As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and the broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving, providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

SkyWater is the first domestic provider of Deca’s M-Series™ fan-out and Adaptive Patterning® technologies to support the reshoring of the semiconductor supply chain

SkyWater Technology, the trusted technology realization partner, and Deca Technologies (Deca), a leading provider of advanced electronic interconnect technology, today announced the kick-off of a significant new Department of Defense (DOD) effort to expand domestic fan-out wafer level packaging (FOWLP) capabilities for both government and commercial customers. These capabilities will be made possible through the five-year DOD contract recently awarded to Osceola County and SkyWater Florida, which is expected to fund the facilitization, tooling and build-out of the Center for Neovation. With an expected value of $120 million over five years, the award includes options for an additional $70 million, for a total value of up to $190 million. SkyWater is the first domestic licensee of Deca’s M-Series and Adaptive Patterning solutions to support the reshoring of the semiconductor supply chain.

The first generation of Deca’s M-Series FOWLP is broadly adopted across multiple device technology nodes in leading smartphones. Deca’s Gen 2 M-Series delivers a powerful new heterogenous integration solution for designers and manufacturers by streamlining the design and assembly processes and providing additional flexibility for multi-chip architectures with sub 20µm pitch. The Gen 2 M-series provides advantages to many markets such as artificial intelligence, high-performance computing and other advanced applications, giving system architects limitless potential through reticle-free maskless digital lithography and the flexibility of a molded interposer layer.

Through SkyWater’s collaboration with Deca, embedded devices including active and passive bridge die, integrated passives and a powerful technology roadmap are planned. SkyWater will implement Deca’s Adaptive Patterning, the industry’s only real-time design-during-manufacturing capability, allowing designers to scale to unprecedented device interface density with wider process windows for robust manufacturability.

The award is part of the DOD’s Office of the Secretary of Defense (OSD’s) Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) efforts, and directly supports the Biden-Harris Administration’s initiatives to strengthen America’s supply chains. This initiative is significant as less than 3% of semiconductor advanced packaging manufacturing takes place in the U.S., posing national security and economic risks for domestic businesses as chips go overseas for this critical step.

In response to the vital need for reshoring, Osceola County and SkyWater plan to stand up advanced packaging capabilities and capacity for low-volume/high-mix production of secure 2.5 and 3D Advanced System Integration and Packaging (ASIP) solutions. To onshore these advanced packaging capabilities, SkyWater will be acquiring, installing, and qualifying new equipment at its Florida facility that can support FOWLP processing of incoming 200mm and 300mm device wafer formats. This dual-wafer size equipment capability provides the flexibility to support a vast array of customers and applications.

Statements about the RESHAPE Program Award:

Matt Walsh, Office of the Secretary of Defense IBAS advanced packaging chief engineer said, “We are very excited about supporting domestic advanced packaging solutions by enabling SkyWater and Deca to establish developmental and volume manufacturing FOWLP technology for commercial and government customers’ applications with technical capability that equals that of foreign providers.”

SkyWater CEO Thomas Sonderman commented, “This agreement with the county enables SkyWater Florida to execute all aspects of the initial DOD award of up to $120 million and stand up our fan-out wafer level packaging capabilities by utilizing Deca’s industry leading technology. Our partnership with the county continues to fortify their efforts to build a thriving community in Central Florida designed for advancing the next generation of technologies here in the U.S.”

AMD’s Corporate Vice President, Advanced Packaging Raja Swaminathan said, “As a leader in chiplet design and advanced packaging, AMD recognizes the importance of creating a geographically diverse advanced packaging supply chain.  We applaud the DOD’s work to expand SkyWater’s manufacturing capabilities in Central Florida and establish a U.S.-based fan-out manufacturing option using Deca’s technology.”

Deca’s Founder and CEO Tim Olson stated, “We’re excited to collaborate with SkyWater on this groundbreaking opportunity to establish an industry leading domestic advanced packaging foundry supporting a secure U.S. microelectronics ecosystem as well as providing commercial customers with a compelling new supply chain option.”

According to Osceola County Manager Don Fisher, “This award builds on all the hard work the county and our partners have invested in NeoCity. Our continued collaboration with SkyWater will help drive our progress in developing a vibrant ecosystem to advance the next generation of technologies that will shape our future and provide more high quality job opportunities in Florida.”

SkyWater Florida Vice President and General Manager Dale Miller said, “We are excited to establish the first Deca FOWLP capability in the U.S. This represents our third heterogeneous integration technology for the Kissimmee facility. It’s an important addition because it completes our advanced packaging trifecta of interposer, hybrid bonding, and now fan-out wafer level packaging technology – all in one facility – to support both DOD and commercial customers.”

About Deca Technologies 
Deca is a leading provider of advanced packaging technology to the semiconductor industry with M-Series™ fan-out and Adaptive Patterning®. Deca has a growing list of industry leading partners working on technology transfer and license agreements to gain access to the proven structures, processes, materials, equipment, design systems, and know-how of the industry’s #1 volume fan-out technology. Starting with the highest quality and reliability in Gen 1 aimed at smartphone applications and moving on to the growth of Gen 2 for chiplets and heterogeneous integration, Deca’s technologies are emerging as key industry standards for the future. For more information, visit www.thinkdeca.com.

About SkyWater Technology
SkyWater (NASDAQ: SKYT) is a U.S.-based semiconductor manufacturer and a DMEA-accredited Category 1A Trusted Foundry. SkyWater’s Technology as a Service model streamlines the path to production for customers with development services, volume production and heterogeneous integration solutions in its world-class U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology with diverse categories including mixed-signal CMOS, ROICs, rad-hard ICs, power management, MEMS, superconducting ICs, photonics, carbon nanotubes and interposers. SkyWater serves growing markets including aerospace & defense, automotive, biomedical, cloud & computing, consumer, industrial and IoT. For more information, visit www.skywatertechnology.com/.

Amkor enables a resilient domestic semiconductor supply chain with the construction of its new advanced packaging facility in Arizona

TEMPE, Ariz.--(BUSINESS WIRE)--Nov. 30, 2023-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ approximately 2,000 people at the new facility.

Amkor is the only US-headquartered OSAT (outsourced semiconductor assembly and test) service provider with advanced packaging technology capability and high-volume manufacturing experience. Upon completion, this will be the largest outsourced advanced packaging facility in the US.

"Expansion of a US semiconductor supply chain is underway, and as the largest US-headquartered advanced packaging company, we are excited to lead the charge in bolstering America’s advanced packaging capabilities," said Giel Rutten, Amkor’s president and chief executive officer. “Semiconductor companies, foundries, and other supply chain partners understand the need to strategically broaden their geographic footprint. The announcement of our new advanced packaging and test facility in Arizona is a clear signal of our intent to help our customers ensure resilient supply chains and be a part of a strong American semiconductor ecosystem.”

In recent Congressional testimony, Commerce Secretary Gina M. Raimondo highlighted advanced packaging as a major area of focus for the US government’s effort to rebuild American semiconductor manufacturing. The Commerce Department made clear that developing robust advanced manufacturing capacity and capability is a key priority and essential to the success of the CHIPS program.

Amkor has secured approximately 55 acres of land with intent to build a state-of-the-art manufacturing campus with more than 500,000 square feet of clean room space. The first phase of the manufacturing plant is targeted to be ready for production within the next two to three years. Amkor plans to provide high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing, automotive, and communications.

Amkor worked closely with Apple on the strategic vision and initial manufacturing capability of the Peoria facility, which will package and test chips produced for Apple at the nearby TSMC fab. When the new facility opens, Apple will be its first and largest customer.

Amkor first established its presence in the Greater Phoenix area in 1984 and is excited to expand its footprint in the evolving Arizona semiconductor industry. The new manufacturing location will uniquely position Amkor among a strong ecosystem of front-end fabs, IDMs, and suppliers with current or expanding presence in the area, including TSMC, Intel, Applied Materials, ASML and others.

The project has garnered strong support from the City of Peoria, the Arizona Commerce Authority, and government authorities as it expands the evolving semiconductor ecosystem, provides high-tech jobs, and increases economic energy in the Greater Phoenix metropolitan area.

To ensure the success of a project of this magnitude in the United States, Amkor has applied for CHIPS funding. The CHIPS and Science Act was established to boost US competitiveness, innovation, and national security in the semiconductor industry. As part of the $52.7 billion program, the federal government will award $39 billion to US companies in competitive grants to manufacturers to finance construction, expansion, and modernization of facilities and equipment. These funds will be critical to Amkor’s project moving forward.

“Amkor’s $2 billion project—one of the largest microchip investments announced in Arizona since the passage of the CHIPS Act last year—will create good-paying jobs, strengthen our local economy, and help protect our national security,” Arizona Senator Mark Kelly said. “As one of the first advanced packaging facilities in the US, this is a huge step forward to reducing dependence on other countries in the microchip supply chain. When negotiating the CHIPS and Science Act, one of my top priorities was making sure companies like Amkor had the support needed to develop a resilient supply chain in places like Arizona that are leading the way in bringing microchip manufacturing back to America.”

“Amkor’s announcement is a historic step forward for Arizona that will bolster America’s national security and build a more resilient supply chain, bring billions of dollars into our state, and create thousands of good-paying jobs for Arizona workers,” said Governor Katie Hobbs. “With this project, one of the most significant investments in advanced packaging in America, Arizona will solidify itself as a world leader in the semiconductor industry. I was glad to meet with the Arizona Commerce Authority and Amkor leadership in South Korea to discuss future investments in Arizona and am proud to have them as a partner. Together, we’ll continue to expand the semiconductor ecosystem and continue Arizona’s long history of leadership in the advanced manufacturing sector.”

“Amkor has been a strategic OSAT partner to TSMC for many years,” said Dr. CC Wei, Chief Executive Officer of TSMC. “TSMC applauds Amkor for investing in the future of the semiconductor industry with us in Arizona. We share Amkor’s excitement for its significant investment and the value this facility will bring to TSMC, our customers, and the ecosystem.”

"Apple is committed to help build a new era of advanced manufacturing, right here in the US,” said Jeff Williams, Apple chief operating officer. “Apple and Amkor have worked together for more than a decade packaging chips used extensively in all Apple products, and we are thrilled that this partnership will now deliver the largest OSAT advanced packaging facility in the United States.”

“This new US facility, in combination with our advanced facilities spanning Asia and Europe, further strengthens our broad geographic footprint, supporting global but also enabling regional supply chains,” added Rutten. “This investment will reinforce our leadership position in advanced packaging and test within the key markets we serve while solidifying our commitment to expanding US-based chip manufacturing.”

About Amkor Technology, Inc.

Amkor Technology, Inc. is the world's largest US headquartered OSAT (outsourced semiconductor assembly and test) service provider. Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey manufacturing services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence, and wearables. Amkor's operational base includes production facilities, research and development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the United States. For more information, visit amkor.com.