Journal of Microelectronics and Electronic Packaging 2026 Issue 2. There are two outstanding papers published in this latest issue:

Jet-Dispensing Process Development for a Microparticle-Based Ag Sintering Paste for Pressureless Sintering of Miniaturized Opto-Electronic Components
Linus Daniel Stier, Marc Dreissigacker, Mathias Koch, Karl-Friedrich Becker, Tanja Braun, Martin Schneider-Ramelow, Adrian Stelzer, Martin Wozniak, Julien Hossain

Laser Cleaning Cylindrical Cells for Optimum Wire Bondability
Dominik Haering, Mike McKeown, Louis Castellanos, Takaaki Higashi, Kentaro Nakamura, Jack Gilson, Dirk Siepe, Vojislav R. Stamenkovic

Advancing Microelectronics 2026 Issue 2 Now Available Here

JMEP (Journal of Microelectronics and Electronic Packaging) Vol. 23, Issue 1, 2026

Now available here

Journal of Microelectronics and Electronic Packaging 2026 Issue 1. There are four outstanding papers published in this latest issue:

Scalable Manufacturing of Multi-Stacked Copper Spiral Inductors Using a Novel Fully Additive Method
Roghayeh Imani, Shailesh Chouhan, Jerker Delsing

Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation
Shyam Muralidharan Nair, Duwage Anushka Sandaruwan Perera, Gavin Farmer, James Abraham, Khanh Tuyet Anh Tran, Usha Philipose, Oliver Chyan

Engineering a Tunable Cu-Selective Oxide-Suppressing Coating to Enable Reliable Cu-to-Cu Direct Bonding for Advanced Interconnects
Kevin Antony Jesu Durai, Duwage Anushka Sandaruwan Perera, Khanh Tuyet Anh Tran, Dinesh Kumar Kumaravel, Hsing-Chien Chien, Po-Wen Chiu, Kuei-Hsien Chen, Oliver Chyan

Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor Packaging
Ning Liu, Shahram Seyedmohammadi, Howard Yun, Matthew Tsai

Advancing Microelectronics 2026 Issue 1 Now Available Here

Advancing Microelectronics 2025 Issue 6 Now Available Here

JMEP (Journal of Microelectronics and Electronic Packaging) Vol. 22, Issue 4, 2025

Now available here

Journal of Microelectronics and Electronic Packaging 2025 Issue 4. There are two outstanding papers published in this latest issue:

Co-Packaged Optics - Heterogeneous Integration of Chiplets (Switch, Photonic IC, and Electronic IC)
John H. Lau

Jet Dispensing of Liquid Metal as a Thermal Interface Material
Sunny Agarwal and Miloš Lazić

Thank you to all the presenters for participating!

The tracks cover:

~ Optical Interconnects / Photonics / Co-Packaged Optics
~ New Interconnects Methods and Reliabilities in Packaging Processes
~ High-Reliability Assembly Packaging for Automotive and AI Systems
~ Additive Manufacturing
~ Modeling of Reliability, Package Warpage and Process

Visit the IMAPSource portal.

Advancing Microelectronics 2025 Issue 5 Now Available Here

JMEP (Journal of Microelectronics and Electronic Packaging) Vol. 22, Issue 3, 2025

Now available here

Journal of Microelectronics and Electronic Packaging 2025 Issue 3. There are four outstanding papers published in this latest issue:

Flip Chip on Glass-Core Substrates with Microbump and Cu-Cu Hybrid Bonding
John H Lau, Ning Liu, Mike Ma, Tzyy-Jang Tseng

Methods for Increasing Dimensional Stability of Buried Cavities in LTCC Substrates
James Fraley, John Fraley, Tom Cannon, Kaoru Porter, David Huitink

HPC Packaging Platform Including Compression Molding
M. Adler, K.-F. Becker, T. Braun, O. Hoelck, A. Gaebler, U. Maass, I Ndip, K. Zoschke, M. Schiffer, M. Schneider-Ramelow

Self-Aligned Fiber-to-Waveguide Configuration for Enhanced Thermal Stability and Cost-Effective Production of Nanoporous Waveguides for Sensing
Serrita A. McAuley, William T. Winter, Joshua Prestage, Tanya Hutter

Advancing Microelectronics IMAPS 2025 Show Issue Now Available Here

JMEP (Journal of Microelectronics and Electronic Packaging) Vol. 22, Issue 2, 2025

Now available here

There are three outstanding papers published in this latest issue:

The Effects of Semiconductor Wafer Storage Methods on Aluminum Fluoride Crystal Growth on Aluminum Wire Bond Pads
Michael Raj Marks

Copper to Copper TCB – A Key Enabler for Ultra-Fine Pitch Heterogeneous Applications
Suleman Ayub, Adeel Bajwa, Ryo Sugano, Tetsuya Ogawa, Tom Colosimo, and Bob Chylak

Copper Electroplating Process for mSAP in the Era of AI and HPC
Saminda Dharmarathna, Sean Fleuriel, Charles Bae, Eric Kil, Sy Maddux, Leslie Kim, Brian Gokey, and Ernie Long

Advancing Microelectronics 2025 Issue 3 Now Available Here

Advancing Microelectronics 2025 Issue 2 Now Available Here

JMEP (Journal of Microelectronics and Electronic Packaging) Vol. 22, Issue 1, 2025

Now available here 

There are two outstanding papers published in this latest issue:

Thermal Performance Differences Between Ceramic Packages and Lead Frame Packages For Dr.MOS
Hao-Lin. Yen and Fang-I. Lai

Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications
Emily Lamport, Sai G.R. Avuthu, Si Chen, Javed Mapkar, and Alkim Akyurtlu

Advancing Microelectronics DPC 2025 Show Issue Now Available Here

Access the IMAPS 2024 Symposium Proceedings on IMAPSource

Your OPEN ACCESS library for microelectronics & packaging

The 57th International Symposium on Microelectronics was held in Boston, Massachusetts on September 30th through October 3rd, 2024. This issue on IMAPSource contains 76 papers from the event.

Thank you Emma Pawliczak for being the Guest Editor for this issue focusing on students.

Inside this issue:

2024 Microelectronics Foundation, Steve Adamson Student Recognition Award:  Electrospray Deposition on Insulating Targets for Electromagnetic Interference (EMI)Protection

Best Student Presentation: The Effect of Conductor Processing and Properties on Additively Manufactured Antenna Performance

Best Student Paper:  Fabrication and Passive Assembly of Broadband Evanescent Couplers for Sustainable Pbps Co-Packaged Optics

Best Student Poster:  Additive Manufacturing of Ultrafine-Resolution Interconnects and Traces for 3D Heterogeneous Integration

Advancing Microelectronics 2024 Issue 5 Now Available Here

JMEP (Journal of Microelectronics and Electronic Packaging) Vol. 21, Issue 3, 2024

Now available here 

There are two outstanding papers published in this latest issue:

Design and Architecture Definition for Advanced 3D
Fan-Out Wafer-Level Packaging
Karan Bhangaonkar and Santosh Sankarasubramanian

Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages
Wenhao (Eric) Li, Feras Eid, Yoshihiro Tomita, and Johanna Swan

Advancing Microelectronics IMAPS 2024 Show Issue Now Available Here

Advancing Microelectronics 2024 Issue 3 Now Available Here

JMEP (Journal of Microelectronics and Electronic Packaging) Vol. 21, Issue 2, 2024

Now available here 

There are four outstanding papers published in this latest issue:

Flip-Chip-Based Dual-Polarized Antenna-on-Package Arrays for 5G mmWave Modules
Thi Huyen Le and Ivan Ndip

Unlocking the True Power of Additive Manufacturing for EMI Shielding
Markus G. Scheibel, Michael P. Kaiser, Sutharsan Balasubramaniam, Mykola Chernobryvko,
Julia-Marie Koszegi, Marc Dreissigacker, Marius Adler, Tanja Braun, Chuan I. Eric Huang,
Meng Jason Li, Muriel Thomas, and Franz Vollmann

Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability
Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, John Alptekin, Logan Estridge, Shyam Nair,
and Oliver Chyan

Improved Throughput with Dynamic “Real-Time” Dual Head Dispensing in Electronics Assembly
Sunny Agarwal

Advancing Microelectronics 2024 Issue 2 Now Available Here

JMEP (Journal of Microelectronics and Electronic Packaging) Vol. 21, Issue 1, 2024

Now available here 

There are four outstanding papers published in this latest issue:

Reliability Assessment of Indium Micro Bumps for
2.5D/3D Electronic Packaging Through Cryo-Argon
Milling Technique
Soheil Razmyar, Nicholas Lay, and Kaysar Rahim

Stereolithographic Process for Embedding of Electronic
Components into Multimaterial Flexible and Stretchable
Polymer Substrate to Reduce Stress During Stretching
Tobias Tiedje, Christoph Brauer, Marco Luniak, Krzysztof Nieweglowski, and Karlheinz Bock

Study on the Manufacturability of X Dimension Fan Out
Integration Package with Organic RDLs (XDFOI-O)
Haijie Chen, Ziyao Bian, Tao Liu, Jielei Xie, Jingyu Wu, Yaojian Lin, and Choon Heung Lee

Transforming WLP Applications: Introducing Cutting-Edge
Next-Generation Nanotwinned Copper Processes to
Revolutionize Hybrid Bonding
Pingping Ye, Jianwen Han, Stephan Braye, Kyle Whitten, Veronica Hayes, Harshul Khanna, Adam Letize,
Thomas Richardson, and Elie Najjar

Advancing Microelectronics 2024 Issue 1 Now Available Here