IMAPS Academy Launches! New Packaging Workforce Development Platform
Thursday, May 30, 2024
IMAPS Academy
IMAPS is pleased to announce the launch of IMAPS Academy, an online training resource to support the industry’s rapidly growing need for workforce development.
IMAPS has a strong track record delivering in-person professional
development initiatives, which it is now expanding to an on-demand environment. Students and professionals of all levels of experience in the semiconductor advanced packaging ecosystem can learn about relevant processes, materials,
and structures that are key in enabling microelectronic packaging directly from leading industry experts.
IMAPS Academy offers convenient professional development and technical training for students and others new to the industry, as well as opportunities for those currently involved in advanced packaging to expand their knowledge
and capabilities, in turn enabling them to change roles or increase their value. Employers can also engage with IMAPS for future workforce development and employee onboarding, to minimize skill gaps and develop talent to give
them a competitive advantage.
“IMAPS Academy is set to become the gold standard in semiconductor advanced packaging education,” stated Brian Schieman, Executive Director, IMAPS. “Our program is focused on delivering value-added training from an industry perspective so students can
gain current, marketable knowledge, enabling them to stay ahead in a rapidly evolving industry. With investment in advanced packaging accelerating globally, the need for workforce development is growing in kind, and IMAPS Academy offers an excellent
opportunity to build this specialized talent pool.”
IMAPS Academy is a global platform that offers introductory, advanced and specialty training topics. The courses are focused on key advanced packaging technologies in support of
various industries, including: 5G/mobile, IoT, automotive, military, power, industrial, networking, advanced computing & artificial intelligence, and medical. Academy instructors are leading technical experts who share both personal experiences
and industry knowledge on focused topics.
IMAPS provides Certificates of Completion for each Academy training course. Participants can complete a series of courses to achieve a strong knowledge base and provide certificates to employers
for continuous education requirements.
The introductory course “What is a Package?” is complementary and intended for those unfamiliar with the basics of
IC packaging or wanting a quick refresher course. All other courses are offered with member, non-member and student pricing and include topics on chip packaging basics, wire bonding, fan out wafer level packaging, flip chip, system-in-package, failure
analysis and more.
“With its dynamic curriculum and continuous updates, IMAPS Academy ensures that participants remain at the forefront of technological advancements. Future courses will delve into cutting-edge topics such as 3D package design, advanced materials, mechanical
modeling, MEMS sensors and silicon photonics, reflecting our commitment to staying ahead of industry trends,” said Schieman.
Visit the IMAPS Academy page to learn more.
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