The IMAPS/IPC Onshoring Advanced Packaging and Assembly Workshop Was a Great Success

The turnout for this important event exceeded expectations with a meaningful representation of companies involved in advanced packaging and electronics assembly.   

General Chair for the Workshop, Darren Crum (US Dept of Navy), was pleased with the participation, topic coverage and conversations:
“The 3-day event was packed with professional development courses, discussion groups, and technical sessions. Over 150 participants got to hear from and engage with representatives from the DoD, the Defense Industrial Base, the microelectronics packaging industry, and academia on a variety of topics related to onshoring efforts of advanced packaging capability. Thanks to the keynote speakers: Will Osborn from NIST, Adele Ratcliff from OUSD/A&S, John Blevins from DARPA, and Dev Shenoy from OUSD/R&E. Thanks to all the speakers, the organizing committee, moderators, and the Technical Chair, Brandon Hamilton from BAE Systems.”  

		The Committee introduced two new “Discussion Groups” at the workshop on Monday, July 10 focused on Chiplets and Substrates to Systems. There was an overwhelming response to these new groups with more than 80 people in attendance at each, and strong interaction between the moderators and attendees. The engagement continued with all participants throughout the full technical program Tuesday and Wednesday, during the four keynote presentations, a workforce development panel session, and with 20 speaker presentations across eight sessions. Please continue to share your feedback with us, as IMAPS and IPC look forward to our next Onshoring Workshop.
Organizing committee (from L to R):  Philip Garrou IFTLE; Brandon Hamilton, BAE Systems; Steven Dooley, Air Force Research Laboratory; David Shahin, Northrup Grumman Advanced Systems; Darren Crum, US Navy; Tony Trinh, Mercury Systems; Christopher Riso, Booz Allen Hamilton; Helen Phillips, NGC; Brian Schieman, IMAPS; and Matt Kelly, IPC. (Not available for the photo: James Will, SkyWater Technology Foundry; Ted Tessier, Integra; and Jason G. Milne, Raytheon.