IMAPS Symposium 2023

IMAPS 2022 Boston



The 56th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held in San Diego, California. This year's Symposium will  feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on SiP/Design/Manufacturing Optimization; Wafer Level/Panel Level (Advanced RDL); High Performance/High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical...); Advanced Process & Materials (Enabling Tech.)

www.imaps2023.org






              Conference            
October 3-5, 2023



            Exhibition            
October 3-4, 2023



 Professional Development Courses 
October 2, 2023



General Chair:
Suresh Jayaraman
Amkor Technology



General Chair-elect (2024):
Tarak Railkar
Qorvo



Past General Chair (2022):
Sandeep Sane 



ABSTRACT & PDC DEADLINE EXTENDED: APRIL 30, 2023 | EXHIBIT SALES BEGIN: APRIL 5, 2023

Submit Your Abstract


TECHNICAL PROGRAM



TRACK 1:
SiP/Design/Manufacturing Optimization

TRACK 2:
Wafer Level/Panel Level (Advanced RDL)

TRACK 3:
High Performance / High Reliability

TRACK 4:
Advanced Package (Flip Chip, 2.5D, 3D, Optical)

TRACK 5:
Advanced Process & Materials (Enabling Tech.)

PLANNED SESSIONS:

• System Architecture, Design, & Integration
• Embedded / High Voltage/  High Density
• Optical
• Automotive Microelectronics
• Wearable Electronics
• Internet of Things (IoT)
• EMI Shielding
• Computing & Networking Package
• CPI & Modeling
• Design for Reliablity/ Manufacturing
• PDK Development for Packaging
• System Optimization

PLANNED SESSIONS:

• Wafer-level Fan Out / WLCSP
• Advanced Fan Out & Heterogeneous Integration
• Panel-level Fan Out
• MEMS & Sensors
• Edge Protection
• Carrier Technologies
• Reliability & Test
• Df/Dk Loss Tangent of Dielectrics

PLANNED SESSIONS:

• High Reliability in Defense and Aerospace
• High Reliability in Automotive
• MM Wave / High-speed Packaging
• RF / Wireless Components
• HiRel in Bio/Medical
•HiRel in Extreme Environments

PLANNED SESSIONS:

• Large Body / Small Body FC
• 2.5D/3D Technologies
• Optical Co-Packaging/ Photonics / Waveguides / Lasers
• BUMP & Interconnect
• 3D Technologies
• Advanced Flip Chip
• Heterogeneous Integration

PLANNED SESSIONS:

• Substrate Technology
• Polymer Materials & Processes
• Novel Materials & Processes
• Advanced Wirebond
• Advanced Equipment for Additive Manufacturing
• Flexible & Wearable Electronics

TRACK 6:

INTERACTIVE POSTER SESSION - "Posters & Pizza Lunch"


Technical sessions are being planned for these tracks, and abstracts will be considered on the session topic listed below. Abstracts are rated by the technical committee members and are selected into the sessions by the session chairs appointed by the technical committee. Authors should identify their preferred session (topical area) when submitting their abstracts. Abstracts should highlight the major contributions of the work in one or more of these areas. All abstracts submitted must represent original, previously unpublished work.

If your abstract is selected, you will be asked to follow the speaker timeline: - Speaker Acceptance/Rejection (May 8, 2023); - First Paper to Peer Review (on/before June 7, 2023); - Peer Review feedback to authors (July 7, 2023); - Final/corrected Papers (August 15, 2023); - Speaker must register before (September 1, 2023); - BIO due (September 15, 2023); Speaker Breakfast (morning of your session); and - Presentation ready (on/before October 1, 2023).

Special Paper Recognition - Cash Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) Cash Awards
Six "Best of Track" Winners will then be reviewed for...
1 Best Paper of the Symposium - One (1) additional Cash Award for a "Best of Track" Winner

IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students