IMAPS Symposium 2022 BOSTON

IMAPS 2022 Boston

IMAPS 2022 is being held at:

Hynes Convention Center
900 Boylston St
Boston, MA 02115


The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. This year's Symposium will  focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL, and will feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!


              Conference            
October 4 - 6, 2022

            Exhibition            
October 4, 2022 | 11am-4pm
October 5, 2022 | 11am-6:30pm

 Professional Development Courses 
October 3, 2022


Plan your visit to the 55th International Symposium on Microelectronics. Download the IMAPS 2022 Final Program & Exhibit Directory  


IMAPS 2022 Final Program

General Chair:
Sandeep Sane
Intel Corporation


General Chair-elect (2023):
Suresh Jayaraman
Amkor Technology

Past General Chair (2021):
Mak Kulkarni
Texas Instruments 

Early Registration Deadline and Hotel Cut-off: SEPTEMBER 2
GET REGISTERED & BOOK HOTEL BEFORE THE BLOCK CLOSES

   

PROFESSIONAL DEVELOPMENT COURSES (PDCs)

The 2022 PDC courses are offered on Monday, October 3, prior to IMAPS 2022. Attendees must register for each course as an add-on to their overall symposium registration. Attendees may select up to one course in each time slot. 

Make sure to review your preferred course's time slot before registration. Course fees are $325 each if registered by September 2, 2022 and $425 after September 2. Course fees are non-refundable.

Click here for detailed information on PDCs.

8:00 am - 10:00 amPDC AM1: 

Introduction to Fan-Out Wafer Level Packaging (FOWLP) Beth Keser, Director, Intel Corp.

PDC AM2:

Semiconductors in Automotive - Technology Trends and Reliability - Pradeep Lall, Auburn University & Vikas Gupta, ASE

PDC AM3: Flip Chip Tech - Mark Gerber, ASE US, Inc.
10:30 am - 12:30 amPDC AM4: Chiplet Design and Heterogeneous Integration Packaging - John Lau, Professor, Unimicron Technology Corp.PDC AM5: Wire Bond Process Development and Optimization - Henri Seppanen, Research Scientist, Kulicke & Soffa Industries & Aashish Shah, Principal Engineer and Technical Lead, Kulicke & Soffa IndustriesPDC AM6: Chip Packaging Processes and Materials - Syed Ahmad, Director, City of Jamestown, ND
1:00 pm - 3:00 pmPDC PM1: Fan Out for Advanced Packaging Applications - John Hunt, Senior Advisor & Jan Vardaman, President, TechSearch International, Inc.PDC PM2: System-in-Package (SiP) - System Solutions Through Miniaturization - Mark Gerber, ASE US, Inc.PDC PM3: Fundamentals of Thermal Management - Rita Mohanty, Sr. Scientific Principal, Henkel Corp.
3:30 pm - 5:30 pmPDC PM4: Polymers for Wafer Level Packaging - Jeffrey Gotro, President, InnoCentrixLLCPDC PM5: 3D Flip Chip Package Technology and Assembly Processes - Tom Dory, R&D Manager, Fujifilm Electronic MaterialsCANCELLED - PDC PM6: Qualification Formalism for Markets Demanding High Quality & Reliability Standards - Shubhada Sahasrabudhe, Principal Engineer, Corporate, Intel Corp. & Shalabh Tandon, Sr. Director Corporate Quality Network, Intel Corp.

KEYNOTE PRESENTATIONS

ELECTRONIC-PHOTONIC PACKAGE INTEGRATION - October 4
Lionel C. Kimerling, Massachusetts Institute of Technology
Thomas Lord Professor of Materials Science and Engineering
Director, MIT Microphotonics Center
AUTOMOTIVE MEMS: OVERVIEW, DEVELOPMENTS AND INNOVATIONS - October 4
Dr. Ando Feyh, Robert Bosch GmbH
MEMS Strategy Management, New Business and M&A
6G: OPPORTUNITIES AND PACKAGING CHALLENGES - October 5
Glenn Daves, NXP Semiconductors
Vice President, Package Innovation
CHANGING DYNAMICS OF THE SEMICONDUCTOR GLOBAL SUPPLY CHAIN AND SCOPE, OPPORTUNITIES FOR INDIA - October 5
Santosh Kumar, Reliance
Vice President and Head, BD Semiconductor Manufacturing
ADVANCING MEDICAL ELECTRONICS AT THE INTELLIGENT EDGE - October 6
David Bolognia, ADI
Fellow, Packaging Technology

TECHNICAL PROGRAM NOW AVAILABLE!

The IMAPS 2022 Technical Committee has helped recruit more than 100  speakers around the following track and session topics.
VIEW THE FULL TECHNICAL PROGRAM FEATURING 20 SESSIONS, 12 PDCs, 5 KEYNOTES, POSTERS & PANELS OVER 2.5 DAYS!!

TRACK 1:
SiP/Design/Manufacturing Optimization

TRACK 2:
Wafer Level/Panel Level (Advanced RDL)

TRACK 3:
High Performance / High Reliability

TRACK 4:
Advanced Package (Flip Chip, 2.5D, 3D, Optical)

TRACK 5:
Advanced Process & Materials (Enabling Tech.)

TRACK CHAIRS:

Dongshun Bai, Brewer Science; 
Bora Baloglu, Amkor Technology; 
Fang Luo, Stony Brook Univ.

TRACK CHAIRS:

Tarak Railkar, Qorvo; 
Rey Alvarado, Qualcomm; 
Mohan Kathaperumal, Georgia Tech.

TRACK CHAIRS:

Erica Folk, Northrop Grumman; 
Rajiv Iyer, Medtronic; 
Ivan Ndip, Fraunhofer IZM

TRACK CHAIRS:

Frank Eberle, Northrop Grumman; 
Jaimal Williamson, Texas Instruments; 
Rahul Panat, Carnegie Mellon Univ.

TRACK CHAIRS:

Mark Hoffmeyer, IBM; 
Habib Hichri, Ajinomoto; 
Benson Chan, Binghamton Univ.

VIEW THE FULL TECHNICAL PROGRAM

NEW THIS YEAR

IMAPS Advanced Technology Workshop on 
STRATEGIES TO REVITALIZE THE  ON-SHORE PACKAGING

AND ASSEMBLY DEFENSE INDUSTRIAL BASE 

Overview:  The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve On-Shore Packaging and Assembly Capabilities on Monday, October 3, 2022, at the Hynes Convention Center, Boston, Massachusetts. 

The mission of this workshop is to engage our workforce community to identify solutions, which address US Government and Defense requirements, critical to the onshoring of the microelectronic assembly and packaging supply chain.

The workshop will feature a SHIP keynote speaker and SHIP program speakers, plus several breakout sessions with speakers focused on:  Substrates & Materials Manufacturing; Enabling & Disruptive Technologies, Reliability, Heterogeneous Integration, the Defense Industrial Base (DIB) Ecosystem, and Workforce Development. Confirmed speakers and panelists include:

  • SHIP Keynote & Session Speakers:
    • Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics | SHIP Program Keynote
    • John Sotir, Intel | SHIP Digital
    • Ted Jones, Qorvo | SHIP RF
    • The Evolution of Moore's Law through Chipletized Architectures | Tony Trinh, Mercury Systems
  • PANEL: Defense Industrial Base Ecosystem
    • Helen Phillips, Northrop Grumman
    • Anthony Bednarz, Lockheed Martin
    • Additional Panelists Soon
  • PANEL: Workforce Development
    • John Allgair, GoBridg
    • Dr Kara Perry, SCALE/Purdue
    • Jerry Roberson, Northrop Grumman
  • Technical Session Speakers:
    • Steve Groothuis, Ayar Labs | Co-Packaged Optics (CPO) of Silicon Photonics Optical I/O Chiplet 
    • John Park, Cadence | When Chips Become Systems
    • Tomoyuki Yamada, Kyocera | HDBU Process and Commercial Practices
    • Madhavan Swaminathan, Georgia Tech | Advances in Glass Interposers for (Beyond) 5G mmW Communications
    • Meredith LeBeau, Calumet Electronics; Habib Hichri, Ajinomoto USA | Panel Discussion: Onshoring Advanced Substrates & Materials
    • Eric Suh, NASA JPL | Advanced Packaging Needs and Issues in Perspective of High-reliability Space Applications
    • Gary Patrizi, Sandia National Labs. | Low Volume, High Mix R&D and High-Reliability Production
    • Tim Pearson, Collins | Design for Manufacturing: Package Design Cleaning Compatibility for High Reliability Electronic Assembly
    • John Lannon, Micross | Heterogeneous Integration of III-V Devices:  Successes and Challenges
    • Alan Huffman, SkyWater Technology | Title Soon

Discounts are available when registering for both the Workshop and IMAPS 2022 Symposium.


DEI Townhall Discussion and Reception

Monday, October 3 - 7:00 pm - 8:00 pm

EQUITY vs. EQUALITY IN THE WORKPLACE


Chair: Robin Davis, Deca Technologies
Committee: Erica Folk, Northrop Grumman; Beth Keser, Intel; Dan Krueger, Honeywell; Urmi Ray, iNEMI; Nicole Wongk, Honeywell

This will be a one-hour townhall – open discussion and panel format. Join us for open and lively conversation around many important topics for all to consider in today‘s challenging work environment, including the important differences between equity and equality in the workplace.

PANELISTS:

KT Moore, Cadence Design Systems - VP Corporate Marketing
Shelby Nelson, Mosaic Microsystems – Chief Technical Officer
Urmi Ray, Saras Micro Devices – Chief Technology Officer
Jean Trewhella, GlobalFoundries - Director of PostFab New Product Introduction
Susan Trulli, Raytheon Technologies, RMD Advanced Microelectronics Solutions – Principal Engineering Fellow


Food & Drink Provided


SPEAKER INFORMATION

All speakers - be sure to view the speaker planning page. Bookmark the page and review it often before arriving at IMAPS 2022!

If your abstract is selected, you will be asked to follow the speaker timeline:

  • Speaker Acceptance/Rejection (June 3, 2022)

  • First Paper to Peer Review (July 8, 2022)

  • Peer Review feedback to authors (September 12, 2022)

  • Final/corrected Papers (September 28, 2022)

  • Speaker must register before (September 5, 2022)

  • BIO due (September 14, 2022)

  • Speaker Breakfast (morning of your session)

  • Slides/Presentation ready (on/before October 2, 2022)


Special Paper Recognition -
Financial Awards Offered!

6 "Best of Track" Outstanding Papers - Six (6) Cash Awards
Six "Best of Track" Winners will then be reviewed for...
1 Best Paper of the Symposium - One (1) additional Cash Award for a "Best of Track" Winner


IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students

IMAPS 2022 is being held at Hynes Convention Center
(900 Boylston St | Boston, MA 02115)

IMAPS has a hotel block just nearby at the:

Sheraton Boston Hotel
39 Dalton Street
Boston, MA 02199 USA
Single/Double: $259/night + taxes and fees

Hotel reservation deadline: September 2, 2022


CANCELLATION POLICY
Cancellations must be received 3-days (72 hours) prior to confirmed arrival date to avoid penalty fee equal to one night's room and tax. 

.

Sheraton Boston Hotel

Booking in the Block

IMAPS sincerely appreciates your support by staying at the Sheraton Boston Hotel.  We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants. 

  • Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel

  • Easily accessible — staying in the host hotel means less travel time and overall convenience




SPONSORS AND EXHIBITORS

Exhibit/Sponsor Application are now being accepted. The exhibition is now ~80% sold out with only ~17 10x10s still available. Download the exhibit application below and book your space TODAY! Early registration ended May 31, 2022.

IMAPS 2022 Prospectus

IMAPS 2022 Exhibit Application

IMAPS 2022 Sponsor Application

IMAPS 2022 Floorplan

   CURRENT EXHBITORS AND SPONSORS INCLUDE 

THANK YOU SPONSORS

PREMIER SPONSOR


LUNCH SPONSOR

KEYNOTE SPONSORS





BREAK SPONSOR

DEI SPONSOR

Honeywell

POSTER SESSION

BAG SPONSOR

OFFICIAL INDUSTRY PARTNER


 


OFFICIAL MEDIA PARTNER