IMAPS Symposium 2022 BOSTON
IMAPS 2022 is being held at:
Hynes Convention Center
900 Boylston St
Boston, MA 02115
The 55th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held at Hynes Convention Center. This year's Symposium will focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL, and will feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial, Defense/Space, Medical electronics markets, and beyond!
Conference
October 4 - 6, 2022
Exhibition
October 4, 2022 | 11am-4pm
October 5, 2022 | 11am-6:30pm
Professional Development Courses
October 3, 2022
Plan your visit to the 55th International Symposium on Microelectronics. Download the IMAPS 2022 Final Program & Exhibit Directory
General Chair:
Sandeep Sane
Intel Corporation
Suresh Jayaraman
Amkor Technology
Mak Kulkarni
Texas Instruments
Early Registration Deadline and Hotel Cut-off: SEPTEMBER 2
GET REGISTERED & BOOK HOTEL BEFORE THE BLOCK CLOSES
PROFESSIONAL DEVELOPMENT COURSES (PDCs)
The 2022 PDC courses are offered on Monday, October 3, prior to IMAPS 2022. Attendees must register for each course as an add-on to their overall symposium registration. Attendees may select up to one course in each time slot.
Make sure to review your preferred course's time slot before registration. Course fees are $325 each if registered by September 2, 2022 and $425 after September 2. Course fees are non-refundable.
Click here for detailed information on PDCs.
| 8:00 am - 10:00 am | PDC AM1: Introduction to Fan-Out Wafer Level Packaging (FOWLP) - Beth Keser, Director, Intel Corp. | PDC AM2: Semiconductors in Automotive - Technology Trends and Reliability - Pradeep Lall, Auburn University & Vikas Gupta, ASE | PDC AM3: Flip Chip Tech - Mark Gerber, ASE US, Inc. |
| 10:30 am - 12:30 am | PDC AM4: Chiplet Design and Heterogeneous Integration Packaging - John Lau, Professor, Unimicron Technology Corp. | PDC AM5: Wire Bond Process Development and Optimization - Henri Seppanen, Research Scientist, Kulicke & Soffa Industries & Aashish Shah, Principal Engineer and Technical Lead, Kulicke & Soffa Industries | PDC AM6: Chip Packaging Processes and Materials - Syed Ahmad, Director, City of Jamestown, ND |
| 1:00 pm - 3:00 pm | PDC PM1: Fan Out for Advanced Packaging Applications - John Hunt, Senior Advisor & Jan Vardaman, President, TechSearch International, Inc. | PDC PM2: System-in-Package (SiP) - System Solutions Through Miniaturization - Mark Gerber, ASE US, Inc. | PDC PM3: Fundamentals of Thermal Management - Rita Mohanty, Sr. Scientific Principal, Henkel Corp. |
| 3:30 pm - 5:30 pm | PDC PM4: Polymers for Wafer Level Packaging - Jeffrey Gotro, President, InnoCentrix, LLC | PDC PM5: 3D Flip Chip Package Technology and Assembly Processes - Tom Dory, R&D Manager, Fujifilm Electronic Materials | CANCELLED - PDC PM6: Qualification Formalism for Markets Demanding High Quality & Reliability Standards - Shubhada Sahasrabudhe, Principal Engineer, Corporate, Intel Corp. & Shalabh Tandon, Sr. Director Corporate Quality Network, Intel Corp. |
KEYNOTE PRESENTATIONS
TECHNICAL PROGRAM NOW AVAILABLE!
The IMAPS 2022 Technical Committee has helped recruit more than 100 speakers around the following track and session topics.
VIEW THE FULL TECHNICAL PROGRAM FEATURING 20 SESSIONS, 12 PDCs, 5 KEYNOTES, POSTERS & PANELS OVER 2.5 DAYS!!
TRACK CHAIRS: Dongshun Bai, Brewer Science; | TRACK CHAIRS: Tarak Railkar, Qorvo; | TRACK CHAIRS: Erica Folk, Northrop Grumman; | TRACK CHAIRS: Frank Eberle, Northrop Grumman; | TRACK CHAIRS: Mark Hoffmeyer, IBM; |
NEW THIS YEAR
AND ASSEMBLY DEFENSE INDUSTRIAL BASE
Overview: The International Microelectronics Assembly and Packaging Society (IMAPS) will host a one-day Workshop to discuss and promote strategies to improve On-Shore Packaging and Assembly Capabilities on Monday, October 3, 2022, at the Hynes Convention Center, Boston, Massachusetts.
The mission of this workshop is to engage our workforce community to identify solutions, which address US Government and Defense requirements, critical to the onshoring of the microelectronic assembly and packaging supply chain.
The workshop will feature a SHIP keynote speaker and SHIP program speakers, plus several breakout sessions with speakers focused on: Substrates & Materials Manufacturing; Enabling & Disruptive Technologies, Reliability, Heterogeneous Integration, the Defense Industrial Base (DIB) Ecosystem, and Workforce Development. Confirmed speakers and panelists include:
- SHIP Keynote & Session Speakers:
- Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics | SHIP Program Keynote
- John Sotir, Intel | SHIP Digital
- Ted Jones, Qorvo | SHIP RF
- The Evolution of Moore's Law through Chipletized Architectures | Tony Trinh, Mercury Systems
- PANEL: Defense Industrial Base Ecosystem
- Helen Phillips, Northrop Grumman
- Anthony Bednarz, Lockheed Martin
- Additional Panelists Soon
- PANEL: Workforce Development
- John Allgair, GoBridg
- Dr Kara Perry, SCALE/Purdue
- Jerry Roberson, Northrop Grumman
- Technical Session Speakers:
- Steve Groothuis, Ayar Labs | Co-Packaged Optics (CPO) of Silicon Photonics Optical I/O Chiplet
- John Park, Cadence | When Chips Become Systems
- Tomoyuki Yamada, Kyocera | HDBU Process and Commercial Practices
- Madhavan Swaminathan, Georgia Tech | Advances in Glass Interposers for (Beyond) 5G mmW Communications
- Meredith LeBeau, Calumet Electronics; Habib Hichri, Ajinomoto USA | Panel Discussion: Onshoring Advanced Substrates & Materials
- Eric Suh, NASA JPL | Advanced Packaging Needs and Issues in Perspective of High-reliability Space Applications
- Gary Patrizi, Sandia National Labs. | Low Volume, High Mix R&D and High-Reliability Production
- Tim Pearson, Collins | Design for Manufacturing: Package Design Cleaning Compatibility for High Reliability Electronic Assembly
- John Lannon, Micross | Heterogeneous Integration of III-V Devices: Successes and Challenges
Alan Huffman, SkyWater Technology | Title Soon
Discounts are available when registering for both the Workshop and IMAPS 2022 Symposium.
DEI Townhall Discussion and Reception
Monday, October 3 - 7:00 pm - 8:00 pm
EQUITY vs. EQUALITY IN THE WORKPLACE
Chair: Robin Davis, Deca Technologies
Committee: Erica Folk, Northrop Grumman; Beth Keser, Intel; Dan Krueger, Honeywell; Urmi Ray, iNEMI; Nicole Wongk, Honeywell
This will be a one-hour townhall – open discussion and panel format. Join us for open and lively conversation around many important topics for all to consider in today‘s challenging work environment, including the important differences between equity and equality in the workplace.
PANELISTS:
KT Moore, Cadence Design Systems - VP Corporate Marketing
Shelby Nelson, Mosaic Microsystems – Chief Technical Officer
Urmi Ray, Saras Micro Devices – Chief Technology Officer
Jean Trewhella, GlobalFoundries - Director of PostFab New Product Introduction
Susan Trulli, Raytheon Technologies, RMD Advanced Microelectronics Solutions – Principal Engineering Fellow
Food & Drink Provided
SPEAKER INFORMATION
All speakers - be sure to view the speaker planning page. Bookmark the page and review it often before arriving at IMAPS 2022!
If your abstract is selected, you will be asked to follow the speaker timeline:
Speaker Acceptance/Rejection (June 3, 2022)
First Paper to Peer Review (July 8, 2022)
Peer Review feedback to authors (September 12, 2022)
Final/corrected Papers (September 28, 2022)
Speaker must register before (September 5, 2022)
BIO due (September 14, 2022)
Speaker Breakfast (morning of your session)
Slides/Presentation ready (on/before October 2, 2022)
Special Paper Recognition -
Financial Awards Offered!
6 "Best of Track" Outstanding Papers - Six (6) Cash Awards
Six "Best of Track" Winners will then be reviewed for...
1 Best Paper of the Symposium - One (1) additional Cash Award for a "Best of Track" Winner
IMAPS Microelectronics Foundation Student Paper Awards
The Foundation is offering CASH AWARDS to the best papers submitted and presented by students!
IMAPS 2022 is being held at Hynes Convention Center
(900 Boylston St | Boston, MA 02115)
IMAPS has a hotel block just nearby at the:
Hotel reservation deadline: September 2, 2022
CANCELLATION POLICY
Cancellations must be received 3-days (72 hours) prior to confirmed arrival date to avoid penalty fee equal to one night's room and tax.
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Booking in the Block
IMAPS sincerely appreciates your support by staying at the Sheraton Boston Hotel. We make every effort to keep conference expenses, registration fees, and hotel rooms as low as possible. Reserving a room with the event hotel helps us stay committed to our contract and allows for a positive stay experience with fellow participants.
Networking — there are numerous opportunities for attendees to connect with each other by staying at the same hotel
Easily accessible — staying in the host hotel means less travel time and overall convenience
SPONSORS AND EXHIBITORS
Exhibit/Sponsor Application are now being accepted. The exhibition is now ~80% sold out with only ~17 10x10s still available. Download the exhibit application below and book your space TODAY! Early registration ended May 31, 2022.
IMAPS 2022 Exhibit Application
IMAPS 2022 Sponsor Application
CURRENT EXHBITORS AND SPONSORS INCLUDE
THANK YOU SPONSORS
BREAK SPONSOR
DEI SPONSOR
POSTER SESSION
