IMAPS 2021 Society Award Winners
Congratulations to the IMAPS 2021 Society Award Winners!
Lifetime Achievement Award and
Fellow of the Society Award
Manford Williamson started his career in construction and farming. He moved to Seattle and graduated from the University of Washington with Bachelors in Electrical Engineering (BSEE) and started working for Boeing Aerospace in 1956. After spending several years in various groups dealing with Boeing electronics applications, Manford was invited to join the R&D Microelectronics development group to develop Hybrid Microcircuits for Boeing applications. In 1969, he joined ISHM and found it to be an incredible resource for networking, parts, materials, processes and equipment; and he credits ISHM for establishing the direction of his career. With ISHM resources, he helped to establish the Boeing R&D lab developing hybrid microelectronics - which eventually became Boeing's production line for Hybrid Microelectronic circuits for many Boeing applications and outside contracts. Manford was instrumental in establishing the ISHM Northwest Chapter, and the Microelectronics Interconnect Conference (MIC). He served five years on the Executive Council, and two years as Technical Vice President, followed three years for his presidential commitment. In 1988, in concert with Ray Prichard of IPC, he launched the marketing segment of activities which is on-going as the Global Business Council (GBC).
Daniel C. Hughes, Jr. Award and
Fellow of the Society Award
Dr. Steve Bezuk worked in the electronics industry for over 37 years and has recently retired. Steve was most recently Senior Director of IC Package Engineering at Qualcomm. His team was responsible for Fan Out Wafer Level and High-Performance Computing packaging technologies at Qualcomm. Prior to joining Qualcomm Steve was with Kyocera, Unisys, Sperry-Univac and RCA‘s Sarnoff Research Center. Steve worked and managed groups in a variety of areas, including amorphous silicon research, CMOS, Bipolar and GaAs IC process development, Laser enhanced materials processing, Wire bond, TAB, Flip Chip, MEMS, and TSV packaging.
Steve has made sustained contributions in advancing mobile device packaging technology and the drive to ever thinner package profiles. He developed new paradigms in leading technology innovations from within a fabless company by creating deep partnerships in the supply chain to form a virtual IDM environment. Many of these advancements were adopted industry-wide.
- Developed industry-standard lead-free flip chip metallurgy and industry-leading conversion to lead-free flip chip
- Developed Thermo-compression flip chip on non-plated Cu traces
- Developed very fine pitch fan in PoP with industry best electrical (26Gbs memory bus), thermal and warpage performance.
- Developed large WLP packages and enhanced industry knowledge of various factors affecting WLP reliability and Electromigration
- Developed technology and industry supply-chain to support embedded capacitors in mobile device packages
- Drove investment in Deca Technologies for adaptive patterning and development of panel FOWLP
Steve has been very active in IMAPS giving Keynote and invited talks at both IMAPS International Symposium on Microelectronics and The Device Packaging Conference. He also arranged an IMAPS symposium on Thin Packaging.
Steve was also very active in the IEEE EPS and ECTC Conference for the society. He was the General Chair for the 2004 ECTC conference and was a member of the IEEE EPS Board of Governors and VP of Technology for the IEEE EPS. In 2015 he was awarded the societies‘ Electronics Manufacturing Technology Award.
Steve has a B.S. in Chemistry from the University of Pittsburgh and a Ph.D. in Chemistry from the University of Minnesota.
William D. Ashman - John A. Wagnon
Technical Achievement Award and
Fellow of the Society Award
Dr. Kuan-Neng Chen received his Ph.D. degree in Electrical Engineering and Computer Science, and his M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He is currently Vice President for International Affairs, Associate Dean of International College of Semiconductor Technology, and Chair Professor of Institute of Electronics in National Yang Ming Chiao Tung University. Prior to the faculty position, he was a Research Staff Member at the IBM Thomas J. Watson Research Center.
Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, MOST Outstanding Research Award (2 times), MOST Futuristic Breakthrough Technology Award, NCTU Distinguished Faculty Awards, NCTU Outstanding Industry-Academia Cooperation Achievement Awards (6 times), CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored more than 300 publications, including 3 books and 6 book chapters, and holds 83 patents. He was Guest Editor of IEEE Transactions on Components, Packaging, and Manufacturing Technology, and MRS Bulletin. He served as General Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a Fellow of IMAPS, National Academy of Inventors (NAI), IEEE, and IET, and a member of Phi Tau Phi Scholastic Honor Society.
In addition to his faculty position, Dr. Chen is currently Program Director of Micro-Electronics Program in Ministry of Science and Technology in Taiwan, Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen‘s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.
Fellow of the Society Award
Susan Trulli is a Principal Engineering Fellow in the Advanced Microelectronics Solutions department of Raytheon Missiles and Defense Systems. She is a recognized leader in microelectronics in high reliability microwave packaging, with over 40 years of experience in communication and radar products for defense, space and commercial applications. Susan is very active in the International Microelectronics Assembly and Packaging Society (IMAPS) serving seventeen years on the Executive Council in multiple positions including the presidency and chairing numerous IMAPS advanced technology workshops in RF and Microwave Packaging. Susan is the recipient of multiple awards including Raytheon‘s highest technical achievement award, the Thomas K. Phillips Award for Excellence in Technology, the IMAPS Sidney J. Stein International Award and the Society for Women Engineers Patent Recognition Award. Susan is focused on gallium nitride (GaN) packaging solutions for high reliability, high power microwave systems and is currently principal investigator for Embedded Die for High Power Microwave Applications through NextFlex. Susan holds patents in the area of microwave module design and materials as well as in the area of printed electronics, thermal design and plasma applicator materials and construction.
Sidney J. Stein International Award
Tanja Braun studied mechanical engineering at Technical University of Berlin with a focus on polymers and micro systems and joined Fraunhofer IZM in 1999. In 2013 she received her Dr. degree from the Technical University of Berlin for the work focusing on humidity diffusion through particle-filled epoxy resins. Tanja Braun is head of the group Assembly & Encapsulation Technologies. Recent research is focused on fan-out wafer and panel level packaging technologies and Tanja Braun is leading the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin.
Results of her research concerning packaging for advanced packages have been presented at multiple international conferences. Tanja Braun holds also several patents in the field of advanced packaging. In 2014 she received the Fraunhofer IZM research award.
Tanja Braun is an active member of IEEE. She is member of the IEEE EPS Board of Governor (BOG) and EPS Region 8 Program Director.
Outstanding Educator Award
Subramanian S. Iyer (Subu) is Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering Department at the University of California at Los Angeles. He is Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS). Prior to that he was an IBM Fellow. His key technical contributions have been the development of the world‘s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable devices as well as the first commercial interposer and 3D integrated products. He also was among the first to commercialize bonded SOI for CMOS applications through a start-up called SiBond LLC. More recently, he has been exploring new packaging paradigms and device innovations that they may enable wafer-scale architectures, in-memory analog compute and medical engineering applications. He has published over 300 papers and holds over 75 patents. He has received several outstanding technical achievements and corporate awards at IBM. He is an IEEE Life Fellow, an APS Fellow, an iMAPS Fellow and a Distinguished Lecturer of the IEEE EDS and EPS and a member of the Board of Governors of IEEE EPS. He is also a Fellow of the National Academy of Inventors. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012 and the 2020 iMAPS Daniel C. Hughes Jr Memorial award.
IMAPS Leadership Award
Amy Lujan is currently Vice President of Business Development at SavanSys, where she does cost modeling and analysis for companies in the electronics packaging and aerospace industries. Prior to joining SavanSys, Amy held positions in business development at TOK America and in engineering at Nokia Japan. In 2006, she received a Fulbright grant to study the cost impact of shifting to lead-free manufacturing, and her degree is in Chemistry. She has published numerous technical papers and has been an invited speaker at multiple conferences and seminars.
IMAPS Foundation‘s Steve Adamson
Student Recognition Award
Suraj Ravimanalan is currently pursuing a Master of Science degree in mechanical engineering at the University of Maryland, College Park. In the late fall of 2021, he will defend his thesis on the topic of long-term storage of electronic components. He served as the President of iMAPS student chapter of the University of Maryland from Fall 2019 till Summer 2021. He played a leadership role in planning, guiding, and hosting the iMAPS sponsored event named Elevator Pitch Contest in Fall 2020. Suraj joined Tesla Motors recently as a reliability engineer and is looking forward to improving his skills and contributing to the greater good of the community.
IMAPS 2021 Corporate Recognition Award