GBC Live Webinar May 20 2020



IMAPS Global Business Council (GBC) Live Webinar on

Wednesday, May 20, 2020 | 12:00pm – 1:15pm EASTERN | Webex

Thank You to our Webinar Sponsor

This webinar was recorded and IMAPS Members can replay the archived MP4 recording here. Member login credentials are required to view these archived resources.

Click here to download Jan Vardaman's slides.

Click here to download Jeorge Hurtarte's slides.

Click here to replay the entire webinar (MP4 recording).


Join the IMAPS Global Business Council for a live webinar featuring a discussion from industry heavyweights Jan Vardaman, TechSearch International, and Jeorge Hurtarte, Teradyne, on recovery and growth areas after COVID-19. Attendees will have an opportunity to pose questions to the speakers during this live webinar.

Registration is FREE for IMAPS members and students. Non-member registration is $50.


Webinar Program 
Chairs: Rich Rice, ASE; Lee Smith, Consultant; Thomas Goodman, Izinus

 Opening Remarks 
Growth Areas Despite Covid-19
Despite the economic downturn caused by the fight against the Covid-19 virus, there are some potential growth areas this year. Growth in advanced packaging continues for datacenter servers, AI accelerators, and 5G infrastructure. The shelter-in-place requirements have driven out-of-season demand for game consoles, commercial and educational laptops and tablets, and monitors. The pandemic is driving increased production of ventilators and wider adoption of telemedicine. Trends in the adoption of industrial IoT continue. This presentation discusses these trends.

E. Jan Vardaman, President and Founder, TechSearch International, Inc.
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987.  She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design & Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly.  She served on the NSF-sponsored World Technology Evaluation Center (WTEC) study team involved in investigating electronics manufacturing in Asia and on the U.S. mission to study manufacturing in China.   She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer.  She is a member of SEMI, IMAPS, and SMTA.  She received the IMAPS GBC Partnership award in 2012, the Daniel C. Hughes, Jr. Memorial Award in 2018, and the Sidney J. Stein International Award in 2019.  She is an IMAPS Fellow.  Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium.    
5G mmWave Test Insertion Scenarios and Test Strategies
As 5G products being its initial production phase, several RF test strategies and test flows are being evaluated for the next phase of high volume production. For 5G millimeter wave products, over-the-air radiated test present a new set of test challenges as compared to sub-6 GHz products.  This presentation provides an overview of the possible test insertion scenarios for 5G RF devices, their intended fault coverage objectives and possible test strategies to address such.

Dr. Jeorge S. Hurtarte, Wireless Product Marketing Strategist, Teradyne
Dr. Jeorge S. Hurtarte is currently Wireless Product Marketing Strategist at Teradyne, Boston, USA.  Dr. Hurtarte has held various technical and management positions at Teradyne, LitePoint, TranSwitch, and Rockwell Semiconductors. He holds Ph.D. and B.S. degrees in electrical engineering, an M.S. in telecommunications, and an M.B.A. Dr. Hurtarte has served on the Advisory Board of Directors of the Global Semiconductor Alliance, TUV Rheinland of North America, and the NSF’s Wireless Internet Center for Advanced RF Technology.  He is the secretary of the IEEE 802.11ay task group. Dr  Hurtarte is also professor at the University of California, Santa Cruz and at the University of Phoenix, Bay Area, California.  He is also the lead co-author of the book Understanding Fabless IC Technology.
Closing remarks and questions via the webinar chat feature.