GBC Live Webinar 19Aug20



IMAPS Global Business Council (GBC) Live Webinar on
Advanced Packaging Landscape in Post-COVID Economy

Wednesday, August 19, 2020 | 12:00pm – 12:45pm EASTERN | MS Teams


As 2020 kicked off to a start, semiconductor industry continued strong momentum achieved in Q4’19 and top OSATs and IDMs reported unseasonably strong Q1 2020 until the coronavirus pandemic shifted the global balance.  In Q1 2020, advanced packaging especially system in package grew significantly as more heterogenous integration is required to meet 5G, and AI.  In 2019. Wafer level packaging (WLP) that includes fan-out packaging and WLCSP/Fan-In packaging revenue surpassed $3B threshold and is expected to approach close to $6B by 2025.  System in Package (SiP), Fan-out packages and upcoming chiplet packages are expected to dominate the market for next few years as thirst for scalability, high bandwidth, and functional integration continues in spite of slowing down of Moore’s law on the Si Front-end.  This presentation will provide overview and evolution of key advanced packaging technologies that remains critical for 5G deployment, and will provide insight into new emerging packaging form factors.  Will the strong growth experienced by top OSATs and IDMs in Q1 continue into 2H’2020?  How will global slow-down reshape the semiconductor industry?  If semiconductor market slows down in the 2H’2020, what will the recovery look like? 

About Vaibhav
Vaibhav Trivedi is a Senior Technology & Market analyst at Yole Développement (Yole) working with the Semiconductor & Software division. Based in the US, he is a member of Yole’s advanced packaging team and contributes to analysis of ever-changing advanced packaging technologies.  Vaibhav has 17+  years of field experience in semiconductor processing and semiconductor supply chain, specifically on memory and thermal component sourcing and advanced packaging such as SiP and WLP. 
Vaibhav has held multiple technical and commercial lead roles at various semiconductor corporations prior to joining Yole. 
Vaibhav holds a Bachelor of Science in Chemical Engineering, and Master of Science of Material Science from University of Florida in addition to an MBA from Arizona State

Registration Details

Members: FREE
Non-Members: $50
This webinar will be hosted via MS Teams. Registrants will receive an email on the webinar date prior to the start of the webinar with login instructions.
The presentation files will be provided to registrants upon the conclusion of the event. The event recording will be made available upon request.

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