The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding ~ February 3-4, 2025 in San Diego, California. The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and marketing people from around the world who have been working in the area of Wire Bonding.  This workshop has been specifically organized to allow for the presentation and debate of some of the latest technologies out there related to the use of Wire Bonding in battery pack, semiconductor and microelectronic packaging.