The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in Phoenix, Arizona on Advanced Packaging for Medical Microelectronics on March 6-7, 2025. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage discussions involving technologies, products, strategies, current and emerging markets, and collaborations. This two-day event will draw invited experts in the fields of medicine, medical devices, biomaterials, microelectronics, semiconductor packaging, and product assembly.