Device Packaging Highlights

16th International Conference and Exhibition on Device Packaging

Conference Highlights



Click the cover to download the conference program PDF.

The 2020 International Conference and Exhibition on Device Packaging was held in Fountain Hills, AZ from March 2-5, 2020.

DPC 2020 was where the latest in microelectronics system integration and packaging technology was unveiled. This conference showcased the best in packaging technology available today, as well as those technologies soon to be released to the market. It offered the benefit of technical exchange among key international players and the opportunity to discover emerging business trends from top marketing analysts. 

DPC 2020 provided a focused forum on the latest technological developments in three topical workshop tracks related to microelectronic packaging: 3D Integration; Fan-Out, Wafer Level Packaging and Flip Chip; and Advanced & Emerging Materials for Automotive, 5G & Next Generation Applications. 


The 2020 Conference featured 60 speakers
 and 24 breakout, interactive, and semi-plenary sessions.


TECHNOLOGY SHOWCASE

66 Exhibitors
(another sell-out show floor!)

Exhibit Hall Happy Hour

NETWORKING AND SPECIAL EVENTS

Welcome Reception

Outdoor Interactive Poster Session

Charity Golf Outing

TECHNICAL PROGRAM

4 Keynotes

60+ Speakers

3 Tracks | # Sessions

9 Professional Development Courses

The 2020 conference featured four premier technical keynote speakers, a Global Business Council (GBC) plenary session on the Electronics Industry Transition, and twelve technical sessions featuring more than 60 technical presentations all covering the latest in packaging technology innovation. Attendees also enjoyed a poster session and happy hour, a selection of nine professional development courses, plus a sold-out vendor exhibition and technology showcase. Industry colleagues gathered for networking receptions and gatherings throughout the week, including the welcome reception, the exhibit hall reception, the poster session and happy hour, and a charity golf outing. 

 Several key topics in our industry are being addressed with our keynotes:

  • HETEROGENEOUS INTEGRATION TECHNOLOGIES FOR MOORE'S LAW 2.0 AND BEYOND
  • RF FRONT END PACKAGING CHALLENGES IN 5G 
  • INTEGRATED WAFER LEVEL PACKAGING TECHNOLOGIES FOR HIGH-PERFORMANCE COMPUTING SYSTEMS: CHALLENGES AND OPPORTUNITIES
  • GET MOoRE OUT OF THE PACKAGE

Jan Vardaman from TechSearch and Beth Keser from Intel led a panel discussion on High Performance Computing:  Are Chiplets the Answer?. 

 


DPC 2020 welcomed nearly 500 attendees


Attendees by Role

The Device Packaging 2020 conference attracted attendees with a wide range of industry experience, from process engineers to chief executive officers.

Industry Organizations Represented

3D Glass Solutions
3D Incites
3D Plus
A.L.M.T. Corp.
Abbott
Accretech America Inc
ACM Research Inc
AdTech Ceramics
AGC Business Development Americas
AGC Electronics America
AI Technology, Inc.
Air Products and Chemicals, Inc.
Ajinomoto Fine-Techno
AkroMetrix, LLC
AMD
American Furukawa, Inc.
American Semiconductor, Inc.
Amkor Technology
ancosys Inc.
ANSYS, Inc.
Anzu Partners
Apex Microtechnology
Apple
Applied Materials
Arieca Inc.
Arizona State University
ASE Group
ASM Pacific Technology, Ltd.
AT&S
Atotech 
ATREG INC
Auburn University
Axus Technology
AZ Supply Chain Solutions
BaiTECH Solutions LLC
Ball Aerospace & Technologies Corp.
BESI AT GmbH
Besi North America, Inc.
Bestronics
BMW AG
Boeing
Brewer Science, Inc.
Broadcom
Bruker Nano Surfaces
BSET EQ
Cactus Materials, Inc.
Cadence Design Systems, Inc.
Camera Hardware
Canon USA
Carsem MEMS & Sensors
CEA LETI
Chalman Technologies
Cobham
Coherent Inc.
Collabratech
Collins Aerospace
COMET Technologies USA Inc.
Compound Photonics
CONNECTEC JAPAN Corporation
Conquest Recruiting
Corning Incorporated
CPS Technologies
Crane Aerospace & Electronics
DAETEC
Dai Nippon Printing
Deca Technologies
Department of Defense
Deweyl Tool Company, Inc.
Digidat
DNP Corporation USA
DuPont
EBD Experts / AZ Tech Direct
ECI Technology
Electronic Business Development Experts
EMD Performance Materials
ERS Electronic GmbH
ESPAT-Consulting
Estatec
ESWIN
EV Group, Inc.

Evatec
F & K Delvotec, Inc.
Ferrian Sales & Associates
Finetech, Inc.
FlipChip International - Hua Tian
Fraunhofer 
FUJIFILM Electronics Materials USA
Gannon & Scott
Geib Refining
General Dynamics Corp.
Georia Tech
Giorgio Technology Sales/Service
Global Cooling Technology Group
GLOBALFOUNDRIES
Golden Altos Corporation
Gordian International
Harvard Group International
HD Microsystems
Heidelberg Instruments
Heller Industries
Henkel
i3 Microsystems, Inc.
IBM Canada Ltd.
IDA
Illumina Inc.
IMAT, Inc.
IMEC
Indium Corporation
Infineon Technologies Americas Corp.
InnoCentrix, LLC
Integra Technologies, Inc.
INTEKPLUS
Intel Corporation
International Test Solutions
Intevac
Izinus
JCET Group
Jet Propulsion Laboratory
JIACO INSTRUMENTS
Kayaku Advanced Materials
Knowles Corp
Kulicke & Soffa Industries, Inc.
Kyocera International, Inc.
Linear Asics
Lintec of America
LPKF Laser & Electronics AG
MacDermid Alpha Electronics Solutions
Marvell Semiconductor
MASIP LLC
Materion Corporation
MEC Company Ltd.
Medtronic
Mentor Graphics Corporation
Mercury Systems
Metallix Refining, Inc.
Metalor Technologies USA
Micro Systems Technologies, Inc.
MicroChem Corp.
Microchip Technology, Inc.
MICRONSULT
MicroScreen LLC
Microsoft
Micross Components
Mini-Systems, Inc.
Mitsui Kinzoku USA Inc.
MKS Instruments
Mosaic Microsystems
Muhlbauer, Inc.
Nagase America LLC
NAMICS Corporation
Nano OPS, Inc
nanoGriptech, Inc.
NCSU Packaging Research in Electronic Energy Systems (PREES)
nepes Corporation
Neutronix Quintel
NGK Spark Plugs
Nhanced Semiconductors
Nissan Chemical America
Nordson 
Northeastern University

Northrop Grumman Mission Systems
NTK Technologies, Inc.
NXP Semiconductors
Oak-Mitsiu Technologies
ON Semiconductor Corporation
Oneida Research Services, Inc.
Onto Innovation
Optomec
PacTech
Palomar Technologies, Inc.
Panasonic Industrial Device Sales Company
Photofabrication Engineering Inc
Photronics, Inc
Plasma-Therm, LLC
Platronics Seals
Practical Components
Prince & Izant
Promex Industries, Inc.
Qorvo
Qualcomm, Inc.
Quik-Pak, a division of Promex Industries
Raytheon
Red Wave Energy, Inc.
Rigaku Semiconductor Metrology
RJ Stierman Consultant LLC
Rochester Electronicse
ROLLON Corp
SABIC
Samtec
Sandia National Labs
Scientific Alloys Corporation
SCREEN Semiconductor Solutions
Sekisui Products
Semiconductor Smart Solutions
SemiDice, Inc.
SETNA Corporation
Sikama International, Inc.
Silicon Light Machines
Siliconware Precision Industries Co. Ltd
Skywater Technology
SML Concepts, LLC
Smoltek
Spectrum Semiconductor Materials, Inc.
SPIL
SPTS Technologies, an Orbotech company
Sputtering Components Inc.
StratEdge Corporation
SurplusGLOBAL
SUSS MicroTec Inc.
SVXR
Synaptics
Tanaka Precious Metals
Tech Insights
Technic, Inc.
TechSearch International, Inc.
Teikoku Taping System Inc.
Teradyne
The Talus Group
Toppan Photomasks, Inc
Toray Industries Inc
Towa USA Corporation
Toyota Tsusho America, Inc.
ULVAC Technologies, Inc.
Unisem Group
United Silicon Carbide Inc.
University of California, Los Angeles
UTAC
Veeco
VentureAide
Versum Materials
Viasat
VLSI Research
Von Ardenne North America, Inc.
Waymo
Xperi
XYZTEC
Yaiyo Ink Mfg. Co., Ltd.
Yole Developpement
YXLON
zGlue Inc.
Zuken, Inc.
Zymet, Inc.

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