Device Packaging Conference

Conference Chairs


General Chair:
Prasad Dhond, Amkor Technology

General Chair-Elect:
Nokibul Islam, JCET Group

Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science

The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.




Featuring 3 Technical Tracks and an Interactive Poster Session


Click Here to Submit an Abstract or PDC | Deadline Extended: September 20, 2021

Interactive
Poster Session

Organizations presenting as of September 1:

3MDeca TechnologiesOptomec
ASE GroupElectroninks inc.Salmon Engineering
Atotech Deutchland GmbHERS Electronic GmbHSavanSys Solutions LLC
Auburn Univ.Fraunhofer AZM-ASSIDSiemens DISW
Cadence Design SystemsIndium CorporationSiemens EDA
Dai Nippon PrintingInternational Test Solutions,
a CMC Materials Company
 Siliconware Precision Industries Co., Ltd.
STMicroelectronics

      

Professional Development Courses (PDCs)


DPC 2022 will offer supplementary classroom style education in the form of two-hour short courses taught by industry leaders. 

Submit your PDC Proposal here!


Sponsors & Exhibitors 


DPC 2022 Exhibitor Prospectus Available Now!

Phase 1: Major Sponsors - sill available

Phase 2: Returning Exhibitors DPC 2020-2021 - Sept. 1 thru Oct. 15

Phase 3: Open Application Period - Oct. 16 thru Show Date


Organizations presenting as of September 1:

60% of the Exhibit Hall sold out in Day 1!

AI Technology, Inc.EvatecLintec of America, Inc.
QP Technologies
Amkor Technology, Inc. F&K Delvotec, Inc.Macdermid Alpha Electronics Solutions
Siemens
ASE GroupGolden Altos Corp.Metalor
SPTS Technologies Ltd, A KLA Company
ASM Pacific TechnologyHeidelberg Instruments Co.
MRSI Systems, Mycronic Group
StratEdge Corp.
Axus TechnologiesIntegra Technologies
NAMICS Technologies, Inc.Technic
Besi North America, Inc.JCET Group
Oneida Research Services, Inc.TechSearch International
Cadence Design SystemsJIACO Instruments
PacTech USA Packaging Technologies, Inc.Teikoku Taping System, Inc.
DeWeyl Tool CompanyJSR Micro
Palomar TechnologiesXperi

Practical ComponentsXYZTEC, Inc.



Hotel & Booking Information 


We-Ko-Pa Resort & Conference Center
Fountain Hills, Arizona

Single/Double is $179 per night + taxes/fees

Hotel deadline: January 26, 2022

Click here for hotel reservations at the discounted rate.


Click here to take a Virtual Tour of the newly renovated resort! 

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