Device Packaging Conference
Prasad Dhond, Amkor Technology
Nokibul Islam, JCET Group
Past General Chairs:
Eric Huenger, DuPont Electronic & Imaging
Rama Puligadda, Brewer Science
The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Click Here to Submit an Abstract or PDC | Deadline Extended: September 20, 2021
Organizations presenting as of September 1:
|ASE Group||Electroninks inc.||Salmon Engineering|
|Atotech Deutchland GmbH||ERS Electronic GmbH||SavanSys Solutions LLC|
|Auburn Univ.||Fraunhofer AZM-ASSID||Siemens DISW|
|Cadence Design Systems||Indium Corporation||Siemens EDA|
|Dai Nippon Printing||International Test Solutions,|
a CMC Materials Company
|Siliconware Precision Industries Co., Ltd.|
DPC 2022 will offer supplementary classroom style education in the form of two-hour short courses taught by industry leaders.
Phase 1: Major Sponsors - sill available
Phase 2: Returning Exhibitors DPC 2020-2021 - Sept. 1 thru Oct. 15
Phase 3: Open Application Period - Oct. 16 thru Show Date
60% of the Exhibit Hall sold out in Day 1!
|AI Technology, Inc.||Evatec||Lintec of America, Inc.||QP Technologies|
|Amkor Technology, Inc.||F&K Delvotec, Inc.||Macdermid Alpha Electronics Solutions||Siemens|
|ASE Group||Golden Altos Corp.||Metalor||SPTS Technologies Ltd, A KLA Company|
|ASM Pacific Technology||Heidelberg Instruments Co.||MRSI Systems, Mycronic Group||StratEdge Corp.|
|Axus Technologies||Integra Technologies||NAMICS Technologies, Inc.||Technic|
|Besi North America, Inc.||JCET Group||Oneida Research Services, Inc.||TechSearch International|
|Cadence Design Systems||JIACO Instruments||PacTech USA Packaging Technologies, Inc.||Teikoku Taping System, Inc.|
|DeWeyl Tool Company||JSR Micro||Palomar Technologies||Xperi|
|Practical Components||XYZTEC, Inc.|
We-Ko-Pa Resort & Conference Center
Fountain Hills, Arizona
Single/Double is $179 per night + taxes/fees
Hotel deadline: January 26, 2022
Click here to take a Virtual Tour of the newly renovated resort!