Full conference registration After April 15 will give the attendee access to: 

• ALL LIVE CONTENT including Keynote presentations, panels, sessions, etc. are already recorded and available for viewing 
  through the Virtual Conference Portal until May 14, 2021. 
  • (with the exception of PDCs)
• Extended Abstracts one download sent to the registrant by email.  Provided by April 21. 
  • (Presentations pending presenter submission and authorization) 
• Corporate Partner profile pages can still be viewed but will not be actively monitored/ live chat disabled.
  • You can still reach out to the company using the Contact Us form. 
• IMAPS individual membership extension or membership renewal.
  • Does not apply to Corporate Level or Affiliates. 

Click HERE for Post-Live Conference Registration

1. Select your registration type from the available options.  (Member, Non-Member, Student, etc.) 
2. Make payment online with a credit card. 
3. Receive a confirmation via email. This will NOT include your login details for the conference. 
   1. You will receive this from noreply@dpcvirtual.org and there will be a slight delay between your registration and receiving your login credentials.
   2. Please email Shelby Moirano Gonzalez with any questions.

10:00am-5:00pm Eastern

Pre-Show Corporate Partner SWAG Downloads

Log-in ahead of the live programming for the opportunity to download swag from our corporate partners. 

Professional Development Courses

Only one course can be taken per time slot | Separate registration required | Available for $250 per course

10:00am-12:00pm Eastern

Course A1:
Polymers For Wafer Level Packaging
Jeffrey Gotro, InnoCentrix, LLC

CANCELLED

Course B1:
Sensor Packaging
Robert Dean, Auburn University
CANCELLED

12:00pm-2:00pm Eastern

Course A2:
Fan Out Variations - Structures and Processes for Low and High Density 
John Hunt, ASE Group

Course B2:
Flexible Hybrid Electronics 2.0 
Subramanian Iyer, UCLA

CANCELLED

2:00pm-4:00pm Eastern

Course A3:
The Evolution of Flip Chip Package Technology
Mark Gerber, ASE Group

CANCELLED

Course B3:
3D Package Assembly and Technology for Mobile Devices 
Tom Dory, Fujifilm Electronic Materials USA

4:00pm-6:00pm Eastern

Course A4:
5G mmWave Package Development Requirements and Solutions 
Urmi Ray

Course B4:
Chip Packaging Processes and Materials 
Syed Ahmad

    24hrs

Technical Presentations On-Demand

Click here to view the technical presentations, speakers, and session categories.

3D Integration 
Fan-Out, Wafer Level Packaging & Flip Chip
Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Applications

11:00am-11:15am Eastern

Opening Ceremonies 

11:15am-12:00pm Eastern

 Keynote Presentation  

Heterogeneous Integration: Developing a New Generation of 3D Chiplet Packaging Technology for Next Generation Devices

Seung Wook Yoon, Samsung Electronics - Corporate VP / Package Technology Planning, Test & System Package

Currently, the best solution for optimizing silicon systems for any given new workload is to create a system on chip (SoC), monolithic chip. But this gets more expensive with demand for high-performance AI, HPC applications and advanced Si node technology. One way of reducing the cost of Silicon systems for emerging workloads would be to use chiplet technology. From a commercial standpoint, this approach makes a lot of sense. The cost of a highly integrated SoC can be very high- so high it‘s prohibitive for many. Furthermore, the complexity of such highly integrated semiconductor systems makes manufacturing more challenging: there is a direct correlation between higher complexity and yield loss. The package technology now sits in the center of the universe for the next generation of devices.

In this presentation, various chiplet packaging technologies including MCM, SiP, integrated wafer level packaging solutions such as 2.5D, 3D and FOWLP will be introduced. These solutions have demonstrated their unique advantages in many applications that require high-end chips (such as CPU, GPU, AI, FPGA, network) or low-end chips (for IoT and wearable devices) in combination with high bandwidth SRAM/DRAM memory.

Additionally, the challenges and opportunities of a new generation of chiplet packaging and decoupling capacitor solutions will be discussed from a system/package co-design, performance and supply chain point of view.   

Sponsored by:

12:00pm-12:45pm Eastern

 Keynote Presentation 

Emerging Opportunities in Heterogeneous design of XPU

Ram Viswanath, Intel Corporation - Vice President and Director of Architecture and Pathfinding

We are entering an era of designing products based on heterogeneous integration on the package, where disaggregated chiplets are  stitched together seamlessly through packaging to derive a quasi-monolithic operation. The talk will focus on product drivers and architectural complexity and the need for execution focus on product cost and TTM.  The need for a disciplined approach to efficiently develop validated IP at the die-package interfaces  will be highlighted. This calls for tight collaboration between physical design, electrical modelling, tools and flows in the design cycle.

Sponsored by:

1:00pm-3:00pm Eastern

Professional Development Courses
Separate registration fees required

Course A5:
System-in-Package (SiP) - System Solutions Through Miniaturization
Mark Gerber, ASE Group

3:00pm-4:30pm Eastern

Live Technical Panel Session:
ELECTRONICS INDUSTRY SUPPLY CHAIN:  IS IT BROKEN?

Chair and Moderator:
E. Jan Vardaman, President, TechSearch International, Inc.

Panelists:

Ivor Barber, AMD - Corporate VP Packaging

Veer Dhandapani, NXP Semiconductors - Sr. Director Automotive Package Innovation

Devan Iyer, Technology Management - Educator and Executive Advisor

Rebeca Jimenez, Amkor Technology -Corporate Vice President, Advanced SiP Business Unit

Paul Mescher, Microsoft - Senior Director IC Packaging Technology

Sponsored by:

5:00pm-6:00pm Eastern

"Meet the Experts – Virtual Happy Hour  - A MacDermid Alpha hosted event

Grab your favorite beverage and virtually meet our industry experts and discuss any questions you may have regarding your semiconductor processes. A brief presentation highlighting our latest offerings from our Alpha, Kester, Compugraphics and MacDermid Enthone brand, will be presented, followed by a Q&A session. Click here for complete information.

Interested parties please contact Deanna Cullen – Deanna.Cullen@MacDermidAlpha.com.

24hrs

Technical Presentations On-Demand

Click here to view the technical presentations, speakers, and session categories.

3D Integration 
Fan-Out, Wafer Level Packaging & Flip Chip
Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Applications

11:00am-2:00pm Eastern

Virtual GBC Live Plenary Session

Friends in HI Places...
Enabling the Transition to Heterogeneous Integration

GBC Chairs:
Rich Rice, ASE Group; Lee Smith, Consultant; Thomas Goodman, Izinus

Advancements in substrates and interconnection will be a key requirement in enabling heterogeneous integration (HI) and the gap between device IO or pad densities and substrate interconnect capabilities is expanding.  Substrate technology must transition towards the levels of scaling that the semiconductor industry continues to demonstrate which will require both high levels of innovation and investment.

The industry has been addressing these issues and the urgency for new technologies, solutions and supply chains.  These have been highlighted due to ABF and advanced substrate supply shortages.  This has created major issues for the industry and the cost / availability and yields for the most advanced fcBGA substrates has become a critical issue.  As these applications transition to HI, the substrate size and density requirements can pose major obstacles.

This LIVE Virtual Session will feature 5 expert GBC speakers:

Sponsored by:

1:00pm-3:00pm Eastern

Professional Development Courses
Separate registration fees required

Course A6:
Introduction to Failure Analysis in Semiconductor Package Assembly
Tom Dory, Fujifilm Electronic Materials USA

3:00pm-5:45pm Eastern

iNEMI Invited Session on:
5G Electronics Challenges: High Frequency Materials Characterization  

Session Chair: Urmi Ray, iNEMI

Next-generation 5G communications solutions require ultra-low loss laminate materials and PCBs/substrates for efficient design and manufacturing. However, these materials pose challenges. For example, there is no consistent methodology for measuring transmission loss or Df/Dk, especially for higher frequencies (e.g., >30 GHz). Many different approaches are currently used, requiring different fixtures and test methods, sample preparation, and/or data analysis/extraction. In response, iNEMI members organized the 5G/mmWave Materials Assessment and Characterization project to develop guidelines and best practices for a standardized measurement and test methodology that can be shared with industry and relevant standards organizations.

This session will provide 5 presentations (25 minute presentations + 5 minutes of live Q&A) outlining the status of the benchmarking phase as shown in the paper titles below:

Sponsored by:

   24hrs

Technical Presentations On-Demand

Click here to view the technical presentations, speakers, and session categories.

3D Integration 
Fan-Out, Wafer Level Packaging & Flip Chip
Advanced Packaging & Emerging Materials for Automotive, 5G & Next Gen Applications

11:00am-11:15am Eastern

Opening Ceremonies 

11:15am-12:00pm Eastern

 Keynote Presentation 

Sponsored by:

12:00pm-12:45pm Eastern

 Keynote Presentation 

System Design of Advanced Power Electronics and Sensing Technologies for Off-Road Vehicle Applications

Brij Singh, John Deere - Region 4 Manager External Relationships and John Deere Fellow in Power Electronics Engineering

Mark Chaney, John Deere - Automation Delivery teams at the Intelligent Solutions Group (ISG)

Scott Johnson, John Deere - Senior Control Systems Engineer for Power Electronics

This presentation is divided into three segments; (a) Automation & Autonomy for John Deere Vehicles, (b) Silicon Carbide (SiC) Power Electronics for Heavy-Duty Vehicles, and (C) Electrification and Controls.

In autonomy section, enabling technologies including sensors will be covered for John Deere agriculture vehicles for crop management, right from farm preparation to the crop harvesting. It would be clearly outlined that how automation is supporting John Deere objectives for significantly increased performance and productivity of the farming vehicles by job automation, resulting in doing more in the less time with optimally minimized input costs incurred by growers. Automation supports John Deere aspirations to unlock customer value that were not possible without advanced sensors and on-board and in-cloud computation, including data management necessary for the next growing season of crops.

In SiC power electronics section, John Deere project co-funded by DOE-PowerAmerica will be discussed including packaging and thermal management of the SiC inverter. Vehicle electrification has enabled John Deere‘s construction and mining customers to enjoy benefits of the increased performance, productivity, up-time, and fuel economy gains. JD 644K and 944K Loaders have established and met industry leading reliability goals and expectations, these aspects will be briefly explained in the presentation.

In electrification and control section, enabling aspects of the electrified plater will be discussed as the ExactEmergeTM Planter has uncovered customer values beyond anyone imagination. The ExactEmergeTM has allowed John Deere customers to exactly place seeds on the ground at proper depth with precise spacing while maintaining appropriate gap for row crops. Industry leading high speed precision planting enabled by electrification has unlocked significant customer values for crop growers, this aspect will be explained in the presentation.

Attendees of this presentation will get impression that with vehicle electrification coupled with job automation, John Deere has established industry leading position in the precision farming and agriculture. John Deere‘s Emerging Technologies will ensure that the vast population of the world is fed, sheltered, and clothed in the ecofriendly and sustained manner. 

Sponsored by:

         1:00pm-2:00pm Eastern

Live Industry-Sponsored Panel

5G MATERIALS Roadmap : Industry Voices

Moderator: Urmi Ray, iNEMI, Experienced Semiconductor Consultant

A partner representative will participate in a moderated interactive panel connecting attendees with supply chain solutions and highlights of key technologies their organization can solve. This is a live programming event that will last up to one hour.

Industry Sponsors & Panelists: 

Brewer Science | Dongshun Bai
"Innovation in materials for overcoming technology challenges for heterogenous integration of 5G devices"

MacDermid Alpha | Jim Watkowski
"Copper Adhesion Promotion for 5G" 

EMD Electronics | Richard Stephenson
"Connection Digital Living" 

1:00pm-3:00pm Eastern

Professional Development Courses
Separate registration fees required

Course A7:
Flip Chip Package Technology and Assembly Processes
Tom Dory, Fujifilm Electronic Materials USA

Professional Development Courses
Separate registration fees required

Course B5:
High-Speed LPDDR4X/5 Signal and Power Integrity Advances in Mobile and Automotive Memory Systems
Sunil Gupta, Qualcomm Technologies, Inc.

CANCELLED

On-Demand

All Conference Presentations

All content presented during the live show dates will be available on-demand in the content library during the archived period through May 14. Catch up on or re-watch your favorite keynote addresses, the panel session, and featured live content. 

Technical presentations will also remain available for on-demand viewing.

Professional development courses are live only and not available for replay after the course concludes.